CN100361563C - Plasma display - Google Patents
Plasma display Download PDFInfo
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- CN100361563C CN100361563C CNB2004101023473A CN200410102347A CN100361563C CN 100361563 C CN100361563 C CN 100361563C CN B2004101023473 A CNB2004101023473 A CN B2004101023473A CN 200410102347 A CN200410102347 A CN 200410102347A CN 100361563 C CN100361563 C CN 100361563C
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- plasma display
- heating panel
- display system
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Abstract
A plasma display apparatus includes: a plasma display panel; a chassis base arranged parallel to the plasma display panel; a driver IC electrically connecting electrodes of the plasma display panel to a driving circuit, the driver IC adapted to supply voltage signals to the electrodes of the plasma display panel in accordance with signals from the driving circuit; and a heat dissipating plate arranged adjacent to the driver IC and facing the chassis base to interpose the driver IC between the chassis base and a heat dissipating plate; wherein the heat dissipating plate includes an accommodating portion adapted to accommodate the driver IC on a side surface thereof opposite to the driver IC.
Description
Technical field
The present invention relates to a kind of plasma display system, and more particularly, relate to a kind of plasma display system that comprises in order to the heating panel that transmits the heat that produces by driver IC effectively.
Background technology
Usually, plasma display system has the plasma display panel that the plasma that utilizes gas discharge to produce shows desired image.This plasma display panel has the electrode that is electrically connected with drive circuit, voltage signal is supplied with the driver IC of electrode according to the signal of drive circuit output.
Using the voltage of driver IC to apply structure comprises: driver IC is installed on chip on board (COB) structure on the printed circuit board (PCB) (PCB); And, driver IC directly is installed on chip (COF) structure on the film on flexible print circuit (FPC) film.Now, (Tape Carrier Package TCP) applies structure as voltage to use a small size and a band year encapsulation cheaply widely.
In order to utilize plasma display panel to show at least 256 gray scales, at least 8 address discharges must take place in corresponding to 1/60 second time of a TV electric field, therefore COF, COB or the TCP that is installed on the base plate produced considerable heat.
So, for COB or COF are provided with stiffener, to strengthen its density of texture globality and to be fixed on the base plate.This stiffener also has the effect of fin, is emitted to the outside with the heat that IC is produced.
Heat for dissipation is produced by the TCP driver IC uses fin.Used fin can be the solid fin that is attached on the TCP, to dissipate heat in the air.Yet this fin radiating efficiency is low.For this reason, the problem of existence is: fin must be enough big with respect to the size of driver IC, with a large amount of heats of dissipation by the generation of TCP driver IC.
Summary of the invention
The purpose of this invention is to provide a kind of plasma display system with the radiator structure that is used for driver IC, this radiator structure can improve the reliability of driver IC by the heat that dissipation is effectively produced by driver IC, thus the fault of preventing or other inefficacy.
Plasma display system according to one aspect of the invention comprises: plasma display panel; Be parallel to the base plate that plasma display panel is provided with; Driver IC, its electrode that is electrically connected plasma display panel is to drive circuit, and it supplies with voltage signal according to the signal of drive circuit the electrode of plasma display panel; And, heating panel, its close driver IC setting, and towards base plate, thereby driver IC is placed between base plate and the heating panel.Wherein, described heating panel comprises holding portion, and this part is contained in driver IC on the heating panel side relative with driver IC.
This holding portion preferably includes heat-conduction medium.
Heat-conduction medium preferably places between the driver IC side surface relative with driver IC with heating panel.
This heat-conduction medium preferably places between the side surface of the holding portion of heating panel and the driver IC relative with this place.
The holding portion of this heat-conduction medium preferably is filled with heat-conduction liquid or gel media.
This heat-conduction medium is silicone oil or hot grease preferably.
This holding portion preferably includes canyon topography and is formed in pockets on heating panel one side surface.
This holding portion preferably includes and is formed on its opposite side surface and to jut that should pockets.
Preferably, a plurality of heat-dissipating fins integrally are arranged on the heating panel opposite side surface.
Fin preferably is installed on the opposite side surface of heating panel, and this fin has a plurality of heat-dissipating fins.
