CN100343968C - Detecting head of tester - Google Patents
Detecting head of tester Download PDFInfo
- Publication number
- CN100343968C CN100343968C CNB2004100324967A CN200410032496A CN100343968C CN 100343968 C CN100343968 C CN 100343968C CN B2004100324967 A CNB2004100324967 A CN B2004100324967A CN 200410032496 A CN200410032496 A CN 200410032496A CN 100343968 C CN100343968 C CN 100343968C
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- probe
- detecting head
- sheet
- testing apparatus
- wafer
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- Measuring Leads Or Probes (AREA)
Abstract
The present invention discloses a detector head of a testing device for testing a wafer. The detector head of the present invention comprises at least one probe, a pair of dies for vertically fixing the probe, and an aligning sheet which is positioned between the dies and is used for aligning a probe group, wherein the probe comprises a stress buffering part, and the dies and the aligning sheet are provided with probe-hole arrays for containing the probe. Pitches between every two probe holes of the probe-hole arrays are identical to contact pad pitches on a wafer or a component to be tested, and the wafer or the component to be tested has different contact pad locations but has identical contact pad pitches.
Description
Technical field
The present invention is relevant for a kind of testing apparatus detecting head, and is particularly a kind of relevant for testing apparatus elastic and vertical detecting head.
Background technology
In the modern integrated circuits technology, be the integrated circuit that forms accurate layout in wafer and on the surface.Generally be distributed in the wafer and epi-planarintegrated circuit has hundreds of small welded gasket or contact mat to be connected with external circuit.In order to carry out in the test wafer and epi-planarintegrated circuit, sometimes when wafer sorts (Wafer Sort), must use be hundreds of equally and spacing closely probe carry out test.It is to be undertaken to guarantee that integrated circuit can normal operation by test macro that wafer sorts testing electrical property.Test macro provides power supply to integrated circuit and receive the signal of passing back from integrated circuit via probe.General test macro comprises a detecting card, and detecting card is as the circuit interface between test macro and tested wafer or the element.
One typical detecting card such as publication number are disclosed by the Japan Patent KOKAI of Sho 64-73632.The detecting card that KOKAI disclosed has the probe that tilts to contact with contact mat.When the integrated level of integrated circuit is more and more higher, inevasiblely be, the contact mat of single wafer or weld pad number needs increase, and the size of contact mat or weld pad and spacing also must be done forr a short time.Above-mentioned detecting card with inclination probe also so gradually can't satisfy the demands.Except the detecting card with inclination probe, a kind of is that the Japan Patent KOKOKU of Hei 2-28828 and Japan Patent KOKAI that publication number is Sho 63-28862 disclose the detecting card with Vertrical probe and then meet demand as publication number.Detecting card design with Vertrical probe can significantly increase the quantity of probe and dwindle probe spacing.
In addition, along with the further raising of semiconductor element integrated level, must use high speed signal testing element at a high speed electrically.Although above-mentioned detecting card with Vertrical probe can be broken through the application bottleneck of the detecting card with inclination probe, still have a great problem to solve.For how efficient making can be applied to have the detecting card of the wafer of different contact mats and spacing and high integration integrated circuit respectively to this difficult problem.Fig. 1 shows the detecting head assembly 100 of a traditional detecting card.Detecting head assembly 100 has a plurality of probe aperture 102 that probe passes through that are used to hold.The formation position and the spacing of probe aperture 102 cooperates the contact mat position distribution and the spacing of corresponding specific component under test.That is to say,, must prepare to have corresponding to the probe aperture position of this specific contact mat position distribution and spacing and the detecting head assembly of spacing in order to test an element with specific contact mat position distribution and spacing.But generally consuming time often for several weeks at the making of traditional detecting head assembly of specific component under test, and the single detective head assembly can not be used for testing the element that other have different contact mat position distribution, therefore makes the cost of test different elements be difficult to reduce.
Because the shortcoming of above-mentioned traditional detecting card and detecting head, so the utmost point need propose a kind of new detecting head to solve above-mentioned shortcoming, and this is the purpose of the present invention's proposition.
Summary of the invention
The technical problem that institute of the present invention desire solves has the detecting head of probe and the probe aperture array group of the contact mat spacing of corresponding tested wafer or element to save time and cost for providing a kind of.
