CN100373541C - Chuck plate assembly with cooling means - Google Patents
Chuck plate assembly with cooling means Download PDFInfo
- Publication number
- CN100373541C CN100373541C CNB2006100003306A CN200610000330A CN100373541C CN 100373541 C CN100373541 C CN 100373541C CN B2006100003306 A CNB2006100003306 A CN B2006100003306A CN 200610000330 A CN200610000330 A CN 200610000330A CN 100373541 C CN100373541 C CN 100373541C
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- Prior art keywords
- shadow mask
- substrate
- sedimentary origin
- chuck
- coldplate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62B—HAND-PROPELLED VEHICLES, e.g. HAND CARTS OR PERAMBULATORS; SLEDGES
- B62B3/00—Hand carts having more than one axis carrying transport wheels; Steering devices therefor; Equipment therefor
- B62B3/002—Hand carts having more than one axis carrying transport wheels; Steering devices therefor; Equipment therefor characterised by a rectangular shape, involving sidewalls or racks
- B62B3/005—Details of storage means, e.g. drawers, bins or racks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62B—HAND-PROPELLED VEHICLES, e.g. HAND CARTS OR PERAMBULATORS; SLEDGES
- B62B3/00—Hand carts having more than one axis carrying transport wheels; Steering devices therefor; Equipment therefor
- B62B3/02—Hand carts having more than one axis carrying transport wheels; Steering devices therefor; Equipment therefor involving parts being adjustable, collapsible, attachable, detachable or convertible
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a chuck plate assembly for depositing an organic material on a glass substrate comprising the glass substrate having a back side and a front side, a shadow mask formed with a predetermined pattern and being aligned and attached to the front side of the glass substrate, a shadow mask frame being aligned and attached to the shadow mask and a cooling element being assembled on the back side and/or the front side of the glass substrate. The temperature of the substrate is optimized so that an alignment error due to thermal deformation is minimized.
Description
The application requires to be submitted on January 5th, 2005 2005-0000965 number and 2005-0000966 number rights and interests of Korea S Department of Intellectual Property, and the content of described application is contained in this by reference.
Technical field
The present invention relates to a kind of device that prevents the thermal deformation of the substrate of glass that organic semiconductor device needs, more particularly, relate to a kind of shadow mask frame with thermal radiation and refrigerating function, and a kind ofly glass plate is being attached to the chuck that uses in the shadow mask and have cooling component, wherein, cooling agent circulates in chuck, therefore prevent because the increase of the radiant heat in auto-deposition source or conduction heat temperature in substrate of glass of causing by the contact shadow mask under vacuum environment, thereby improved the accuracy of aliging between substrate of glass and the shadow mask.
Background technology
Usually, the organic semiconductor device for example organic film of Organic Light Emitting Diode is formed by the low molecule organic material of evaporation in vacuum environment, perhaps is formed by use spin coating method, dip-coating method, scraper or ink-jet printing method behind the dissolve polymer organic material in solvent.
Particularly, comprise that in vacuum environment the film of low molecule organic material is manufactured, the shadow mask with predetermined pattern is required to be used for that organic material is deposited on suitable layer.Shadow mask is fixed to shadow mask frame.Align with this shadow mask and when being attached to this shadow mask, carry out the film growth course then when substrate of glass is set up.During the film growth course, point type or line formula organic material sedimentary origin are used will hang down the molecule organic material according to predetermined pattern and are deposited on the substrate of glass.
The typical sedimentary technology of the schematically illustrated use vertical-type of Fig. 1 sedimentary origin, for example, it will hang down the molecule organic material and guide the shadow mask with predetermined pattern into when making organic light emitting display.In depositing operation, the shadow mask 20 with predetermined pattern is installed to shadow mask frame 10, and substrate of glass 30 is aligned by chuck 40 and magnetic rubber 50 then.Then, the deposition materials from vertical-type sedimentary origin 70 is deposited on the substrate of glass 30 by shadow mask 20.Here, in vacuum environment, carry out depositing operation.
In above-mentioned depositing operation, radiant heat R is transferred to shadow mask from sedimentary origin, therefore, has increased its temperature.Along with the rising of mask temperature, therefore its thermal expansion has also reduced the accuracy of the pattern position of Organic Light Emitting Diode.This reduced to be used to embody red R, green G and blue B pattern position accuracy and cause R, G and B color mixed, Here it is well-known " variable color ".
