CN103203944A - Film-mounting method by adding water - Google Patents
Film-mounting method by adding water Download PDFInfo
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- CN103203944A CN103203944A CN2012100107442A CN201210010744A CN103203944A CN 103203944 A CN103203944 A CN 103203944A CN 2012100107442 A CN2012100107442 A CN 2012100107442A CN 201210010744 A CN201210010744 A CN 201210010744A CN 103203944 A CN103203944 A CN 103203944A
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- pad pasting
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Abstract
The present invention discloses a film-mounting method by adding water, and the method comprises the steps of: S10, after the pretreatment of a substrate, delivering the substrate to a film mounting station; S11, checking the substrate before the film mounting; S12, spraying water on the substrate surface; S13, preheating a film mounting machine before the film mounting; and S14, equipping a to-be-mounted dry film on the film mounting machine, installing rollers on the film mounting machine, and then feeding the substrate wetted by spaying deionized water into the rollers for film mounting. According to the film-mounting method by adding water, through water wetting, affinity between the dry film and a core mold (the substrate) is increased and bubbles can be effectively driven way; by driving small bubbles generated in the mounted film, adhesion and mounting performance of the dry film with substrate is increased, and film mounting quality is improved, thus preventing film falling off later.
Description
Technical field
The invention belongs to the surface mounting technology field, relate in particular to that a kind of employing adds the method that the water mode is carried out pad pasting in the mask plate manufacture craft.
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Background technology
Surface mounting technology (Surface Mounting Technology is called for short SMT) is born in the sixties in last century.The Surface Mount Component, that SMT just is to use certain instrument will not have pin was placed into on printing soldering paste or the PCB pad through some glue exactly, passed through wave-soldering or Reflow Soldering then, made components and parts and circuit board set up favorable mechanical and be electrically connected.
At present, make the field at the PCB mask plate, generally adopt photoetching process, earlier photoresist is coated on the substrate, carry out exposure technology then, the back developing process that then exposes carries out electroforming or etching at last.Along with the progress of science and technology, the manufacturing technology of microelectronics industry is at a tremendous pace, and wherein lithography process (lithography process) is being played the part of very important role.Lithography process comprises formation photoresist layer, exposure (exposure) and the steps such as (development) of developing.Lithography process briefly is that the line pattern that will design is complete and accurately copy on the substrate.
Wherein, film coating process is first procedure in whole lithography process, plays an important role, and the quality of film coating process directly has influence on the carrying out of subsequent technique and the quality of product.The principle of pad pasting is very simple, namely under uniform temperature and physical pressure the photoresistance dry film is attached on the substrate uniformly with certain speed.But, be a difficult point for high-accuracy mask plate pad pasting, there are the temperature difference in dry film and substrate (core) during owing to pad pasting, make that the two applying is bad, and easily produce bubble, in follow-up development electroforming process, will cause bad phenomenon such as film like this.
Therefore, industry is badly in need of exploring a kind of bonding force that can improve dry film and substrate (core), and generation bubble when effectively preventing pad pasting is avoided the method for adhering film of film, solve present electrode print the problem that faces of film coating process.
Summary of the invention
For addressing the above problem, the object of the present invention is to provide a kind of employing to add the method that the water mode is carried out pad pasting, to have reduced the bubble that produces in the pad pasting, strengthen the stickiness of dry film and substrate.
For achieving the above object, technical scheme of the present invention is:
A kind of employing adds the method that the water mode is carried out pad pasting, comprises the steps:
S10: substrate is delivered to the pad pasting station through pre-treatment;
S11: check before the substrate pad pasting;
S12: substrate surface is sprayed water;
S13: the preheating of laminator is prepared before the pad pasting;
S14: the dry film that will paste installs at laminator, and namely the laminator upper roller is sent the substrate after the over and done with deionized water spray wettability treatment into roller then and carried out pad pasting.
Further, described step S12 evenly sprays at substrate surface by adopting deionized water, mainly comprises the steps:
S120: deionized water is packed in the spray thrower, and try spray and check whether mouth spray stops up;
S121: the substrate level is placed on the operating desk evenly sprays.
Further, the pre-treatment among the described step S10 mainly comprise to substrate clean, polishing, stoving process.
Further, the inspection of among the described step S11 substrate being carried out before the pad pasting mainly comprises: check whether substrate surface has water mark, cut and dirt, and by special-purpose wiping liquid wiped clean.
The present invention adopts and to add method that the water mode carries out pad pasting by water-wet, has increased the compatibility of dry film and core (substrate) in the pad pasting process, can well drive bubble away.Throw out the minute bubbles that produce in the pad pasting, increase adhesiveness, the stickiness of dry film and substrate; Improve the pad pasting quality, avoid the follow-up film that falls.
Description of drawings
Fig. 1 is method flow diagram of the present invention.
Fig. 2 is thermosticking film schematic diagram of the present invention.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
Please refer to shown in Figure 1ly, the present invention adopts and to add the water mode and carry out the method for pad pasting and comprise:
S10: substrate is delivered to the pad pasting station through pre-treatment
Described pre-treatment mainly comprise to substrate clean, polish, technology such as oven dry.
S11: check before the substrate pad pasting
Substrate is carried out inspection before the pad pasting, check whether substrate surface has water mark, cut and dirt, and by special-purpose wiping liquid wiped clean.
S12: substrate surface is sprayed water
Evenly spray at substrate surface with deionized water, substrate surface is sprayed moistening getting final product.Wherein, mainly comprise the steps:
S120: deionized water is packed in the spray thrower, and try spray and check whether mouth spray stops up;
S121: the substrate level is placed on the operating desk evenly sprays.
