CN100333875C - Light conducting board processing method - Google Patents
Light conducting board processing method Download PDFInfo
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- CN100333875C CN100333875C CNB021349479A CN02134947A CN100333875C CN 100333875 C CN100333875 C CN 100333875C CN B021349479 A CNB021349479 A CN B021349479A CN 02134947 A CN02134947 A CN 02134947A CN 100333875 C CN100333875 C CN 100333875C
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- lgp
- processing method
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- platform
- gluing
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Abstract
The present invention relates to a processing method of a light guiding board, which comprises the following steps: preparing a platform; preparing an instrument with a prearranged shape and gluing the instrument on the platform; preparing a substrate to be processed of a light guiding board and gluing the substrate on the instrument; polishing the substrate of the light guiding board to form the light guiding board when the substrate of the light guiding board is ground to form a certain width. The light guiding board has lower surface roughness and favorable optical performance, and moreover, light guiding boards with different shapes can be obtains by replacing instruments with other shapes.
Description
[technical field]
The present invention relates to the processing method of the LGP of a kind of processing method of optical element, particularly a kind of excellent optical performance.
[background technology]
In recent years, along with the colorize and the maximization of LCD, its application is more extensive, as notebook computer, desktop computer and LCD TV etc.Because of liquid crystal itself can not be luminous, thereby need utilize a light-source system, as backlight module etc., as the light source of LCD.
LGP is the important optical element in the light-source system, and it can be divided into wedge shape and plate shaped LGP in order to entering in the liquid crystal panel from the light guiding of light source according to its shape.Please refer to Fig. 1, for having the backlight module of wedge shape LGP, it comprises wedge shape LGP 2, be positioned at the reflecting plate 4 of wedge shape LGP 2 one sides, be positioned at wedge shape LGP 2 opposite sides light diffusing sheet 5, be arranged on the light source 7 of wedge shape LGP 2 sides and the lampshade 8 that the light that light source 7 sends is imported wedge shape LGP 2.During work, the light that light source 7 sends enters wedge shape LGP 2 by lampshade 8 reflections, part light directly enters light diffusing sheet 5 by wedge shape LGP 2, the light of minority effusion wedge shape LGP 2 enters wedge shape LGP 2 after being reflected by reflecting plate 4 once more, and light is evenly injected in the liquid crystal panel 1 through behind the light diffusing sheet 5.With reference to Fig. 2, for having the backlight module of plate shaped LGP, not existing together of backlight modular structure is that the both sides of plate shaped LGP 3 are provided with light source 7 respectively among itself and Fig. 1, is beneficial to light and is uniformly distributed in the liquid crystal panel 1.
Wedge shape and plate shaped LGP generally adopt pressure gram (PMMA) material ejection formation, because difficult control such as the time of ejection formation, temperature and issuing velocity, and the smoothness of die surface is lower, so the flatness of finished product and roughness are relatively poor, and then influences optical property.And when injection, because shorting (resin non-rotating structure) and molten resin need be additional by packing pressure with the insufficient section of cooling curing generation volume contraction, because of passage to end-to-end distance from long, pressure does not have useful effect and shrinks, cause the figuration of die cavity one side to degenerate, thereby making light guide plate inhomogeneous, size is difficult to accurately.
And plate shaped LGP base material need cut off by the processing of laser cutting double as end face, and the thin slice after cut-out is printed on one side or the etching reflection graphic patterns, to form finished product.Because substrate surface is comparatively coarse and in uneven thickness, will cause subsequent printing inhomogeneous, and produce the gap with framework when chimeric and can not fit like a glove, therefore the LGP surface is processed and make that surface roughness reduces, thickness is more evenly very necessary.
In addition, make the light-source system of difform wedge shape LGP, then need open different moulds,, cause the processing cost of LGP to increase because die cost is higher with the matching fluid crystal display.
[summary of the invention]
The object of the present invention is to provide the processing method that a kind of cost is lower, can reduce the LGP of LGP surface roughness.Another object of the present invention is to provide a kind of processing method of plate shaped LGP.
