CL2008001366A1 - Sistema de manejo termico que contiene:una carcasa para alojar componentes electronicos,la envolvente sellada de un ambiente externo,un armazon de tarjetas alojado dentro de la envolvente,al menos una tarjeta de dispositivo electronico instalada en el armazon de tarjetas y al menos un deflector;y metodo asociado. - Google Patents
Sistema de manejo termico que contiene:una carcasa para alojar componentes electronicos,la envolvente sellada de un ambiente externo,un armazon de tarjetas alojado dentro de la envolvente,al menos una tarjeta de dispositivo electronico instalada en el armazon de tarjetas y al menos un deflector;y metodo asociado.Info
- Publication number
- CL2008001366A1 CL2008001366A1 CL2008001366A CL2008001366A CL2008001366A1 CL 2008001366 A1 CL2008001366 A1 CL 2008001366A1 CL 2008001366 A CL2008001366 A CL 2008001366A CL 2008001366 A CL2008001366 A CL 2008001366A CL 2008001366 A1 CL2008001366 A1 CL 2008001366A1
- Authority
- CL
- Chile
- Prior art keywords
- enclosure
- card cage
- card
- management system
- electronic components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/025—Cabinets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/03—Power distribution arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/206—Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Sistema de manejo térmico para componentes electrónicos en una envolvente cerrada que comprende una envolvente para alojar componentes electrónicos, además de una tarjeta de dispositivo y un deflector de flujo de aire; y una envolvente, un aparato para enfriar y un método para manejar energía térmica.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/746,199 US20080278912A1 (en) | 2007-05-09 | 2007-05-09 | Thermal management systems and methods for electronic components in a sealed enclosure |
Publications (1)
Publication Number | Publication Date |
---|---|
CL2008001366A1 true CL2008001366A1 (es) | 2009-01-09 |
Family
ID=39771420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CL2008001366A CL2008001366A1 (es) | 2007-05-09 | 2008-05-09 | Sistema de manejo termico que contiene:una carcasa para alojar componentes electronicos,la envolvente sellada de un ambiente externo,un armazon de tarjetas alojado dentro de la envolvente,al menos una tarjeta de dispositivo electronico instalada en el armazon de tarjetas y al menos un deflector;y metodo asociado. |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080278912A1 (es) |
AR (1) | AR066470A1 (es) |
CL (1) | CL2008001366A1 (es) |
TW (1) | TW200850138A (es) |
WO (1) | WO2008141170A1 (es) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100302728A1 (en) * | 2007-11-28 | 2010-12-02 | Voltwerk Electronics Gmbh | Chassis for inverter |
US8031470B2 (en) * | 2008-06-11 | 2011-10-04 | Adc Telecommunications, Inc. | Systems and methods for thermal management |
US8019396B2 (en) * | 2008-06-11 | 2011-09-13 | Adc Telecommunications, Inc. | Pull-out shelf for use in a confined space formed in a structure |
US8254850B2 (en) * | 2008-06-11 | 2012-08-28 | Adc Telecommunications, Inc. | Communication module component assemblies |
US7724521B2 (en) * | 2008-06-11 | 2010-05-25 | Adc Telecommunications, Inc. | Systems and methods for Venturi fan-assisted cooling |
US7812254B2 (en) * | 2008-06-11 | 2010-10-12 | Adc Telecommunications, Inc. | Solar shields |
US8141965B2 (en) * | 2008-06-11 | 2012-03-27 | Adc Telecommunications, Inc. | L-shaped door with three-surface seal for endplates |
US8549741B2 (en) * | 2008-06-11 | 2013-10-08 | Adc Telecommunications, Inc. | Suspension method for compliant thermal contact of electronics modules |
US20110162822A1 (en) * | 2008-09-08 | 2011-07-07 | Hewlett-Packard Development Company, L.P. | Cooling System |
US7893365B2 (en) * | 2008-11-10 | 2011-02-22 | Adc Telecommunications, Inc. | Weather resistant variable enclosure frame |
US8068338B1 (en) * | 2009-03-24 | 2011-11-29 | Qlogic, Corporation | Network device with baffle for redirecting cooling air and associated methods |
US9442540B2 (en) * | 2009-08-28 | 2016-09-13 | Advanced Green Computing Machines-Ip, Limited | High density multi node computer with integrated shared resources |
