CN100379324C - Wet filming method of flexible printed circuit - Google Patents
Wet filming method of flexible printed circuit Download PDFInfo
- Publication number
- CN100379324C CN100379324C CNB2005100327870A CN200510032787A CN100379324C CN 100379324 C CN100379324 C CN 100379324C CN B2005100327870 A CNB2005100327870 A CN B2005100327870A CN 200510032787 A CN200510032787 A CN 200510032787A CN 100379324 C CN100379324 C CN 100379324C
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- China
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- printed circuit
- film
- flexible printed
- pad pasting
- wet
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Abstract
The present invention relates to a wet film sticking method for a flexible printed circuit, which belongs to the field of a printed circuit. The flexible printed circuit of the present invention adopts the following technological processes that a circulating base plate (1), chemical cleaning (2), a mechanical brushing plate (3) and a wet sticking film (4) in a previous procedure is converted into a next procedure (5). One layer of water film is coated on a plate surface before sticking a film, which increases fluidity during compression. Fatty alcohol-polyoxyethylene ether with the content from 0.01 to 1.0% (weight composition) is added into water, and a wet mode is used for sticking the film. Consequently, the plate surface is effectively cleaned, and nondefective rate in image transfer is improved. Because the problems of dry film binding force / fluidity are not needed to be worried, the film sticking production efficiency can be greatly improved.
Description
Technical field
The wet filming method of flexible printed circuit of the present invention belongs to printed circuit field, relate to a kind of method for adhering film of photosensitive resist film when being used for the flexible printed circuit figure transfer, be applicable to the pad pasting of photosensitive resist film when the later circuitous pattern of flexible printed circuit graphic plating shifts, be particularly useful for the making of high-precision fine line flexible printed circuit.
Background technology
The wet film coating process flow process of flexible printed circuit is, last process circulation substrate (1), chemical cleaning (2), mechanical brush board (3), pad pasting (4), change next procedure (5) over to, film coating process is the one procedure during flexible printed circuit is made, the quality that film process is handled can directly have influence on the quality of pad pasting effect, also can produce very big influence to the back operation.Flexible printed circuit is at the copper foil surface pad pasting, because defectives such as uneven, the pin hole of copper foil surface, depression, scuffing, can cause anastomose property not good, between Copper Foil and dry film, will form interfacial voids, during etching, soup is invaded from the bottom, promptly may cause open circuit, the depression on breach or the circuit etc.Be to adapt to the requirement of high density fine-line, solve between Copper Foil and the dry film owing to the not good problem that forms interfacial voids of anastomose property, develop new film coating process with regard to needs.
The content of invention
The purpose of this invention is to provide a kind of Filming Technology of photosensitive resist film when being used for the flexible printed circuit figure transfer, be used for improving the pad pasting effect of photosensitive resist film, promote the yields in pad pasting production efficiency and the product figure transfer, solve between Copper Foil and the dry film because of the not good problem that forms interfacial voids of anastomose property.
The purpose of this utility model reaches by following measure, flexible printed circuit of the present invention adopts following technological process, last process circulation substrate (1), chemical cleaning (2), mechanical brush board (3), wet film coating (4), change next procedure (5) over to, chemical cleaning (2) is to utilize aqueous slkali or acid solution to remove the oxide layer on copper surface, finger-marks and other organic pollution, improve the cleannes on copper surface, to guarantee the adhesion of copper face and dry film against corrosion.Machinery brush board (3) is the pretreatment procedure of pad pasting, adopts abrasive brush roll-type brush plate machine, special-purpose ground pumice brush plate machine or manual ground pumice to scrub usually, and through behind the brush board, the roughened copper surface degree should be between 0.5-2.5 μ m.Wet film coating (4) is to be coated with water membrane at the plate face earlier before pad pasting, the flowability during with the increase pressurized, and make dry film on copper face, have goodish closely connected property.Pressure is 20-80PSI during pad pasting, and temperature is 90-120 ℃, and transfer rate is 0.5-4m/min.
