CN101780693A - Method for cutting base plate structure - Google Patents
Method for cutting base plate structure Download PDFInfo
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- CN101780693A CN101780693A CN200910002867A CN200910002867A CN101780693A CN 101780693 A CN101780693 A CN 101780693A CN 200910002867 A CN200910002867 A CN 200910002867A CN 200910002867 A CN200910002867 A CN 200910002867A CN 101780693 A CN101780693 A CN 101780693A
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Abstract
The invention provides a method for cutting a base plate structure. The base plate structure is provided with a first surface and a second surface, wherein the second surface is opposite to the first surface. The method comprises the following steps of: firstly, carrying out a first cutting step on the first surface of the base plate structure by a cutting tool to form a first cutting crack; then carrying out a second cutting step on the second surface of the base plate structure by the cutting tool to form a second cutting crack, wherein the first cutting crack is butted against the second cutting crack, and the base plate structure is cut off; and finally carrying out edge grinding processing on the cutting surface of the cut base plate structure, wherein the cutting tool can be a tooth cutter or a toothless cutter. The invention can simplify the process, reduce the bending condition of the base plate structure during cutting and ensure the cutting quality of the base plate structure.
Description
Technical field
The present invention particularly relates to a kind of cutting method that reduces cutter or break bar restriction and improve the board structure of substrate deflection degree about a kind of cutting method of board structure.
Background technology
At present, substrate or base material can be in order to make various electronic products, and for example transparent substrates such as glass substrate can be in order to make display floater.With large-sized slim liquid crystal display (Liquid Crystal Display, LCD) substrate is an example, it can cut into a plurality of display units.
See also Fig. 1, it shows the method flow diagram of method for dividing substrate of the prior art.Substrate for example is a display base plate, form by first substrate and second substrate, and substrate have first surface and with the first surface opposing second surface, first surface is positioned at first substrate, second surface is positioned at second substrate.When cutting substrate, at first, on the first surface of substrate, utilize anodontia break bar such as wolfram steel break bar or the diamond writing of indictments, appeals, etc. to wait and cut setting-out, use and form the first cutting slight crack (step S1) on the first surface that makes substrate.Then, use rubber pressurization sheet, make the first cutting slight crack of substrate first surface deepen (step S2) in the face of second surface comes first substrate of substrate is carried out the sliver action.Then, form the second cutting slight crack on the second surface of substrate, wherein the second cutting slight crack is in alignment with the first cutting slight crack (step S3).Then, re-use rubber pressurization sheet in the face of first surface comes second substrate of substrate is carried out the sliver action, the second cutting slight crack of second surface is deepened, the final first cutting slight crack docks with the second cutting slight crack, thereby reaches substrate cut effect (step S4).In summary, above step is and cuts-split-process of Qie-split.
In the practical application, the size of glass substrate intensity is influenced by the flatness at glass substrate edge, adopts different cuttves or break bar to cut, and there is evident difference in its intensity.In the prior art, make the substrate of cutting after splitting reach deflection degree preferably as need, then must use anodontia break bar, otherwise, the step of carrying out brisement after cutting more then is easy to damaged substrate, thereby the restriction of substrate cut technology of the prior art tool setting or break bar is too big, requires too highly, and cut-split-Qie-step split is relatively also more loaded down with trivial details.And in the substrate cut process, sliver and cutting position should be consistent as far as possible, otherwise might produce the chimb salient angle, the broken and low problem of strength of glass.
Summary of the invention
The object of the present invention is to provide a kind of cutting method of board structure, the cutting method of board structure of the present invention can be simplified flow process, reduces the deflection situation of board structure when cutting, guarantees the board structure cut quality, and then improves processing yield.
The invention provides a kind of cutting method of board structure, this board structure have first surface and with this first surface opposing second surface, it is characterized in that this cutting method comprises the steps: at first, utilize cutting tool that this first surface of this board structure is carried out first cutting step, to form the first cutting slight crack; Then, utilize this cutting tool that this second surface of this board structure is carried out second cutting step, to form the second cutting slight crack, wherein this first cutting slight crack docks with this second cutting slight crack, and board structure disconnects; At last, the cut surface to this board structure after the cutting carries out the edging processing.
As optional technical scheme, this cutting tool is for having serrated knife or break bar.
As optional technical scheme, this cutting tool is no serrated knife or break bar.
As optional technical scheme, this cutting method comprises the steps: that more behind this first cutting step, this board structure overturns.
As optional technical scheme, this first surface of this board structure has first cut mark, and this second surface has second cut mark, and this first cut mark and this second cut mark are oppositely arranged.
As optional technical scheme, this cutting method more comprises the steps: to utilize next first cut mark in alignment with this first surface of this cutting tool, to cut; And utilize next second cut mark of this cutting tool in alignment with this second surface, to cut, wherein this first cut mark and this second cut mark connect.
As optional technical scheme, this board structure is a display base plate.
As optional technical scheme, this board structure is made up of first substrate and second substrate.
As optional technical scheme, this first substrate is a thin-film transistor array base-plate.