US8214086B2 (en) | 2010-04-01 | 2012-07-03 | Adc Telecommunications, Inc. | Systems and methods for retractable fan cooling of electronic enclosures |
US20120134114A1 (en) * | 2010-07-22 | 2012-05-31 | Nick Kamenszky | Thermal management of environmentally-sealed electronics enclosure |
TWI392997B (zh) * | 2010-11-05 | 2013-04-11 | Inventec Corp | 伺服器之冷卻循環系統 |
US8687363B2 (en) * | 2012-05-01 | 2014-04-01 | General Electric Company | Enclosure with duct mounted electronic components |
US9167730B2 (en) * | 2012-05-07 | 2015-10-20 | Abb Technology Oy | Electronics compartment |
US20130294026A1 (en) * | 2012-05-07 | 2013-11-07 | Abb Oy | Electronics compartment |
US9333599B2 (en) * | 2013-12-20 | 2016-05-10 | General Electric Company | Electronics chassis and method of fabricating the same |
US10477724B2 (en) * | 2015-03-09 | 2019-11-12 | Datalogic IP Tech, S.r.l. | Efficient heat exchange systems and methods |
US10136556B2 (en) | 2016-02-24 | 2018-11-20 | Thermal Corp. | Electronics rack with selective engagement of heat sink |
US10349557B2 (en) | 2016-02-24 | 2019-07-09 | Thermal Corp. | Electronics rack with compliant heat pipe |
EP3403148A1 (de) * | 2016-03-24 | 2018-11-21 | Siemens Aktiengesellschaft | Verfahren zur steuerung, steuersystem und anlage |
US10291698B2 (en) * | 2017-07-14 | 2019-05-14 | Amazon Technologies, Inc. | Antenna structures and isolation chambers of a multi-radio, multi-channel (MRMC) mesh network device |
US10615514B2 (en) | 2017-07-14 | 2020-04-07 | Amazon Technologies, Inc. | Antenna structures of a multi-radio, multi-channel (MRMC) mesh network device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD212871A1 (de) * | 1982-12-21 | 1984-08-22 | Elektroprojekt Anlagenbau Veb | Anordnung zur waermeabfuehrung aus geschlossenen gehaeusen |
US6082441A (en) * | 1997-06-13 | 2000-07-04 | Knuerr-Mechanik Fuer Die Elektronik Aktiengellschaft | Cabinet for electric and electronic systems |
US6088225A (en) * | 1998-03-17 | 2000-07-11 | Northern Telecom Limited | Cabinet with enhanced convection cooling |
DE19812117A1 (de) * | 1998-03-19 | 1999-09-23 | Knuerr Mechanik Ag | Geräteschrank |
JP3408424B2 (ja) * | 1998-07-28 | 2003-05-19 | 日本電気株式会社 | 電子機器の冷却構造 |
US6127663A (en) * | 1998-10-09 | 2000-10-03 | Ericsson Inc. | Electronics cabinet cooling system |
US6164369A (en) * | 1999-07-13 | 2000-12-26 | Lucent Technologies Inc. | Door mounted heat exchanger for outdoor equipment enclosure |
US6781831B1 (en) * | 2002-02-14 | 2004-08-24 | Mercury Computer Systems, Inc. | Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers |
US6877551B2 (en) * | 2002-07-11 | 2005-04-12 | Avaya Technology Corp. | Systems and methods for weatherproof cabinets with variably cooled compartments |
US6854275B2 (en) * | 2002-08-08 | 2005-02-15 | International Business Machines Corporation | Method for cooling automated storage library media using thermoelectric cooler |
US6788535B2 (en) * | 2002-12-12 | 2004-09-07 | 3M Innovative Properties Company | Outdoor electronic equipment cabinet |
US7100385B2 (en) * | 2004-08-03 | 2006-09-05 | Lucent Technologies Inc. | Thermal management system for electrical enclosures |
DE202004016492U1 (de) * | 2004-10-25 | 2004-12-30 | Knürr AG | Geräte- und Netzwerkschrank |
US7212403B2 (en) * | 2004-10-25 | 2007-05-01 | Rocky Research | Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection |
US7245485B1 (en) * | 2004-11-15 | 2007-07-17 | Utstarcom, Inc. | Electronics cabinet with internal air-to-air heat exchanger |
-
2007
- 2007-05-09 US US11/746,199 patent/US20080278912A1/en not_active Abandoned
-
2008
- 2008-05-07 AR ARP080101929A patent/AR066470A1/es unknown
- 2008-05-08 TW TW097116951A patent/TW200850138A/zh unknown
- 2008-05-09 WO PCT/US2008/063233 patent/WO2008141170A1/en active Application Filing
- 2008-05-09 CL CL2008001366A patent/CL2008001366A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
WO2008141170A1 (en) | 2008-11-20 |
US20080278912A1 (en) | 2008-11-13 |
AR066470A1 (es) | 2009-08-19 |
TW200850138A (en) | 2008-12-16 |
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