In addition, substrate of glass not only is subjected to the photothermal influence from sedimentary origin, also be subjected to conducting hot influence owing to directly contacting with shadow mask, thereby the temperature of substrate of glass rises constantly.More specifically, under substrate of glass is difficult to thermal-radiating situation, accumulated by continuous depositing operation heat.Therefore, when only having shadow mask frame to be cooled, the thermal deformation difference between substrate of glass and the shadow mask becomes bigger.
Summary of the invention
Therefore, an aspect of of the present present invention is to provide a kind of shadow mask-frame assembly, and it has the radiant heat of thermal radiation function to prevent from substantially to shift from sedimentary origin, and refrigerating function is accumulated in the shadow mask to prevent heat, thereby restrains the thermal expansion of shadow mask.This has improved the accuracy of the pattern position of Organic Light Emitting Diode.
Embodiments of the invention provide a kind of chuck assembly, comprising: shadow mask is formed with predetermined pattern; Shadow mask frame, shadow mask are attached on it; Coldplate is installed on the part that shadow mask is exposed to sedimentary origin.
Another embodiment of the present invention provides a kind of chuck assembly, comprising: shadow mask is formed with predetermined pattern; Shadow mask frame is used to support shadow mask; Substrate is alignd with shadow mask and is deposited thereon from the deposition materials of sedimentary origin; Chuck by will closely being attached to the rear surface away from the substrate of sedimentary origin in the face of the front surface of sedimentary origin, is attached to described shadow mask with described substrate, and wherein, chuck comprises the circulate coolant pipe, and cooling agent is by this circulate coolant pipe circulation.
In the another embodiment of the present invention, a kind of chuck assembly also comprises outer coldplate, is installed on the relative rear surface of the front surface with closely being attached to described substrate of chuck.In the present embodiment, outer coldplate rather than chuck comprise the circulate coolant pipe, and cooling agent is by this circulate coolant pipe circulation.
Description of drawings
The description that preferred embodiment is carried out in conjunction with the drawings, these and other aspect of the present invention will become apparent and is more readily understood, wherein:
Fig. 1 is the schematic diagram that the general depositing operation that uses the vertical-type sedimentary origin is shown;
Fig. 2 is the schematic diagram that illustrates according to the depositing operation of using shadow mask frame of the embodiment of the invention;
Fig. 3 is the amplification diagrammatic sketch of " A " among Fig. 2;
Fig. 4 illustrates the schematic diagram that is installed to according to the coldplate of the shadow mask frame of the embodiment of the invention, and wherein, coldplate can prevent the shadow mask phenomenon;
Fig. 5 illustrates according to alignment between the shadow mask of the embodiment of the invention and the substrate of glass and the detailed amplification view that adheres to;
Fig. 6 shows the diagrammatic plan view and the schematic side elevation of the chuck that is used for the cooled glass substrate according to another embodiment of the present invention;
Fig. 7 is the perspective view of chuck according to another embodiment of the present invention;
Fig. 8 is to use the schematic diagram of the depositing operation of chuck according to another embodiment of the present invention;
Fig. 9 shows the schematic plan diagrammatic sketch and the schematic side elevation of the chuck that is used for the cooled glass substrate according to another embodiment of the present invention;
Figure 10 is the perspective view of chuck according to another embodiment of the present invention;
Figure 11 is the detailed amplification view that alignment between the shadow mask and substrate of glass is shown according to another embodiment of the present invention and adheres to;
Figure 12 is to use the schematic diagram of the depositing operation of chuck according to another embodiment of the present invention.
Embodiment
Below, the preferred embodiments of the present invention are described with reference to the accompanying drawings, wherein, provide embodiments of the invention to be more readily understood by those skilled in the art.
As shown in Figure 2, the shadow mask 120 with predetermined pattern is installed to shadow mask frame 110.In common depositing operation, from sedimentary origin 170 to shadow mask 120 and the distance of substrate 130 be approximately 300mm or more, and sedimentary origin 170 has about 200 ℃ nozzle temperature.Therefore, the radiant heat R from sedimentary origin 170 causes shadow mask 120 thermal expansions.At this moment, the thermal expansion of shadow mask 120 directly is subjected to the Temperature Influence of shadow mask frame 110.
Heat radiation method or cooling means can be used to restrain the thermal expansion of shadow mask 120.The heat radiation method interception is from the radiant heat R of sedimentary origin 170.Cooling means prevents heat accumulation in shadow mask 120.
According to embodiments of the invention, coldplate 60 can be installed to the part of shadow mask frame 110 in the face of sedimentary origin 170, thereby carries out heat radiation method and cooling means.The radiant heat R that coldplate 60 is tackled from shadow mask frame 110, and remove the heat that in shadow mask frame 110, accumulates.