This heating panel preferably includes: be arranged in parallel with base plate so that the first relative with driver IC; And, the second portion that extends to the plasma display panel periphery from a far-end of first integrally.
This driver IC preferably is electrically connected the electrode of plasma display panel by flexible print circuit (FPC), and is received part and centers on fully, and wherein FPC passes holding portion.
This driver IC preferably carries the form encapsulation of encapsulation (TCP) with band.
Plasma display system according to a further aspect of the invention comprises: plasma display panel; Base plate has the plasma display panel that is positioned on the one side surface and is arranged at the lip-deep drive circuit of its opposite side; Driver IC, its electrode that is electrically connected plasma display panel is supplied with voltage signal according to the signal of drive circuit the electrode of plasma display panel to drive circuit; Heating panel near the driver IC setting and towards base plate, thereby places driver IC between base plate and the heating panel; And, being arranged at first heat-conduction medium between heating panel and the driver IC, its heat that is suitable for being produced by driver IC is sent to heating panel.
First heat-conduction medium is heat-conduction liquid or gel media preferably.
First heat-conduction medium is silicone oil or hot grease preferably.
First heat-conduction medium preferably has the coefficient of heat conduction that is not less than 1.0W/mK and is not less than 100, the viscosity of 000cps.
High heat conduction solid element is preferably disposed on the base plate part relative with driver IC.
Plasma display system preferably also comprises second heat-conduction medium that is arranged between solid element and the driver IC, and its heat that is suitable for being produced by driver IC is sent to high heat conduction solid element.
Second heat-conduction medium is heat-conducting liquid or gel media preferably.
Plasma display system preferably also comprises the 3rd heat-conduction medium that is arranged between first heat-conduction medium and the driver IC.
The 3rd heat-conduction medium is conducting strip preferably.
Heating panel preferably also comprise be suitable for first heat-conduction medium be contained on the relative side surface of heating panel with driver IC holding portion.
Description of drawings
By below in conjunction with the accompanying drawing detailed description of the present invention, the present invention is easy to understand, in the accompanying drawing similarly Reference numeral represent identical or similar elements, wherein:
Fig. 1 according to the first embodiment of the present invention, have a decomposition diagram of the plasma display system of the radiator structure that is used for driver IC;
Fig. 2 is the cutaway view along the A-A line intercepting of Fig. 1;
Fig. 3 is the cutaway view of radiator structure according to a second embodiment of the present invention, that be used for driver IC;
Fig. 4 is the cutaway view of a third embodiment in accordance with the invention, the radiator structure that is used for driver IC;
Fig. 5 is the cutaway view of a fourth embodiment in accordance with the invention, the radiator structure that is used for driver IC;
Fig. 6 is the cutaway view of radiator structure according to a fifth embodiment of the invention, that be used for driver IC;
Fig. 7 is the cutaway view of radiator structure according to a sixth embodiment of the invention, that be used for driver IC;
Fig. 8 is the cutaway view of radiator structure according to a seventh embodiment of the invention, that be used for driver IC;
Fig. 9 according to the eighth embodiment of the present invention, be used for the cutaway view of the radiator structure of driver IC; And
Figure 10 according to the ninth embodiment of the present invention, be used for the cutaway view of the radiator structure of driver IC.
Embodiment
By below in conjunction with the accompanying drawing detailed description of the present invention, the present invention is easy to understand, in the accompanying drawing similarly Reference numeral represent identical or similar elements, wherein:
Fig. 1 is the decomposition diagram of plasma display system that is used for the radiator structure of driver IC according to having of first embodiment of the invention, and Fig. 2 is the cutaway view along the A-A line intercepting of Fig. 1.
With reference to figure 1 and Fig. 2, plasma display system comprises plasma display panel 12 (hereinafter referred is " PDP ") and base plate 16.Base plate 16 is made of Cu, Fe etc., and PDP 12 is installed on the side surface of base plate, and drive circuit 18 is installed on the opposite side surface of base plate 16.
The PDP 12 of plasma display device is installed on the base plate (not shown), and the protecgulum (not shown) is positioned on the outside of PDP 12, and the bonnet (not shown) is positioned on the base plate outside.