As optional technical scheme, this second substrate is a colored filter substrate.
Can be about the advantages and spirit of the present invention by following detailed Description Of The Invention and appended graphic being further understood.
Description of drawings
Fig. 1 shows the flow chart of method for dividing substrate of the prior art;
Fig. 2 shows the method flow diagram according to the cutting method of board structure of the present invention;
Fig. 3 A and 3B show the schematic diagram according to the cutting method of board structure of the present invention.
The specific embodiment
Please refer to Fig. 2 and Fig. 3 A and 3B, Fig. 2 shows the method flow diagram according to the cutting method of board structure of the present invention, and Fig. 3 A and 3B show the schematic diagram according to the cutting method of board structure of the present invention.The cutting method of the board structure of present embodiment can be in order to cut board structure 100, board structure 100 can be brittle base (for example glass substrate or wafer substrate) or flexible base plate (for example plastic base), and its thickness can be about 0.3mm or 0.4mm.With board structure 100 is that display base plate illustrates, and display base plate can be cut into a plurality of display floaters, for example display panels.At this moment, board structure 100 can be made up of first substrate 110 and second substrate 120.When board structure 100 for example is liquid crystal display substrate, first substrate 110 for example is thin film transistor (TFT) (Thin Film Transistor, TFT) array base palte, second substrate 120 for example is colored filter (Color Filter, CF) substrate, certain first substrate also can be colored filter substrate, and second substrate also can be a thin-film transistor array base-plate.Board structure 100 more comprises liquid crystal layer (not illustrating), and it is formed between first substrate 110 and second substrate 120.
Shown in Fig. 3 A and 3B, the board structure 100 of present embodiment comprises first surface 111 and second surface 121, and wherein first surface 111 is oppositely arranged with second surface 121.With the display substrate structure is example, and first surface 111 is sides that are formed at first substrate 110, and second surface 121 is sides that are formed at second substrate 120.
As shown in Figure 2, when carrying out the method for dividing substrate of present embodiment, at first, as step S10, utilize cutting tool that the first surface 111 of board structure 100 is carried out first cutting step, to form the first cutting slight crack (or cutting seam) 113 on first surface 111, as shown in Figure 3A.Cutting tool 101 can be anodontia cutter or break bar, also can not influence the effect after the board structure cutting is finished in the present embodiment for serrated knife or break bar are arranged.Cutting tool 101 for example is slitter wheel, wolfram steel break bar, the diamond writing of indictments, appeals, etc., laser or high-pressure water knife etc.Then, as step S11, utilize the second surface 121 of 101 pairs of board structures 100 of cutting tool to carry out second cutting step, to form the second cutting slight crack (or cutting seam) 123 on second surface 121, wherein the first cutting slight crack 113 docks with this second cutting slight crack 123, and board structure 100 disconnects.Above step is the process of Qie-Qie-mill.In addition, when carrying out second cutting step, can first substrate overturn structure 100, with contraposition cutting tool 101 in second surface 121 cut places, shown in Fig. 3 B.Then, utilize cutting tool 101 to come second surface 121 is cut, thereby form the second cutting slight crack 123.At last, as step S12, cut surface to the board structure 100 after the cutting carries out the edging processing, board structure can stay the cutting vestige in cutting section after cutting, and its cutting vestige is the main cause that causes the LCD panel display unit edge strength to reduce, thereby can use cerium oxide abrasive liquid for example etc. that the board structure 100 after the cutting is carried out edge grinding, its edge leveling reaching the purpose of lifting glass intensity, and then can be reduced the restriction to break bar.
In addition, for making cutting more accurate, the position that can need cut on the first surface 111 of board structure 100 is provided with first cut mark 112, and the position that need cut on the second surface 121 is provided with second cut mark 122, and wherein first cut mark 112 is relative with second cut mark 122.First cut mark 112 is the relative both sides that are formed at board structure 100 respectively with second cut mark 122, in order to make the mark of cutting contraposition.Carrying out first cutting step when being S10, can utilize first cut mark 112 of cutting tool 101 so, cutting, thereby form first line of cut 113 in alignment with first surface 111.Same, carrying out second cutting step when being S11, utilize second cut mark 123 of cutting tool 101 in alignment with second surface 121, to cut, wherein first cut mark 113 is relative with second cut mark 123.
By the embodiment of the invention described above as can be known; the cutting method of board structure of the present invention is applicable to the two-sided cutting process of board structure; simplified the cutting flow process of board structure; and the deflection situation of minimizing board structure after cutting; guarantee the substrate cut quality; and then the raising processing yield, and reduce device dependence, reduce cost.
By the detailed description of the above specific embodiment, be to wish to know more to describe feature of the present invention and spirit, and be not to come claim scope of the present invention is limited with the above-mentioned disclosed specific embodiment.On the contrary, its objective is that hope can contain in being arranged in of various changes and the tool equality claim scope of the present invention.Therefore, claim scope of the present invention should be done the broadest explanation according to above-mentioned explanation, contains the arrangement of all possible change and tool equality to cause it.