Coldplate 60 is installed on the shadow mask frame 110 in the face of vertical-type sedimentary origin 170, and coldplate 60 is subjected to radiant heat easily, prevents the rising of shadow mask frame 110 temperature.This has just prevented because the distortion of the shadow mask 120 that thermal expansion causes, thereby has strengthened the accuracy of pattern position.
Simultaneously, can go wrong: coldplate 60 hinders the deposition materials from vertical-type sedimentary origin 170, and therefore reduces the film growth district of substrate.
In order to address this problem, coldplate 60 comprises expose portion 60a that faces sedimentary origin 170 and the interior section 60b that faces the film growth district, as shown in Figure 3 and Figure 4.Here, the interior section 60b of coldplate 60 is tapers.Because the interior section 60b of coldplate 60 has cone, thus the film growth district of substrate fix, irrelevant with the variation of the upright position of sedimentary origin 170, thus protected the film growth district.
Coldplate preferably surrounds whole shadow mask frame to improve the thermal radiation and the cooling effect of shadow mask frame.
In addition, can make by various thermal-radiating materials known to a person of ordinary skill in the art according to the coldplate 60 of the embodiment of the invention.
See Fig. 5, substrate of glass 130 and shadow mask 120 are aligned by chuck and magnetic rubber 150 and adhere to, and the coldplate 60 with cone is installed to shadow mask frame 110.Coldplate 60 is tackled from the radiant heat of sedimentary origin 170 and is prevented that heat accumulation is in shadow mask 120.Yet coldplate 60 can not prevent fully that substrate of glass 130 temperature are subjected to radiant heat and because the directly influence of shifting from sedimentary origin 170 of the conduction heat of contact shadow mask 120 generations.Therefore, under the situation that only has shadow mask frame 110 to be cooled, the difference of thermal deformation becomes big between substrate of glass 130 and the shadow mask 120.
For sort this problem out, for example, the present invention can provide the chuck that is used for the cooled glass substrate according to another embodiment of the present invention, as shown in Figure 6.
With reference to Fig. 6 and Fig. 7, chuck assembly can comprise: shadow mask 120 has predetermined pattern; Shadow mask frame 110 is used for fixing shadow mask 120; Coldplate 60 is placed on shadow mask 120 in the face of in the sedimentary origin exposed portions, prevents the thermal deformation of shadow mask frame 110; Chuck 140 makes substrate of glass 130 align with shadow mask 120 and is attached to shadow mask 120.Chuck 140 can be formed with circulate coolant pipe 41.Deposition materials can deposit on the substrate of glass 130 from sedimentary origin, forms predetermined pattern.
Chuck 140 is from its rear side support glass substrate 130, and substrate of glass 130 is alignd with shadow mask 120 and is attached to shadow mask 120.Circulate coolant pipe 41 is formed directly into the inside of chuck 140, thereby cooling agent is recycled by circulate coolant pipe 41, so cooled glass substrate 130.
Chuck 140 can be made of aluminum and adheres to rear side with covering glass substrate 130 in depositing operation, thereby substrate of glass 130 is had favorable cooling effect.
Circulate coolant pipe 41 can be formed on chuck 140 inside by the whole bag of tricks.Circulate coolant pipe 41 is long more, gives the cooling effect of substrate of glass 130 good more.Therefore, circulate coolant pipe 41 preferably prolongs to increase cooling effect.
In addition, for example can consider that the size of chuck 140 and the cooling effect of expectation design circulate coolant pipe 41.As shown in Figure 6 and Figure 7, circulate coolant pipe 41 has inlet 42 that is placed on chuck 140 first edges and the outlet 43 that is placed on chuck 140 second edges.Perhaps, the entrance and exit of circulate coolant pipe 41 can be placed on the same edge of chuck.
In addition, the thermoregulator (not shown) can be set to regulate temperature by circulate coolant pipe 41 coolant circulating.In this case, can consider the temperature of substrate of glass 130 and shadow mask 120, optimize temperature by circulate coolant pipe 41 coolant circulating.In addition, the thermometer (not shown) can be set to measure the temperature of shadow mask 120.
See Fig. 8, when radiant heat R when sedimentary origin 170 is transferred to shadow mask 120 and substrate of glass 130, the coldplate 60 that is installed to shadow mask frame 110 is restrained the rising of the temperature of shadow mask frame 110, thereby prevents because the thermal deformation of the shadow mask 120 that the thermal expansion of shadow mask 120 causes.