The electrodes that extend from PDP 12 periphery are electrically connected drive circuits 18, drive the required signal of PDP 12 to receive.
Driver IC 23 is with the encapsulation of TCP 25 forms, thereby with FPC 21 and drive circuit 18 electrical connections, driver IC 23 is installed on the TCP band FPC 21.With base plate 16 driver IC 23 is set relatively.
In the outside of driver IC 23, be on the outside of TCP 25 heating panel 32 to be set, to support TCP25 and to be fixed on the base plate 16.Parallel and heating panel 32 is set along the periphery of base plate 16.
Can heating panel 32 vertically be set along the periphery of base plate 16 in integral slab, and a plurality of heating panels 32 can be set continuously along the periphery of base plate 16, wherein each heating panel 32 corresponds respectively to driver IC 23.
For heating panel 32 is provided with 32a of first and second portion 32b, the 32a of this first is relative with driver IC 23, and second portion 32b integrally extends to the periphery of PDP 12 from a far-end of first.This heating panel 32 can be made of Al, Cu, Fe etc. according to the mode identical with base plate 16.
Secure component (not shown) by for example screw is fixed to the extension 27 of base plate 16 with heating panel 32, maybe can be fixed on the following high heat conduction solid part 127.Heat-conduction medium 41 is arranged between the 32a of first and driver IC 23 of heating panel 32, so that the heat that driver IC 23 is produced is sent to heating panel 32 effectively.
In plasma display system according to first embodiment of the invention, provide heating panel 32, so that heat-conduction medium 41 can be placed between the side surface of driver IC 23 and the heating panel 32 relative with driver IC 23 with the holding portion 50 that is used to hold driver IC 23.Heat-conduction medium 41 can be placed equally between the side surface of the holding portion of heating panel 32 and the driver IC 23 relative with heating panel 32.
In more detail, holding portion 50 is provided with the pockets 36 that forms on side surface of the 32a of first, outwards forms jut 38 from the opposite side surface corresponding to pockets 36.The width of determining jut 38 according to the width and the degree of depth of pockets 36 and height.
Preferably, driver IC 23 can partly be contained in the predetermined height in the pockets 36, and this predetermined altitude is based on FPC 21 surfaces.
Heat-conduction medium 41 should be liquid state or gel state at least under the working temperature of PDP 12, can use silicone oil or the hot grease of pyroconductivity coefficient more than 1.0 W/mK.
The heat that this heat-conduction medium 41 not only is used for being produced by driver IC 23 is sent to heating panel 32, and be used for driver IC 23 fix in position, because heat-conduction medium 41 is contained in the pockets 36, and, heat-conduction medium 41 part be contained in driver IC 23 in the pockets 36 around keep gel state.
Because being installed into contacting heat-conduction medium 41, driver IC 23 contacts fully, so needn't exert pressure by relative 23 pairs of heating panels 32 of driver IC for transfer of heat.In addition; even external impact is applied on the base plate 16 or base plate 16 is bent; because driver IC 23 is contained in the groove 36; and be installed in the stationary heat transmitting medium 41 under the gel state; also owing between FPC 21 and heating panel 32, forming the gap, so protection driver IC 23 is injury-free.
Because driver IC 23 parts are contained in the groove 36, and by secure component heating panel 32 are fixed on the base plate 16, so between FPC 21 and heating panel 32, form predetermined gap.As a result, because heat-conduction medium 41 absorbs the direct impact between FPC 21 and the heating panel 32, and owing to be applied to the external impact of heating panel 32 and alleviated, so can effectively prevent the damage of breaking of FPC 21 for example etc.
According to the present invention, heat-conduction medium 41 is sent to heating panel 32 with the heat that driver IC 23 produces.Since the periphery that heat-conduction medium 41 is contained in driver IC 23 with and the groove 36 of upper surface in, so towards the both sides of the pockets 36 of heat-conduction medium 41 equally as radiator portion.As a result, when heating panel 32 closely contacted with heat-conduction medium 41, the contact area that is used to dispel the heat increased.So the pyroconductivity coefficient of the heat-conduction medium 41 relative with driver IC 23 improves, the temperature of having reduced driver IC 23 thus rises.Equally, because heating panel 32 provides jut 38 on the one surface of respective slot 36, so heating panel 32 can have bigger area of dissipation to improve radiating efficiency.