The processing method of LGP of the present invention comprises the steps: to prepare a platform, prepares a tool and gluing this tool and platform, this tool has a predetermined angular with respect to the surface of the platform of gluing described tool, gluing LGP base material to be processed is ground to predetermined thickness with the platform direction that is parallel to gluing described tool to this surface of tool, with the LGP base material after, polish again, promptly make LGP.
Compared with prior art, the present invention saves the exploitation of the light-conducting board mold of different shape, so not only saves development cost, and tool is changed easily, cost of manufacture is lower, grinds, polishing can obtain the lower LGP of surface roughness.In addition, plate shaped LGP can be directly LGP base material and platform are carried out gluing, then to its grinding, polishing, simple, lower, the excellent optical performance of LGP surface roughness of its processing.
[description of drawings]
Fig. 1 is the schematic diagram that prior art has the backlight module of wedge shape LGP.
Fig. 2 is the schematic diagram that prior art has the backlight module of plate shaped LGP.
Fig. 3 is the combination schematic diagram of wedge shape LGP base material and platform in the processing method of the present invention, tool.
Fig. 4 is the schematic diagram of the wedge shape LGP made of processing method of the present invention.
Fig. 5 is the combination schematic diagram of processing method intermediate cam shape LGP base material of the present invention and platform, tool.
Fig. 6 is the schematic diagram of the triangle LGP made of processing method of the present invention.
[specific embodiment]
Please refer to Fig. 3, processing platform 10 can adopt the glass platform of hard nothing distortion, and it has level and smooth surface; The material of LGP base material 14 preferably adopts methacryl resin, and it can adopt ejection formation, also can adopt resin sheet to cut out; Wedge shape tool 12 can be made by the stainless steel material of hard nothing distortion, and it has good surperficial degree, and can be processed into different shape with the supporter as LGP base material 14; The LP-52 type that polisher lapper (figure does not show) can adopt Britain Logitech company to produce.Between platform 10 and the wedge shape tool 12, adopt two-sided epoxy resin adhesive tape 11,13 gluing between tool 12 and the LGP base material 14 respectively, wherein this two-sided epoxy resin adhesive tape 11,13 is a UV epoxy resin, its adhesion strength is strong and to move back glue easy.
Wedge shape LGP manufacturing procedure is as described below: at first platform 10 is thoroughly cleaned to keep any surface finish not have foreign matter, a selected angle is the wedge shape tool 12 of θ, thoroughly cleans to guarantee that its any surface finish do not have foreign matter; With two-sided epoxy resin adhesive tape 11 gluing wedge shape tools 12 and platform 10, to make even level and smooth, the no gap of its cemented surface when gluing; Selected one LGP base material 14 to be processed with two-sided epoxy resin adhesive tape 13 gluing tools 12 and LGP base material 14, when gluing, also will keep the evenly level and smooth no gap of cemented surface; Then, with polisher lapper machined surface 141 is ground, wherein, grinding pressure is 150g/cm
2, rotating speed is 70RPM (Round Per Minute, rev/min) time effect preferable, treat to stop to grind when LGP base material 14 is ground to than the thick 20 μ m of desired thickness, with the alundum (Al material machined surface 141 is cleaned, with polisher lapper it is polished, polish pressure is 120g/cm again
2, effect was preferable when rotating speed was 40RPM, stopped when being polished to desired thickness, this moment, wedge shape LGP base material 14 surface roughness can be reduced to below the 0.8nm, it has better optical characteristics.At last, wedge shape LGP base material 14 is moved back glue take off, with the germanium dioxide material its surface is cleaned to remove surface residue and viscose glue, to obtain the wedge shape LGP 24 that flatness is preferable, roughness is lower, its wedge angle is θ, as shown in Figure 4.
Can make the LGP of different shape with above-mentioned processing method, when operation, only need to change difform tool, promptly can be made into the corresponding with it LGP in angle of inclination.
With reference to Fig. 5, a selected triangle tool 15, the processing method of employing LGP of the present invention can be made LGP base material 16 the triangle LGP 26 (referring to Fig. 6) with triangle tool 15 correspondences, and the two angle of inclination is identical.