Wet film coating is artificially to make even, the continuous moisture film of a layer thickness before pad pasting on copper face, carries out press mold then, and it has improved the flowability of dry film effectively, closely connected property, thereby press mold generation of defects such as minimizing bubble.The effect of this moisture film is the flowability that improves dry film, replaces the bubble that is detained on the positions such as cut, sand holes, pit, and in heating and pressurizing pad pasting process, water plays viscosifying action to photoresist.In order to improve the even distribution of water on copper face, improve the adhesion of dry film and copper face, Xiang Shuizhong adds the AEO of 0.01-1.0% (weight composition), improve the even distribution of water effectively at copper face, improve the adhesion of dry film and copper face, thereby improved the qualification rate of making fine wire, the molecular structure of AEO is RO (CH
2CH
2O)
2H, wherein R=C
12H
25-C
16H
37
Plate face coating water membrane, used water is deionized water.
The present invention is a kind of method for adhering film of photosensitive resist film when being used for the flexible printed circuit figure transfer, is specially adapted to the making of high-precision fine line flexible printed circuit.Use wet film coating, thus effective cleaning the plate face, promoted the yields in the image transfer owing to need not worry the problem of dry film adhesion/flowability, can greatly promote pad pasting production efficiency.
Description of drawings
Accompanying drawing 1 be flexible printed circuit of the present invention process frame chart.
Accompanying drawing 2 is schematic diagrames of the present invention.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
As shown in Figure 1, the last process circulation substrate (1) of flexible printed circuit, chemical cleaning (2), machinery brush board (3), wet film coating (4), change next procedure (5) over to, chemical cleaning (2) is the oxide layer of removing the copper surface with aqueous slkali or acid solution, finger-marks and other organic pollution, machinery brush board (3) is the pretreatment procedure of pad pasting, adopt abrasive brush roll-type brush plate machine to scrub, through behind the brush board, the roughened copper surface degree is between 0.5-2.5 μ m, wet film coating (4) is that artificially manufacturing one layer thickness is even on copper face before pad pasting, continuous moisture film, earlier in plate face coating water membrane, carry out press mold then, pressure is 20-80PSI during pad pasting, and temperature is 90-120 ℃, and transfer rate is 0.5-4m/min.
As shown in Figure 2, wet film coating of the present invention is to be coated with the continuous uniform moisture film of one deck before pad pasting on copper face 11, then dry film 12 is attached on the copper face, carry out press mold, pressure is 20-80PSI during pad pasting, and temperature is 90-120 ℃, and transfer rate is 0.5-4m/min.
Embodiment
Remove oxide layer, finger-marks and other organic pollution on copper surface by chemical cleaning acid solution (sulfuric acid, hydrochloric acid etc.), improve the cleannes on copper surface, adopt abrasive brush roll-type brush plate machine to carry out brush board, it is even to be coated with a layer thickness at the plate face earlier before the pad pasting, continuous moisture film, Xiang Shuizhong adds the cetyl alcohol APEO of 0.05% (weight composition), improves the even distribution of water at copper face effectively, improves the adhesion of dry film and copper face.The pad pasting temperature is 105 ℃, and pressure is 50PSI, and transfer rate is 1.5m/min.