Hereinafter second to the 9th embodiment of the present invention is described, the structural detail that the structural detail of first embodiment is identical uses identical Reference numeral, and omits its detailed description for the sake of brevity.
Fig. 3 is the cutaway view of the radiator structure that is used for driver IC according to a second embodiment of the present invention.
With reference to figure 3, different with first embodiment, heating panel 132 only is provided with the first 132a relative with driver IC 23.Holding portion 150 is provided with the pockets 136 that forms and outwards forms from its opposite side surface and the jut 138 of corresponding pockets 136 on the side surface of the 132a of first.The width of determining jut 138 according to the width and the degree of depth of pockets 136 and height.
As a result, owing to removed the second portion 32b of Fig. 2 according to the heating panel 132 of second embodiment, thus reduced the overall size of plasma display system, and reduced the used material of formation heating panel, obtain plasma display system compacter and that simplify thus.
Fig. 4 is the cutaway view of the radiator structure that is used for driver IC of a third embodiment in accordance with the invention.
With reference to figure 4, the pockets 250 of heating panel 232 has " τ " shape cross section with interior receptacle 236, and makes heating panel 232 depressions and be fixed in base plate 16, so that it holds heat-conduction medium 41 and whole driver IC 23.So the heat that is produced by driver IC is sent to heating panel 232 effectively by heat-conduction medium 41.
Fig. 5 is the cutaway view according to the radiator structure that is used for driver IC 23 of fourth embodiment of the invention.
With reference to figure 5, for heating panel 332 forms holding portion 350, this part has the chamber 336 that is positioned on its inside, so that center at least one part of whole driver IC 23 and FPC 21.Chamber 336 accommodates heat-conduction medium 41.FPC 21 passes holding portion 350.The result, because holding portion 350 and heat-conduction medium 41 are around whole driver IC 23, so improved the pyroconductivity coefficient of the heat-conduction medium 41 relative with driver IC 23, thereby the heat that driver IC 23 produces can be sent to heating panel 332 effectively by heat-conduction medium 41, and be emitted in the air.
Fig. 6 is the cutaway view of the radiator structure that is used for driver IC according to a fifth embodiment of the invention.
With reference to figure 6, heating panel 432 is formed with 432a of first and second portion 432b, and the 432a of this first is relative with driver IC 23, and this second portion 432b extends to the periphery of PDP 12 from the far-end of the 432a of first.Heating panel 432 has radiator structure, and this radiator structure has a plurality of heat-dissipating fins 439 that are provided with along the 432a of first.
Heat-conduction medium 41 is arranged in the pockets 436 of holding portion 450, this holding portion 450 is formed on the side surface of heating panel 432.As a result, the heat that is sent to heating panel 432 by heat-conduction medium 41 can pass through heat-dissipating fin 439 dissipations, thereby reduces the temperature of radiating efficiency, and wherein this heat-dissipating fin 439 is outstanding from the 432a of first on heating panel 432 opposite side surfaces.
Fig. 7 is the cutaway view of the radiator structure that is used for driver IC according to a sixth embodiment of the invention.
With reference to figure 7, heating panel 632 is formed with 632a of first and second portion 632b, and the 632a of this first is relative with driver IC 23, and this second portion 632b extends to the periphery of PDP 12 from the far-end of the 632a of first.Heating panel 632 is fixed on the fin 660 with a plurality of heat-dissipating fins 639.
The holding portion 650 that holds driver IC 23 and heat-conduction medium 41 has: the pockets 636 that forms on the side surface of the 632a of first; With the outside also jut 638 of corresponding pockets 636 that forms from its opposite side surface.This fin 660 has aligned fit groove (registeringcoupling recess) 651, and this groove arrangement becomes by being connected with jut 638 corresponding shape and this ledge 638.As a result, because the increase of the contact area of heating panel 632 contact heat spreaders 660, so the heat that is produced by driver IC 23 is easier to be emitted in the air by fin 660.
