CN100362673C - 一种提高半导体发光二极管光提取效率的表面钝化方法 - Google Patents
一种提高半导体发光二极管光提取效率的表面钝化方法 Download PDFInfo
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- CN100362673C CN100362673C CNB2006100010615A CN200610001061A CN100362673C CN 100362673 C CN100362673 C CN 100362673C CN B2006100010615 A CNB2006100010615 A CN B2006100010615A CN 200610001061 A CN200610001061 A CN 200610001061A CN 100362673 C CN100362673 C CN 100362673C
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000002161 passivation Methods 0.000 claims abstract description 19
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims abstract description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000000605 extraction Methods 0.000 claims abstract description 11
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000001272 nitrous oxide Substances 0.000 claims abstract description 9
- 238000001259 photo etching Methods 0.000 claims abstract description 9
- 229910000077 silane Inorganic materials 0.000 claims abstract description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 claims abstract description 7
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims abstract 4
- 238000009832 plasma treatment Methods 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 239000008246 gaseous mixture Substances 0.000 claims description 4
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 239000007858 starting material Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910020286 SiOxNy Inorganic materials 0.000 abstract description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 239000007789 gas Substances 0.000 abstract 2
- 229910004205 SiNX Inorganic materials 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 229910001873 dinitrogen Inorganic materials 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 239000010408 film Substances 0.000 description 25
- 239000000523 sample Substances 0.000 description 12
- 238000000151 deposition Methods 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 241001025261 Neoraja caerulea Species 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- NICDRCVJGXLKSF-UHFFFAOYSA-N nitric acid;trihydrochloride Chemical compound Cl.Cl.Cl.O[N+]([O-])=O NICDRCVJGXLKSF-UHFFFAOYSA-N 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Formation Of Insulating Films (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2006100010615A CN100362673C (zh) | 2006-01-18 | 2006-01-18 | 一种提高半导体发光二极管光提取效率的表面钝化方法 |
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CNB2006100010615A CN100362673C (zh) | 2006-01-18 | 2006-01-18 | 一种提高半导体发光二极管光提取效率的表面钝化方法 |
Publications (2)
Publication Number | Publication Date |
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CN1822403A CN1822403A (zh) | 2006-08-23 |
CN100362673C true CN100362673C (zh) | 2008-01-16 |
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CNB2006100010615A Expired - Fee Related CN100362673C (zh) | 2006-01-18 | 2006-01-18 | 一种提高半导体发光二极管光提取效率的表面钝化方法 |
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CN (1) | CN100362673C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2257997A4 (en) * | 2008-03-25 | 2014-09-17 | Lattice Power Jiangxi Corp | SEMICONDUCTOR LIGHT ARRANGEMENT WITH DOUBLE-SIDED PASSIVATION |
US20120032212A1 (en) * | 2010-08-06 | 2012-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of light emitting diode sidewall passivation |
CN102136530A (zh) * | 2011-02-12 | 2011-07-27 | 西安神光安瑞光电科技有限公司 | 白光led的制备方法 |
CN102569564B (zh) * | 2012-02-27 | 2015-05-13 | 湘能华磊光电股份有限公司 | SiOx钝化膜的沉积方法及具有该钝化膜的LED芯片 |
CN102544268A (zh) * | 2012-03-05 | 2012-07-04 | 复旦大学 | 半导体发光二极管表面处理方法 |
WO2022073176A1 (en) * | 2020-10-09 | 2022-04-14 | Applied Materials, Inc. | Plasma-enhanced chemical vapor deposition processes for depositing passivation films on microelectronic structures |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1385885A (zh) * | 2002-06-20 | 2002-12-18 | 上海华虹(集团)有限公司 | 一种光刻用无机抗反射膜SiON的表面处理方法 |
CN1162734C (zh) * | 2002-04-19 | 2004-08-18 | 清华大学 | 室温发光硅基法布里-珀罗(f-p)微腔器件 |
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- 2006-01-18 CN CNB2006100010615A patent/CN100362673C/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1162734C (zh) * | 2002-04-19 | 2004-08-18 | 清华大学 | 室温发光硅基法布里-珀罗(f-p)微腔器件 |
CN1385885A (zh) * | 2002-06-20 | 2002-12-18 | 上海华虹(集团)有限公司 | 一种光刻用无机抗反射膜SiON的表面处理方法 |
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CN1822403A (zh) | 2006-08-23 |
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Address after: No. 1 North Ze street, Beijing Economic Development Zone, Beijing Patentee after: Beijing TimesLED Technology Co.,Ltd. Address before: Branch of Beijing economic and Technological Development Zone two Beijing street, No. 4 Building 2 layer in the south of 1-4 Patentee before: Beijing TimesLED Technology Co.,Ltd. |
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