Claims (2)
1. the wet filming method of a flexible printed circuit, flexible printed circuit adopts following technological process, last process circulation substrate (1), chemical cleaning (2), machinery brush board (3), pad pasting (4), change next procedure (5) over to, before pad pasting, be coated with water membrane at the plate face earlier, pressure is 20-80PSI during pad pasting, temperature is 90-120 ℃, transfer rate is 0.5-4m/min, it is characterized in that the uniform continuous moisture film of coating one layer thickness on the plate face, Xiang Shuizhong adds AEO, content is formed for 0.01-1.0% weight, and the molecular structure of AEO is RO (CH
2CH
2O)
2H, wherein R=C
12H
25-C
16H
37
2. the wet filming method of flexible printed circuit according to claim 1 is characterized in that the pad pasting temperature is 105 ℃, and pressure is 50PSI, and transfer rate is 1.5m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100327870A CN100379324C (en) | 2005-01-10 | 2005-01-10 | Wet filming method of flexible printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100327870A CN100379324C (en) | 2005-01-10 | 2005-01-10 | Wet filming method of flexible printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1658738A CN1658738A (en) | 2005-08-24 |
| CN100379324C true CN100379324C (en) | 2008-04-02 |
Family
ID=35007920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100327870A Expired - Fee Related CN100379324C (en) | 2005-01-10 | 2005-01-10 | Wet filming method of flexible printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100379324C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015035754A1 (en) * | 2013-09-13 | 2015-03-19 | 番禺南沙殷田化工有限公司 | Wet process-based film pasting method for flexible printed circuit board |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI293851B (en) | 2005-12-30 | 2008-02-21 | Ind Tech Res Inst | Capacitive microphone and method for making the same |
| CN1997244B (en) * | 2005-12-31 | 2012-05-23 | 财团法人工业技术研究院 | Capacitance microphone and its making method |
| CN101605432B (en) * | 2009-07-10 | 2011-08-24 | 番禺南沙殷田化工有限公司 | Automatic wet process lamination method of rigid printed circuit boards |
| CN101961942A (en) * | 2010-08-09 | 2011-02-02 | 代芳 | Circuit board wet-lamination method and device |
| CN102079158B (en) * | 2010-11-11 | 2013-06-19 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
| CN102510672A (en) * | 2011-11-27 | 2012-06-20 | 常州市协和电路板有限公司 | Method for manufacturing radiofrequency transmission substrates |
| CN103203943A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Film mounting method for substrate |
| CN103203944A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Film-mounting method by adding water |
| CN106102332B (en) * | 2016-07-07 | 2019-01-01 | 深圳市景旺电子股份有限公司 | A kind of wiring board and its method for adhering film |
| CN106793528A (en) * | 2016-12-05 | 2017-05-31 | 东莞市科佳电路有限公司 | A kind of method of pcb board part electrolytic copper wet method press mold |
| CN108650802A (en) * | 2018-06-29 | 2018-10-12 | 珠海杰赛科技有限公司 | A kind of reworking method of plating folder film defective products |
| CN110740583B (en) * | 2019-10-08 | 2021-06-25 | 深南电路股份有限公司 | Pattern transfer method for printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4405394A (en) * | 1980-05-27 | 1983-09-20 | E. I. Du Pont De Nemours And Company | Laminating process |
| CN1043799A (en) * | 1988-12-23 | 1990-07-11 | 纳幕尔杜邦公司 | Do not have bubble with the pressurized with fluid manufactured, the printed circuit board (PCB) of film/liquid solder mask coating is arranged |
| GB2385022A (en) * | 2002-02-08 | 2003-08-13 | Albert Michael Keane | Technique for laminating films to glass substrates |
-
2005
- 2005-01-10 CN CNB2005100327870A patent/CN100379324C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4405394A (en) * | 1980-05-27 | 1983-09-20 | E. I. Du Pont De Nemours And Company | Laminating process |
| CN1043799A (en) * | 1988-12-23 | 1990-07-11 | 纳幕尔杜邦公司 | Do not have bubble with the pressurized with fluid manufactured, the printed circuit board (PCB) of film/liquid solder mask coating is arranged |
| GB2385022A (en) * | 2002-02-08 | 2003-08-13 | Albert Michael Keane | Technique for laminating films to glass substrates |
Non-Patent Citations (1)
| Title |
|---|
| 内层良品率提升的捷径. Gregory，E.Homan（李学义，译）.印刷电路信息，第5期. 2000 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015035754A1 (en) * | 2013-09-13 | 2015-03-19 | 番禺南沙殷田化工有限公司 | Wet process-based film pasting method for flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1658738A (en) | 2005-08-24 |
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Granted publication date: 20080402 Termination date: 20210110 |