As mentioned above, although first to the 6th embodiment has TCP 25 is arranged at structure (referring to Fig. 2-7) on the extension 27 of base plate 16, the 8th to the tenth embodiment has TCP 25 is arranged on structure (referring to Fig. 8-10) from the outstanding heat conduction solid element 127 of base plate 16.
Fig. 8 is the cutaway view of the radiator structure that is used for driver IC according to a seventh embodiment of the invention.
With reference to figure 8, the second portion 732b that heating panel 732 has the first 732a relative with driver IC 23 and extends to PDP 12 peripheries from a far-end of first.For the purpose of convenient, first heat-conduction medium 41 is called transmitting medium 41, is placed between the 732a of first of driver IC 23 and heating panel 732.Second heat-conduction medium 42 of liquid state or gel state also places between driver IC 23 and the high heat conduction solid element 127.
In more detail, heat-conduction medium 41 should be liquid state or gel state at least under the working temperature of PDP 12, and it can be silicone oil or hot grease.This heat-conduction medium 41 has the pyroconductivity coefficient greater than 1.0W/mK, can not flow to the periphery of circuit element when being in erectility with convenient device.Equally, preferably, first heat-conduction medium 41 has the thickness of 0.2mm between 732a of first and driver IC 23.
The clamp structure (not shown) is exerted pressure to heating panel 732, so that the predetermined pressure contact driver IC 23 that utilizes fastening force to determine.With above-mentioned radiator structure, the heat that is produced by driver IC 23 is sent to heating panel 732 by first heat-conduction medium 41, and continues to be emitted in the air.
In addition, second heat-conduction medium 42 has identical characteristic with first heat-conduction medium 41.So the heat that produces at driver IC 23 is sent to high heat conduction solid element 127 by second heat-conduction medium 42.Then, the heat that is sent to high heat conduction solid element 127 is conducted to base plate 16 and continue to be emitted in the air.
In the plasma display system of based on the above discussion embodiment, heating panel 732 is installed on the high heat conduction solid element 127, simultaneously driver IC 23 is applied predetermined pressure.Then, driver IC 23 closely contacts with high heat conduction solid element 127.Because first heat-conduction medium 41 places between heating panel 732 and the driver IC 23, so first heat-conduction medium 41 closely contacts heating panel 732 and driver IC 23.That is to say, not between first heat-conduction medium 41 and the heating panel 732 and/form air layer on the border surface between first heat-conduction medium 41 and the driver IC 23.
In comparing embodiment, will be arranged at by the heat-conduction medium that the sheet silicones constitutes between heating panel 732 and the driver IC 23.When the heat dissipation characteristics of comparing embodiment is compared with embodiments of the invention, find to be sent to the heat of heating panel 732 and the heat that produces by driver IC between have the temperature difference.Measure the temperature ratio of using driver IC 23 of the present invention and use the little 2～3EC of temperature of comparing embodiment driver IC 23.This shows that heat dissipation characteristics according to present embodiment driver IC 23 is better than the heat dissipation characteristics according to comparing embodiment driver IC 23.
In addition, because second heat-conduction medium 42 that is arranged between driver IC 23 and the high heat conduction solid element 127 is formed by liquid or gel, similar with first heat-conduction medium, therefore second heat-conduction medium closely contacts driver IC 23 and high heat conduction solid element 127.That is to say, do not forming air layer between second heat-conduction medium 42 and the high heat conduction solid element 127 or on the border surface between second heat-conduction medium 42 and the driver IC 23.
Therefore, contact area between heating panel 732 and the driver IC 23 strengthens, and has improved from driver IC 23 to heating panel 732 pyroconductivity coefficient thus.Equally, increased the contact area between driver IC 23 and the high heat conduction solid element 127, improved pyroconductivity coefficient thus from driver IC 23 to high heat conduction solid element 127.
Fig. 9 is the cutaway view according to the radiator structure that is used for driver IC 23 of the eighth embodiment of the present invention.