In addition, use chuck 140 shadow mask 120 is alignd with substrate of glass 130 and make shadow mask 120 be attached to substrate of glass 130, by being formed on circulate coolant pipe 41 coolant circulating of chuck 140 inside, thereby substrate of glass 130 is cooled, therefore, the difference of thermal deformation between substrate of glass 130 and the shadow mask 120 is minimized.
When the temperature of considering shadow mask 120, when optimizing the temperature by circulate coolant pipe 41 coolant circulating, the temperature difference between substrate of glass 130 and the shadow mask 120 is minimized.Therefore, because the alignment error that the thermal expansion of substrate of glass 130 and shadow mask 120 causes is minimized, thereby improved the accuracy of alignment between substrate of glass 130 and the shadow mask 120.
To shown in Figure 11, chuck assembly also comprises the outer coldplate 45 in the outside that is installed in chuck 140 according to another embodiment of the present invention as Fig. 9, and it is formed with circulate coolant pipe 46.
The identical consideration that is applied to circulate coolant pipe 41 as mentioned above can be applied to circulate coolant pipe 46.
The outlet 48 that circulate coolant pipe 46 has the inlet 47 at first edge that is placed on outer coldplate 45 and is placed on second edge of outer coldplate 45.Perhaps, the entrance and exit of circulate coolant pipe 46 can be placed on the same edge of outer coldplate 45.But serviceability temperature adjuster (not shown) and thermometer (not shown) are to optimize the temperature of substrate of glass 130 and shadow mask 120.
With reference to Figure 12, outer coldplate 45 is installed to the outside of chuck 140, circulate coolant pipe 46 circulations of cooling agent by being formed on outer coldplate 45 inside, thus substrate of glass is indirectly cooled, therefore, the difference of the thermal deformation between substrate of glass 1 30 and the shadow mask 120 is minimized.Here, outer according to another embodiment of the present invention coldplate 45 can be made by various thermal-radiating materials known to a person of ordinary skill in the art.
As mentioned above, when coldplate is installed to shadow mask in the face of the part of sedimentary origin, not only from plate 60 interceptions that are cooled of the radiant heat of sedimentary origin, the temperature of shadow mask itself also is prevented from rising, thereby, therefore also prevent the reduction of the pattern position accuracy that the thermal expansion by shadow mask 120 causes because the distortion of the shadow mask that causes of thermal expansion is prevented from.
It will be apparent to those skilled in the art that under the situation that does not break away from the spirit or scope of the present invention, can carry out various modifications and variations.Therefore, the present invention has covered in the scope by claim and its equivalent provides modifications and variations of the present invention.
Claims (10)
1. chuck assembly, comprising: shadow mask is formed with predetermined pattern; Shadow mask frame, shadow mask are attached on it; Coldplate is installed in the part that shadow mask frame is exposed to sedimentary origin, and described coldplate is mounted with the complete described shadow mask that centers on,
Wherein, described coldplate has the interior section that extends towards the film growth district, and described interior section is tapered.
2. chuck assembly as claimed in claim 1, wherein, described sedimentary origin is along vertically moving in the face of the surperficial parallel plane of sedimentary origin with shadow mask.
3. chuck assembly, comprising: shadow mask is formed with predetermined pattern; Shadow mask frame is used to support shadow mask; Substrate is alignd with described shadow mask and is deposited in the described substrate from the deposition materials of sedimentary origin; Chuck, by will closely being attached to rear surface in the face of the front surface of sedimentary origin away from the substrate of sedimentary origin, described substrate is attached to described shadow mask, wherein, chuck comprises the circulate coolant pipe, and cooling agent is by this circulate coolant pipe circulation, described circulate coolant pipe has entrance and exit, described chuck is made of aluminum, and described chuck assembly also comprises and is installed in the coldplate that shadow mask is exposed to the part of sedimentary origin
Wherein, described coldplate has the interior section that extends towards the film growth district, and described interior section is tapered.
4. chuck assembly as claimed in claim 3, wherein, described sedimentary origin vertically moves along the plane parallel with the front substrate surface of facing sedimentary origin.
5. chuck assembly as claimed in claim 3 also comprises thermoregulator, is used for based on the adjustment of the shadow mask temperature by circulate coolant pipe coolant circulating.
6. chuck assembly as claimed in claim 5 also comprises thermometer, is used to measure the temperature of described shadow mask.