Claims (10)
1. the cutting method of a board structure, this board structure have first surface and with this first surface opposing second surface, it is characterized in that this cutting method comprises the steps:
Utilize cutting tool that this first surface of this board structure is carried out first cutting step, to form the first cutting slight crack;
Utilize this cutting tool that this second surface of this board structure is carried out second cutting step, to form the second cutting slight crack, wherein this first cutting slight crack docks with this second cutting slight crack, and board structure disconnects; And
Cut surface to this board structure after the cutting carries out the edging processing.
2. cutting method according to claim 1 is characterized in that this cutting tool is for having serrated knife or break bar.
3. cutting method according to claim 1 is characterized in that this cutting tool is no serrated knife or break bar.
4. cutting method according to claim 1 is characterized in that this cutting method more comprises the steps:
Behind this first cutting step, this board structure overturns.
5. cutting method according to claim 1 is characterized in that this first surface of this board structure has first cut mark, and this second surface has second cut mark, and this first cut mark and this second cut mark are oppositely arranged.
6. cutting method according to claim 5 is characterized in that this cutting method also comprises the steps:
Utilize next this first cut mark of this cutting tool, to cut in alignment with this first surface; And
Utilize next this second cut mark of this cutting tool, to cut in alignment with this second surface.
7. cutting method according to claim 1 is characterized in that this board structure is a display base plate.
8. cutting method according to claim 1 is characterized in that this board structure is made up of first substrate and second substrate.
9. cutting method according to claim 8 is characterized in that this first substrate is a thin-film transistor array base-plate.
10. cutting method according to claim 9 is characterized in that this second substrate is a colored filter substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910002867A CN101780693A (en) | 2009-01-20 | 2009-01-20 | Method for cutting base plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910002867A CN101780693A (en) | 2009-01-20 | 2009-01-20 | Method for cutting base plate structure |
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| CN101780693A true CN101780693A (en) | 2010-07-21 |
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| CN200910002867A Pending CN101780693A (en) | 2009-01-20 | 2009-01-20 | Method for cutting base plate structure |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103085176A (en) * | 2011-11-03 | 2013-05-08 | 奇景光电股份有限公司 | Wafer cutting method |
| CN103341692A (en) * | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | Method for cutting irregular figure substrate and display device |
| WO2014063383A1 (en) * | 2012-10-24 | 2014-05-01 | 深圳市华星光电技术有限公司 | Substrate and cut-cracking method thereof |
| CN105093610A (en) * | 2015-06-29 | 2015-11-25 | 深圳市华星光电技术有限公司 | Cutting method and cutting device for liquid crystal display panels |
| CN107092047A (en) * | 2017-06-22 | 2017-08-25 | 深圳市楠轩光电科技有限公司 | A kind of optical filter cutting method |
| CN107942566A (en) * | 2018-01-04 | 2018-04-20 | 京东方科技集团股份有限公司 | Method for dividing substrate |
| CN114180822A (en) * | 2021-12-08 | 2022-03-15 | 华天慧创科技（西安）有限公司 | Cutting method of wafer-level stacked structure optical glass |
-
2009
- 2009-01-20 CN CN200910002867A patent/CN101780693A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103085176A (en) * | 2011-11-03 | 2013-05-08 | 奇景光电股份有限公司 | Wafer cutting method |
| CN103085176B (en) * | 2011-11-03 | 2015-03-25 | 奇景光电股份有限公司 | Wafer cutting method |
| WO2014063383A1 (en) * | 2012-10-24 | 2014-05-01 | 深圳市华星光电技术有限公司 | Substrate and cut-cracking method thereof |
| CN103341692A (en) * | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | Method for cutting irregular figure substrate and display device |
| US9416041B2 (en) | 2013-06-26 | 2016-08-16 | Beijing Boe Display Technology Co., Ltd. | Method for cutting substrate of irregular pattern and display device |
| US10414683B2 (en) | 2013-06-26 | 2019-09-17 | Boe Technology Group Co., Ltd. | Method for cutting substrate of irregular pattern and display device |
| CN105093610A (en) * | 2015-06-29 | 2015-11-25 | 深圳市华星光电技术有限公司 | Cutting method and cutting device for liquid crystal display panels |
| CN105093610B (en) * | 2015-06-29 | 2018-06-15 | 深圳市华星光电技术有限公司 | The cutting method and cutter device of LCD panel |
| CN107092047A (en) * | 2017-06-22 | 2017-08-25 | 深圳市楠轩光电科技有限公司 | A kind of optical filter cutting method |
| CN107942566A (en) * | 2018-01-04 | 2018-04-20 | 京东方科技集团股份有限公司 | Method for dividing substrate |
| CN114180822A (en) * | 2021-12-08 | 2022-03-15 | 华天慧创科技（西安）有限公司 | Cutting method of wafer-level stacked structure optical glass |
| CN114180822B (en) * | 2021-12-08 | 2024-03-12 | 华天慧创科技（西安）有限公司 | Cutting method of wafer-level stacked structure optical glass |
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Application publication date: 20100721 |