With reference to figure 9, have sheet the 3rd heat-conduction medium 43 according to the plasma display system of eighth embodiment of the invention, it places between the driver IC 23 and first heat-conduction medium 41.
In this embodiment, the 3rd heat-conduction medium 43 places between the 832a of first of driver IC 23 and heating panel 832, and first heat-conduction medium 41 places between the 832a of first and the 3rd heat-conduction medium 43 of heating panel 832.Heating panel 832 can have second portion 832b equally, and its far-end from the 832a of first extends to the periphery of PDP 12, and intersects so that support second portion 832b with the 832a of first.
The 3rd heat-conduction medium 43 can be formed by the silicone resin sheet that is fixed on driver IC 23 1 sides relative with heating panel 832.
In this embodiment, because first heat-conduction medium 41 that is arranged between the 3rd heat-conduction medium 43 and the heating panel 832 is liquid or gel, so first heat-conduction medium 41 can more closely contact the 3rd heat-conduction medium 43 and heating panel 832.That is to say, do not forming air layer between first heat-conduction medium 41 and the heating panel 832 or on the border surface between the first and the 3rd heat- conduction medium 41 and 43.
Therefore, increase the contact area between the 3rd heat-conduction medium 43 and first heat-conduction medium 41, improved from driver IC 23 to heating panel 832 pyroconductivity coefficient thus.Equally, increased the contact area between driver IC 23 and the high heat conduction solid element 127, improved pyroconductivity coefficient thus from driver IC 23 to high heat conduction solid element 127.
That is to say, when relative base plate 16 is exerted pressure on heating panel 832, at first will be sent on the 3rd heat-conduction medium 43, and be sent to first heat-conduction medium 41 subsequently, allow thus to dissipate heat in the air by heating panel 832 by the heat that driver IC 23 produces.As a result, reduced the temperature of driver IC 23 effectively.
Figure 10 is the cutaway view according to the radiator structure that is used for driver IC of the ninth embodiment of the present invention.
With reference to Figure 10, according to the plasma display system of ninth embodiment of the invention holding portion 950 is arranged, this holding portion 950 is used for first heat-conduction medium 41 is contained in a side surface of the heating panel 932 relative with driver IC 23.
In holding portion 950 recessed heating panels 932, and in groove, can hold first heat-conduction medium 41 of driver IC 23 and liquid state or gel.
As mentioned above, plasma display system according to this embodiment of the invention, because the heat-conduction medium 41 that holds in the groove of the pockets part 950 of heating panel 932 is centered around the both sides of driver IC 23, so the side surface of groove equally can be as the heating panel relative with heat-conduction medium 41.So, having increased heating panel 932 and the heat-conduction medium 41 tight contacts area that contact, and improved to the pyroconductivity coefficient of the heat-conduction medium 41 of driver IC, the temperature that has reduced driver IC 23 thus rises.
Equally, because its one side corresponding to driver IC of heating panel is provided with groove, so heating panel can have bigger area of dissipation to improve the radiating efficiency of driver IC 23.
Because heat-conduction medium 41 is at least liquid or gel under the working temperature of PDP 12, so, improved the radiating efficiency of driver IC thus not forming air layer between heat-conduction medium 41 and the heating panel 932 or on the border surface between heat-conduction medium 41 and the driver IC 23.
Equally; because after the heat-conduction medium 41 with liquid or gel state is injected into holding portion 950; the heat-conduction medium 41 that is in liquid or gel state can be the glue that congeals into; so heat-conduction medium 41 does not flow in the periphery of circuit element when device is upright, protective circuit is not contaminated thus.
Although below described one exemplary embodiment of the present invention in detail, but should be understood that understanding, to those skilled in the art, obviously can make many modifications and/or change to the present invention under the prerequisite that does not break away from spirit of the present invention, described modification and change fall in the spirit and scope of the invention that is defined by the claims.