7. chuck assembly, comprising: shadow mask is formed with predetermined pattern; Shadow mask frame is used to support shadow mask; Substrate is alignd with described shadow mask and is deposited in the described substrate from the deposition materials of sedimentary origin; Chuck by will closely being attached to the rear surface away from the substrate of sedimentary origin in the face of the front surface of sedimentary origin, is attached to described shadow mask with described substrate; Outer coldplate, be installed on the relative rear surface of the front surface with closely being attached to described substrate of chuck, wherein, described outer coldplate comprises the circulate coolant pipe, cooling agent is by this circulate coolant pipe circulation, and the circulate coolant pipe has entrance and exit, and described chuck is made of aluminum, described chuck assembly also comprises and is installed in the shadow mask coldplate that shadow mask is exposed to the part of sedimentary origin
Wherein, described shadow mask coldplate has the interior section that extends towards the film growth district, and described interior section is tapered.
8. chuck assembly as claimed in claim 7, wherein, described sedimentary origin vertically moves along the plane parallel with the front surface of the substrate of facing sedimentary origin.
9. chuck assembly as claimed in claim 7 also comprises thermoregulator, is used for based on the adjustment of the shadow mask temperature by circulate coolant pipe coolant circulating.
10. chuck assembly as claimed in claim 9 also comprises thermometer, is used to measure the temperature of described shadow mask.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050000965 | 2005-01-05 | ||
| KR1020050000966 | 2005-01-05 | ||
| KR1020050000965A KR100646942B1 (en) | 2005-01-05 | 2005-01-05 | a chuck plate assembly for cooling a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1805119A CN1805119A (en) | 2006-07-19 |
| CN100373541C true CN100373541C (en) | 2008-03-05 |
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ID=36867056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100003306A Active CN100373541C (en) | 2005-01-05 | 2006-01-04 | Chuck plate assembly with cooling means |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100646942B1 (en) |
| CN (1) | CN100373541C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205685A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Electroforming mask plate |
| KR101420162B1 (en) | 2012-02-13 | 2014-07-21 | 주식회사 선익시스템 | Apparatus for Cooling Substrates |
| KR101693788B1 (en) * | 2015-06-17 | 2017-01-09 | 주식회사 에스에프에이 | Mask frame assembly and apparatus for depositing thin film having the same |
| CN105132860A (en) * | 2015-09-23 | 2015-12-09 | 京东方科技集团股份有限公司 | Metal mask cooling device and metal mask evaporating device |
| KR101844643B1 (en) | 2016-02-03 | 2018-04-02 | 주식회사 야스 | Combining unit of substrate and mask for improving substrate hangning |
| CN109023239B (en) * | 2018-09-05 | 2020-12-29 | 京东方科技集团股份有限公司 | Cooling plate and film coating device |
| KR20220056914A (en) | 2020-10-28 | 2022-05-09 | 삼성디스플레이 주식회사 | Mask frame and deposition apparatus including the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002008859A (en) * | 2000-06-16 | 2002-01-11 | Sony Corp | Pattern forming device, pattern forming method, manufacturing device and manufacturing method of organic electroluminescent element display |
| US20020062791A1 (en) * | 2000-10-11 | 2002-05-30 | Andrey Ginovker | Table |
| US20040089232A1 (en) * | 2002-07-22 | 2004-05-13 | Koji Sasaki | Organic film formation apparatus |
| US20040232109A1 (en) * | 2003-05-21 | 2004-11-25 | Mitsuhiro Yoshinaga | Mask unit and film deposition apparatus using the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4179041B2 (en) * | 2003-04-30 | 2008-11-12 | 株式会社島津製作所 | Deposition device for organic EL protective film, manufacturing method, and organic EL element |
-
2005
- 2005-01-05 KR KR1020050000965A patent/KR100646942B1/en active IP Right Grant
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2006
- 2006-01-04 CN CNB2006100003306A patent/CN100373541C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002008859A (en) * | 2000-06-16 | 2002-01-11 | Sony Corp | Pattern forming device, pattern forming method, manufacturing device and manufacturing method of organic electroluminescent element display |
| US20020062791A1 (en) * | 2000-10-11 | 2002-05-30 | Andrey Ginovker | Table |
| US20040089232A1 (en) * | 2002-07-22 | 2004-05-13 | Koji Sasaki | Organic film formation apparatus |
| US20040232109A1 (en) * | 2003-05-21 | 2004-11-25 | Mitsuhiro Yoshinaga | Mask unit and film deposition apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100646942B1 (en) | 2006-11-23 |
| KR20060080483A (en) | 2006-07-10 |
| CN1805119A (en) | 2006-07-19 |
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