The technological means that the present invention deals with problems is to propose a detecting head, this detecting head comprises at least one probe, the a pair of Jie's sheet and of this probe of vertical fixing that is used for is between this is to Jie's sheet and in order to adjust the collimation sheet of this probe groups, wherein this probe comprises a stress buffer partly, and should have in order to hold the probe aperture array group of probe with the collimation sheet by Jie's sheet, probe aperture in this probe aperture array group is equidistantly to distribute, the probe aperture spacing of this probe aperture array group with have different contact mat position distribution but to have the tested wafer or the contact mat spacing on the element of identical contact mat spacing identical.
The effect of edition with parallel text invention and prior art, because utilization of the present invention has the detecting head of probe and the probe aperture array group of the contact mat spacing of corresponding tested wafer or element, so can save in order to test the time and the cost of the required making detecting head of different wafers or element.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
Description of drawings
Fig. 1 has shown the detecting head assembly of a traditional detecting card;
Fig. 2 A has shown the vertical view of one embodiment of the invention detecting heads;
Fig. 2 B has shown the front view of one embodiment of the invention detecting heads;
Fig. 3 has shown that detecting card and detecting head are used to test an element; And
Fig. 4 shows that detecting card and detecting head are used to test an element.
Embodiment
In this mandatory declaration is that structure described below and processing step do not comprise complete structure and processing step.The present invention can the various technologies of mat implement, and only mentions at this and understands component structure and technology required for the present invention.Below will appended diagram be described in detail according to the present invention.Must it should be noted that diagram is the form of a utmost point simplification and is not to draw in proportion.
Fig. 2 A and Fig. 2 B have shown the vertical view and the front view of one embodiment of the invention detecting heads respectively.Shown in Fig. 2 A, show a detecting head 200 with equidistant probe aperture array group.Shown in Fig. 2 B, detecting head 200 comprises probe 202, collimation sheet 206, Jie's sheet 204a and a 204b.Collimation sheet 206 is used to adjust the aligning of probe 202, and its material comprises Mai La (Mylar) polyester material or soft materials.Jie's sheet 204a and 204b are used for the vertical fixing of probe 202, and its material comprises ceramic material.Collimation sheet 206, Jie's sheet 204a and 204b comprise a plurality of probe aperture 210, and the formation position of probe aperture 210 is corresponding to the contact mat position of component under test.Though the collimation sheet 206 shown in Fig. 2 B, Jie's sheet 204a and 204b have only a probe aperture 210 and a probe 202, probe aperture 210 is also unrestricted with the quantity of probe 202.For having identical contact mat spacing but the wafer or the element of different contact mat position distribution, probe aperture 210 is formed on collimation sheet 206, Jie's sheet 204a and the 204b and corresponding to the contact mat spacing of all wafers or element and the position of contact mat position, forms the probe aperture array group.These are positioned at collimation sheet 206, Jie's sheet 204a and can be used for testing wafer or the element that all have uniform distances and corresponding contact mat position with probe aperture array group on the 204b.When test one wafer or element, probe is placed in the probe aperture corresponding to wafer or element contact mat position, and because probe aperture 210 has identical contact mat spacing but the wafer of different contact mats position or the contact mat position of element corresponding to all, detecting head 200 can be used for testing all and has identical contact mat spacing but the wafer or the element of different contact mats position and be beneficial to and carry out wafer and sort (Wafer Sort).
Fig. 3 has shown originally a detecting card 300 and the detecting head 200 of inventing an embodiment.As shown in Figure 3, detecting card 300 comprises a printed circuit board (PCB) 304 and detecting head 200.Printed circuit board (PCB) 304 is by a retainer ring (Mounting Ring) the 302 structural test macros (not shown) that are connected to.Printed circuit board (PCB) 304 by be positioned at not with another side that detecting head 200 contacts on weld pad (not shown) to be electrically connected to test macro.Printed circuit board (PCB) 304 has contact mat 306 to electrically connect probe 202.In test during one element 400, probe 202 is placed in the detecting head 200 probe aperture corresponding to element 400 contact mat positions, to electrically connect contact mat 402.Detecting head 200 is a packaged type, and is used for the signal transmission between component under test and the test macro.Detecting head 200 time is fixing and is electrically connected on the printed circuit board (PCB) 304 in test, printed circuit board (PCB) 304 then can bolt on retainer ring 302.
Fig. 4 shows that detecting card 300 and detecting head 200 are used to test an element 500. Element 400 and 500 comprises the wafer with integrated circuit.When testing element 500, probe 202 is placed in the detecting head 200 probe aperture corresponding to element 500 contact mat positions, to electrically connect contact mat 502.Utilize detecting head of the present invention, detecting card can be used for testing and anyly has identical contact mat spacing but the wafer or the element of different contact mats position, so the cost of element test can reduce effectively.