Claims (16)
1. plasma display system comprises:
Plasma display panel;
Be parallel to the base plate that plasma display panel is provided with;
The electrode of plasma display panel is electrically connected to the driver IC of drive circuit, and this driver IC is according to the electrode of voltage signal being supplied with plasma display panel from the signal of drive circuit; And
Heating panel near the driver IC setting and towards base plate, thereby places driver IC between base plate and the heating panel;
Wherein, this heating panel comprises holding portion, and this part is contained in driver IC on the heating panel side surface relative with driver IC; And
First heat-conduction medium is folded between the along continuous straight runs of described driver IC and the described heating panel side surface relative with described driver IC; And also be folded between the side surface relative vertically of the holding portion of described heating panel and described driver IC with described heating panel.
2. plasma display system as claimed in claim 1, wherein the holding portion of heat-conduction medium is filled with heat-conduction liquid or gel media.
3. plasma display system as claimed in claim 1, wherein heat-conduction medium is silicone oil or hot grease.
4. plasma display system as claimed in claim 1, wherein holding portion is included in the pockets that canyon topography becomes on the side surface of heating panel.
5. plasma display system as claimed in claim 4, wherein holding portion is included on its opposite side surface and forms and corresponding to the jut of described pockets.
6. plasma display system as claimed in claim 1, wherein a plurality of heat-dissipating fins integrally are arranged on the opposite side surface of heating panel.
7. plasma display system as claimed in claim 1 wherein is installed on fin on the opposite side surface of heating panel, and this fin has a plurality of heat-dissipating fins.
8. plasma display system as claimed in claim 1, wherein this heating panel comprises:
Be arranged in parallel so that the first relative with base plate with driver IC;
From a far-end of first to the whole second portion that extends of the periphery of plasma display panel.
9. plasma display system as claimed in claim 1, wherein this driver IC is electrically connected the electrode of plasma display panel by flexible print circuit, and is divided integrally by the described accommodation section and to surround, and described flexible print circuit passes the described accommodation section branch.
10. plasma display system as claimed in claim 1, wherein this driver IC carries the form encapsulation of encapsulation with band.
11. plasma display system as claimed in claim 1, wherein first heat-conduction medium has the pyroconductivity coefficient that is not less than 1.0W/mK and is not less than 100, the viscosity of 000cps.
12. plasma display system as claimed in claim 1, wherein high heat conduction solid element is arranged on the part of the base plate relative with driver IC.
13. as the plasma display system of claim 12, also comprise second heat-conduction medium that is arranged between described high heat conduction solid element and the driver IC, it is used for the heat that driver IC produces is sent to high heat conduction solid element.
14. as the plasma display system of claim 13, wherein second heat-conduction medium is heat-conducting liquid or gel media.
15., also comprise the 3rd heat-conduction medium that is arranged between first heat-conduction medium and the driver IC as the plasma display system of claim 13.
16. as the plasma display system of claim 15, wherein the 3rd heat-conduction medium is a conducting strip.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR0074276/2003 | 2003-10-23 | ||
| KR0074276/03 | 2003-10-23 | ||
| KR1020030074276A KR100669368B1 (en) | 2003-10-23 | 2003-10-23 | Plasma display apparatus having heat dissipating structure for driver ic |
| KR0014564/2004 | 2004-03-04 | ||
| KR0014564/04 | 2004-03-04 | ||
| KR1020040014564A KR100649182B1 (en) | 2004-03-04 | 2004-03-04 | Plasma display apparatus having heat dissipating structure for driver ic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1620244A CN1620244A (en) | 2005-05-25 |