S13: the preheating of laminator is prepared before the pad pasting
Need before the pad pasting that laminator is carried out preheating and prepare, treat that the laminator temperature is constant and begin to carry out pad pasting work again.
S14: the dry film that will paste installs at laminator, and namely the laminator upper roller is sent the substrate after the over and done with deionized water spray wettability treatment into roller then and carried out pad pasting.
The present invention adopts and adds the method that the water mode is carried out pad pasting, and is easy and simple to handle, catches up with bubble respond well.During concrete operations, at first the substrate that pre-treatment is come in checks, checks whether the surface has water mark, cut, dirt, then with special-purpose wiping liquid wiped clean; Then begin to spray at substrate surface with deionized water, require to spray evenly, only need wetting getting final product a little; Then, the laminator preheating is prepared before the pad pasting, require the laminator temperature constant just begin pad pasting; At last, substrate is sent into the laminator cylinder.
Please refer to shown in Figure 2ly, be thermosticking film schematic diagram of the present invention, comprising substrate 4, be attached at substrate 4 surfaces dry film 3, be used for dry film 3 is compressed pad pasting upper roller 1 and the pad pasting bottom roller 2 that is attached on the substrate 4.Wherein, dry film 3 and substrate 4 tightly are held between pad pasting upper roller 1 and the pad pasting bottom roller 2.
The present invention adopts and adds the suitable any substrate of method that the water mode is carried out pad pasting, comprise thin plate, slab, and catch up with the respond well of bubble, obtained the checking of testing, only needing during checking that use is added water adhered film adds water adhered film and compares experiment with not using, wherein, figure adopts the fine and closely woven and many pattern datas of opening lines, is convenient to view result.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. an employing adds the method that the water mode is carried out pad pasting, it is characterized in that, comprises the steps:
S10: substrate is delivered to the pad pasting station through pre-treatment;
S11: check before the substrate pad pasting;
S12: substrate surface is sprayed water;
S13: the preheating of laminator is prepared before the pad pasting;
S14: the dry film that will paste installs at laminator, and namely the laminator upper roller is sent the substrate after the over and done with deionized water spray wettability treatment into roller then and carried out pad pasting.
2. employing as claimed in claim 1 adds the method that the water mode is carried out pad pasting, it is characterized in that: described step S12 evenly sprays at substrate surface by adopting deionized water, mainly comprises the steps:
S120: deionized water is packed in the spray thrower, and try spray and check whether mouth spray stops up;
S121: the substrate level is placed on the operating desk evenly sprays.
3. employing as claimed in claim 2 adds the method that the water mode is carried out pad pasting, it is characterized in that: the pre-treatment among the described step S10 mainly comprise to substrate clean, polishing, stoving process.
4. employing as claimed in claim 3 adds the method that the water mode is carried out pad pasting, it is characterized in that: the inspection of among the described step S11 substrate being carried out before the pad pasting mainly comprises: check whether substrate surface has water mark, cut and dirt, and by special-purpose wiping liquid wiped clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100107442A CN103203944A (en) | 2012-01-16 | 2012-01-16 | Film-mounting method by adding water |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100107442A CN103203944A (en) | 2012-01-16 | 2012-01-16 | Film-mounting method by adding water |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103203944A true CN103203944A (en) | 2013-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100107442A Pending CN103203944A (en) | 2012-01-16 | 2012-01-16 | Film-mounting method by adding water |
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| CN (1) | CN103203944A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107187642A (en) * | 2017-06-27 | 2017-09-22 | 昆山特酷信息科技有限公司 | A kind of still method for adhering film of tablet personal computer display screen diaphragm |
| CN108237685A (en) * | 2017-12-28 | 2018-07-03 | 苏州触动电子科技有限公司 | Automate film sticking equipment and the applying method using automation film sticking equipment |
| CN113716102A (en) * | 2021-07-06 | 2021-11-30 | 江苏东福光电科技有限公司 | Novel sheet film machine table for diffusion plate and using method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1658738A (en) * | 2005-01-10 | 2005-08-24 | 安捷利（番禺）电子实业有限公司 | Wet filming method of flexible printed circuit |
| JP2009174002A (en) * | 2008-01-24 | 2009-08-06 | Fujifilm Corp | Heat treatment method, and barrier film |
| CN102079158A (en) * | 2010-11-11 | 2011-06-01 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
-
2012
- 2012-01-16 CN CN2012100107442A patent/CN103203944A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1658738A (en) * | 2005-01-10 | 2005-08-24 | 安捷利（番禺）电子实业有限公司 | Wet filming method of flexible printed circuit |
| JP2009174002A (en) * | 2008-01-24 | 2009-08-06 | Fujifilm Corp | Heat treatment method, and barrier film |
| CN102079158A (en) * | 2010-11-11 | 2011-06-01 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107187642A (en) * | 2017-06-27 | 2017-09-22 | 昆山特酷信息科技有限公司 | A kind of still method for adhering film of tablet personal computer display screen diaphragm |
| CN108237685A (en) * | 2017-12-28 | 2018-07-03 | 苏州触动电子科技有限公司 | Automate film sticking equipment and the applying method using automation film sticking equipment |
| CN113716102A (en) * | 2021-07-06 | 2021-11-30 | 江苏东福光电科技有限公司 | Novel sheet film machine table for diffusion plate and using method thereof |
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Application publication date: 20130717 |