Though the present invention describes with reference to current specific embodiment, but those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, under the situation that does not break away from spirit of the present invention, also can make the variation or the replacement of various equivalences, therefore, as long as in connotation scope of the present invention in the scope to the variation of the foregoing description, claims that modification all will drop on the application.
Claims (8)
1. detecting head that is used for testing apparatus, this detecting head comprises:
At least one probe, this probe comprise a stress buffer partly;
A pair of Jie's sheet, this is to this probe of Jie's sheet vertical fixing; And
One collimation sheet, this collimation sheet is used to adjust the aligning of this probe and between this is to Jie's sheet, wherein a probe aperture array group be formed at this on Jie's sheet and this collimation sheet to hold this probe, probe aperture in this probe aperture array group is equidistantly to distribute, between this probe aperture array group apart from have that different contact mats distribute but the contact mat spacing of the component under test of identical contact mat spacing is identical.
2. the detecting head that is used for testing apparatus as claimed in claim 1 is characterized in that above-mentioned stress buffer partly comprises a bent part, the stress when can be used for absorbing test.
3. the detecting head that is used for testing apparatus as claimed in claim 1 is characterized in that the material of above-mentioned probe comprises a conductor material.
4. the detecting head that is used for testing apparatus as claimed in claim 3 is characterized in that above-mentioned conductor material comprises palladium metal.
5. the detecting head that is used for testing apparatus as claimed in claim 1 is characterized in that, on give an account of sheet material comprise a ceramic material.
6. the detecting head that is used for testing apparatus as claimed in claim 1 is characterized in that the material of above-mentioned collimation sheet comprises a flexible material.
7. the detecting head that is used for testing apparatus as claimed in claim 6 is characterized in that, above-mentioned flexible material comprises the polyester material of drawing advanced in years.
8. the detecting head that is used for testing apparatus as claimed in claim 1 is characterized in that, said elements comprises and has different contact mats and distribute but the wafer of identical contact mat spacing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100324967A CN100343968C (en) | 2004-04-09 | 2004-04-09 | Detecting head of tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100324967A CN100343968C (en) | 2004-04-09 | 2004-04-09 | Detecting head of tester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1681101A CN1681101A (en) | 2005-10-12 |
| CN100343968C true CN100343968C (en) | 2007-10-17 |
Family
ID=35067610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100324967A Expired - Fee Related CN100343968C (en) | 2004-04-09 | 2004-04-09 | Detecting head of tester |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100343968C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100360944C (en) * | 2006-03-01 | 2008-01-09 | 友达光电股份有限公司 | Voltage detecting circuit and voltage detecting system |
| WO2016108520A1 (en) * | 2015-01-04 | 2016-07-07 | 김일 | Contact inspection device |
| TWI596346B (en) * | 2016-08-24 | 2017-08-21 | 中華精測科技股份有限公司 | Probe device of vertical probe card |
| CN106199089B (en) * | 2016-10-10 | 2018-05-22 | 广东惠伦晶体科技股份有限公司 | A kind of anti-strip device for quartz crystal testing head |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1121644A (en) * | 1994-07-12 | 1996-05-01 | 现代电子产业株式会社 | Probe card |
| CN1166206A (en) * | 1995-08-17 | 1997-11-26 | 南载祐 | Probe card having verticle type needles and the method thereof |
| CN1216369A (en) * | 1997-11-05 | 1999-05-12 | 精密金属有限公司 | Test head for microstructures with interface |
| JP2003218180A (en) * | 1996-05-17 | 2003-07-31 | Formfactor Inc | Wafer-level burn-in and test |
| US20030199179A1 (en) * | 1993-11-16 | 2003-10-23 | Formfactor, Inc. | Contact tip structure for microelectronic interconnection elements and method of making same |
-
2004
- 2004-04-09 CN CNB2004100324967A patent/CN100343968C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030199179A1 (en) * | 1993-11-16 | 2003-10-23 | Formfactor, Inc. | Contact tip structure for microelectronic interconnection elements and method of making same |
| CN1121644A (en) * | 1994-07-12 | 1996-05-01 | 现代电子产业株式会社 | Probe card |
| CN1166206A (en) * | 1995-08-17 | 1997-11-26 | 南载祐 | Probe card having verticle type needles and the method thereof |
| JP2003218180A (en) * | 1996-05-17 | 2003-07-31 | Formfactor Inc | Wafer-level burn-in and test |
| CN1216369A (en) * | 1997-11-05 | 1999-05-12 | 精密金属有限公司 | Test head for microstructures with interface |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1681101A (en) | 2005-10-12 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071017 |