| CN100361563C true CN100361563C (en) | 2008-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004101023473A Expired - Fee Related CN100361563C (en) | 2003-10-23 | 2004-10-25 | Plasma display |
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| Country | Link |
|---|---|
| JP (1) | JP3923974B2 (en) |
| CN (1) | CN100361563C (en) |
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| KR100696517B1 (en) * | 2005-05-02 | 2007-03-19 | 삼성에스디아이 주식회사 | Structure for heat dissipation of integrated circuit chip of plasma display module and plasma display module comprising the same |
| KR100646567B1 (en) * | 2005-06-01 | 2006-11-14 | 삼성에스디아이 주식회사 | Drive circuit board and flat display apparatus including the same |
| KR100649566B1 (en) * | 2005-07-07 | 2006-11-27 | 삼성에스디아이 주식회사 | Plasma display device |
| KR100649216B1 (en) | 2005-07-21 | 2006-11-24 | 삼성에스디아이 주식회사 | Plasma display device |
| JPWO2007020697A1 (en) * | 2005-08-18 | 2009-02-19 | 日立プラズマディスプレイ株式会社 | Flat display device |
| JP4667504B2 (en) * | 2006-07-20 | 2011-04-13 | 日立プラズマディスプレイ株式会社 | Plasma display device |
| JP5504557B2 (en) * | 2007-09-21 | 2014-05-28 | セイコーエプソン株式会社 | Electro-optical device, mounting case for electro-optical device, and electronic apparatus |
| WO2009050874A1 (en) * | 2007-10-15 | 2009-04-23 | Panasonic Corporation | Display device and method for disassembling the same |
| KR100907235B1 (en) | 2007-10-30 | 2009-07-10 | 히다찌 플라즈마 디스플레이 가부시키가이샤 | Flat display device |
| JP5932297B2 (en) * | 2011-11-04 | 2016-06-08 | キヤノン株式会社 | Display device |
| JP6402512B2 (en) * | 2014-07-02 | 2018-10-10 | セイコーエプソン株式会社 | Electro-optic module and electronic equipment |
| KR102552047B1 (en) | 2016-11-24 | 2023-07-07 | 엘지디스플레이 주식회사 | Display device |
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|---|---|---|---|---|
| US20010033009A1 (en) * | 2000-04-25 | 2001-10-25 | Hirokazu Inoue | Display driver module and mounting structure therefor |
| JP2001326879A (en) * | 2000-05-18 | 2001-11-22 | Fuji Electric Co Ltd | Display driver module and its manufacturing method |
| JP2001352022A (en) * | 2000-06-05 | 2001-12-21 | Fujitsu Hitachi Plasma Display Ltd | Heat-dissipating mounting structure for driver ic |
| CN1397999A (en) * | 2001-07-13 | 2003-02-19 | 持田商工株式会社 | Radiating fin and plasma indicating panel |
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| JPH05313184A (en) * | 1992-05-13 | 1993-11-26 | Canon Inc | External circuit structure for driving liquid crystal display element |
| JP2638427B2 (en) * | 1993-05-27 | 1997-08-06 | 日本電気株式会社 | Liquid crystal display |
| JPH10260641A (en) * | 1997-03-17 | 1998-09-29 | Nec Corp | Mount structure for driver ic for flat panel type display device |
| JP3341987B2 (en) * | 1998-07-27 | 2002-11-05 | 中村製作所株式会社 | Method of forming a recess in a metal plate |
| JP2000242189A (en) * | 1999-02-24 | 2000-09-08 | Canon Inc | Image display panel supporting surface and plane thin type image display device |
| JP2001170721A (en) * | 1999-10-08 | 2001-06-26 | Shinko Electric Ind Co Ltd | Platelike body having recessed part, its manufacturing method and press die for forming recessed part |
| JP4310039B2 (en) * | 2000-09-29 | 2009-08-05 | エーユー オプトロニクス コーポレイション | IC heat dissipation structure and display device |
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2004
- 2004-10-19 JP JP2004304317A patent/JP3923974B2/en not_active Expired - Fee Related
- 2004-10-25 CN CNB2004101023473A patent/CN100361563C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010033009A1 (en) * | 2000-04-25 | 2001-10-25 | Hirokazu Inoue | Display driver module and mounting structure therefor |
| JP2001326879A (en) * | 2000-05-18 | 2001-11-22 | Fuji Electric Co Ltd | Display driver module and its manufacturing method |
| JP2001352022A (en) * | 2000-06-05 | 2001-12-21 | Fujitsu Hitachi Plasma Display Ltd | Heat-dissipating mounting structure for driver ic |
| CN1397999A (en) * | 2001-07-13 | 2003-02-19 | 持田商工株式会社 | Radiating fin and plasma indicating panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3923974B2 (en) | 2007-06-06 |
| CN1620244A (en) | 2005-05-25 |
| JP2005128533A (en) | 2005-05-19 |
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