If will make plate shaped LGP, can need not tool, directly the LGP base material directly is adhesive on the platform, surface roughness is lower, the plate shaped LGP of excellent optical performance through making behind grinding and the polishing process.Its technological parameter can be with reference to the parameter of above-mentioned wedge shape LGP.
Claims (10)
1. the processing method of a LGP, it comprises the steps:
Prepare a platform;
Prepare a tool and gluing this tool and platform, this tool has a predetermined angular with respect to the surface of the platform of gluing described tool;
Gluing LGP base material to be processed is to this surface of tool;
This LGP base material is ground with the platform direction that is parallel to gluing described tool;
LGP base material after grinding is polished, promptly make LGP.
2. the processing method of LGP according to claim 1 is characterized in that grinding pressure is 150g/cm in the process of lapping
2, rotating speed is 70RPM.
3. as the processing method of the LGP as described in the claim 2, stop to grind when it is characterized in that being ground to this LGP base material than the thick 20 μ m of desired thickness.
4. the processing method of LGP according to claim 1 is characterized in that grinding the back and cleans the LGP base material with the alundum (Al material.
5. the processing method of LGP according to claim 1 is characterized in that polish pressure is 120g/cm in the polishing process
2, rotating speed is 40RPM.
6. the processing method of LGP according to claim 1 is characterized in that polishing the back and cleans LGP with the germanium dioxide material.
7. the processing method of LGP according to claim 1 is characterized in that this platform and tool clean before gluing.
8. the processing method of LGP according to claim 1 is characterized in that this platform is a glass platform.
9. the processing method of LGP according to claim 1 is characterized in that this tool is an acutance with respect to the predetermined angular on the surface of the platform of gluing this tool, is used for processing wedged or the triangle LGP.
10. the processing method of LGP according to claim 1 is characterized in that described tool is 0 degree with respect to the predetermined angular on the surface of the platform of gluing this tool, is used to process plate shaped LGP.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021349479A CN100333875C (en) | 2002-10-11 | 2002-10-11 | Light conducting board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021349479A CN100333875C (en) | 2002-10-11 | 2002-10-11 | Light conducting board processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1488469A CN1488469A (en) | 2004-04-14 |
| CN100333875C true CN100333875C (en) | 2007-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021349479A Expired - Fee Related CN100333875C (en) | 2002-10-11 | 2002-10-11 | Light conducting board processing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN100333875C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104536270A (en) * | 2014-12-31 | 2015-04-22 | 上海现代先进超精密制造中心有限公司 | Photo-etching machine wedge plate oblique plane processing method and clamp tool thereof |
| CN114454658A (en) * | 2022-02-28 | 2022-05-10 | 蓝思科技（长沙）有限公司 | Single-color gradient film, preparation method thereof, cover plate, device and application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1123728A (en) * | 1994-12-01 | 1996-06-05 | 詹华新 | Continuously grinding method for thin stone plate |
| US6050885A (en) * | 1997-05-07 | 2000-04-18 | Peter Wolters Werkzeugmaschinen Gmbh | Device for the chemical-mechanical polishing of an object, in particular a semiconductor wafer |
| CN1372154A (en) * | 2001-02-27 | 2002-10-02 | 统晏科技股份有限公司 | Method for amking quartz substrate of optical coupling device |
-
2002
- 2002-10-11 CN CNB021349479A patent/CN100333875C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1123728A (en) * | 1994-12-01 | 1996-06-05 | 詹华新 | Continuously grinding method for thin stone plate |
| US6050885A (en) * | 1997-05-07 | 2000-04-18 | Peter Wolters Werkzeugmaschinen Gmbh | Device for the chemical-mechanical polishing of an object, in particular a semiconductor wafer |
| CN1372154A (en) * | 2001-02-27 | 2002-10-02 | 统晏科技股份有限公司 | Method for amking quartz substrate of optical coupling device |
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| Publication number | Publication date |
|---|---|
| CN1488469A (en) | 2004-04-14 |
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