CN100359698C - 可平铺的传感器阵列 - Google Patents

可平铺的传感器阵列 Download PDF

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Publication number
CN100359698C
CN100359698C CNB2003101187125A CN200310118712A CN100359698C CN 100359698 C CN100359698 C CN 100359698C CN B2003101187125 A CNB2003101187125 A CN B2003101187125A CN 200310118712 A CN200310118712 A CN 200310118712A CN 100359698 C CN100359698 C CN 100359698C
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CN
China
Prior art keywords
substrate
sensor array
interposer
connector
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2003101187125A
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English (en)
Chinese (zh)
Other versions
CN1506658A (zh
Inventor
小威廉·E·伯迪克
詹姆斯·W·罗斯
唐娜·M·舍曼
詹姆斯·E·萨巴蒂尼
乔治·E·波辛
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General Electric Co
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General Electric Co
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Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN1506658A publication Critical patent/CN1506658A/zh
Application granted granted Critical
Publication of CN100359698C publication Critical patent/CN100359698C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/29Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
    • G01T1/2914Measurement of spatial distribution of radiation
    • G01T1/2921Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras
    • G01T1/2928Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras using solid state detectors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/41Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
CNB2003101187125A 2002-12-06 2003-12-02 可平铺的传感器阵列 Expired - Fee Related CN100359698C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/313,078 2002-12-06
US10/313,078 US7564125B2 (en) 2002-12-06 2002-12-06 Electronic array and methods for fabricating same

Publications (2)

Publication Number Publication Date
CN1506658A CN1506658A (zh) 2004-06-23
CN100359698C true CN100359698C (zh) 2008-01-02

Family

ID=32392932

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003101187125A Expired - Fee Related CN100359698C (zh) 2002-12-06 2003-12-02 可平铺的传感器阵列

Country Status (6)

Country Link
US (1) US7564125B2 (https=)
JP (1) JP4688413B2 (https=)
CN (1) CN100359698C (https=)
DE (1) DE10356737A1 (https=)
IL (1) IL159065A0 (https=)
NL (1) NL1024947C2 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7257051B2 (en) 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US6990176B2 (en) 2003-10-30 2006-01-24 General Electric Company Methods and apparatus for tileable sensor array
US7239526B1 (en) * 2004-03-02 2007-07-03 Xilinx, Inc. Printed circuit board and method of reducing crosstalk in a printed circuit board
CN101213445A (zh) * 2005-06-29 2008-07-02 皇家飞利浦电子股份有限公司 超声波换能器中的优化的温度测量
US20070012965A1 (en) * 2005-07-15 2007-01-18 General Electric Company Photodetection system and module
JP4831300B2 (ja) * 2005-10-06 2011-12-07 ゼネラル・エレクトリック・カンパニイ マルチダイ背面照射型ダイオードのモジュール・アセンブリ
US7229292B1 (en) * 2005-12-22 2007-06-12 General Electric Company Interconnect structure for transducer assembly
US8648702B2 (en) 2010-08-20 2014-02-11 Denso International America, Inc. Combined time-of-flight and image sensor systems
JP5209689B2 (ja) * 2010-11-05 2013-06-12 株式会社東芝 超音波プローブ
US20120193545A1 (en) * 2011-01-31 2012-08-02 General Electric Company Detector systems with anode incidence face and methods of fabricating the same
RU2019103999A (ru) * 2016-07-14 2020-08-14 Конинклейке Филипс Н.В. Детекторный модуль, детектор, устройство формирования изображений и способ производства детекторного модуля
DE102018200845B4 (de) * 2018-01-19 2021-05-06 Siemens Healthcare Gmbh Montageverfahren für die Herstellung eines Röntgendetektors, Röntgendetektor und Röntgengerät

Citations (7)

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US4663652A (en) * 1983-11-21 1987-05-05 Sumotomo Electric Industries, Ltd. Package for optical device
US4798541A (en) * 1987-09-02 1989-01-17 Ncr Corporation Right angle electrical connector
US5477075A (en) * 1994-12-16 1995-12-19 Advanced Photonix, Inc. Solid state photodetector with light-responsive rear face
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5907178A (en) * 1996-01-29 1999-05-25 International Business Machines Corporation Multi-view imaging apparatus
US20020030261A1 (en) * 1999-12-17 2002-03-14 Rolda Ruben A. Multi-flip-chip semiconductor assembly
US20020081869A1 (en) * 2000-08-23 2002-06-27 Abbott Russell M. High density electrical connector

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US5464984A (en) 1985-12-11 1995-11-07 General Imaging Corporation X-ray imaging system and solid state detector therefor
JP2789234B2 (ja) * 1989-10-02 1998-08-20 株式会社日立メディコ 超音波診断装置
EP0473125B1 (en) 1990-08-30 1996-01-31 Shimadzu Corporation Radiation detector
US5267221A (en) * 1992-02-13 1993-11-30 Hewlett-Packard Company Backing for acoustic transducer array
JP3253203B2 (ja) 1993-01-19 2002-02-04 キヤノン株式会社 フレキシブル配線基板、及びこれを使用したインクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法
US5545429A (en) 1994-07-01 1996-08-13 International Business Machines Corporation Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
GB9710843D0 (en) * 1997-05-28 1997-07-23 Secr Defence A thermal detector array
US6234820B1 (en) 1997-07-21 2001-05-22 Rambus Inc. Method and apparatus for joining printed circuit boards
US6279399B1 (en) * 1998-08-03 2001-08-28 Vingmed Sound A/S Multi-dimensional transducer array apparatus
JP4147639B2 (ja) 1998-09-29 2008-09-10 宇部興産株式会社 フレキシブル金属箔積層体
JP2000164422A (ja) * 1998-11-24 2000-06-16 Fuji Electric Corp Res & Dev Ltd 薄膜コイルモジュール
JP4521126B2 (ja) * 2000-02-02 2010-08-11 株式会社東芝 二次元アレイ型超音波プローブ
US6426991B1 (en) * 2000-11-16 2002-07-30 Koninklijke Philips Electronics N.V. Back-illuminated photodiodes for computed tomography detectors
JP2003084066A (ja) * 2001-04-11 2003-03-19 Nippon Kessho Kogaku Kk 放射線検出器用部品、放射線検出器および放射線検出装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663652A (en) * 1983-11-21 1987-05-05 Sumotomo Electric Industries, Ltd. Package for optical device
US4798541A (en) * 1987-09-02 1989-01-17 Ncr Corporation Right angle electrical connector
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5477075A (en) * 1994-12-16 1995-12-19 Advanced Photonix, Inc. Solid state photodetector with light-responsive rear face
US5907178A (en) * 1996-01-29 1999-05-25 International Business Machines Corporation Multi-view imaging apparatus
US20020030261A1 (en) * 1999-12-17 2002-03-14 Rolda Ruben A. Multi-flip-chip semiconductor assembly
US20020081869A1 (en) * 2000-08-23 2002-06-27 Abbott Russell M. High density electrical connector

Also Published As

Publication number Publication date
NL1024947C2 (nl) 2007-04-20
IL159065A0 (en) 2004-05-12
DE10356737A1 (de) 2004-06-24
JP2004219406A (ja) 2004-08-05
JP4688413B2 (ja) 2011-05-25
US7564125B2 (en) 2009-07-21
NL1024947A1 (nl) 2004-06-15
CN1506658A (zh) 2004-06-23
US20040109299A1 (en) 2004-06-10

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Granted publication date: 20080102

Termination date: 20131202