WO2012136210A3 - Cooling system for a power module - Google Patents

Cooling system for a power module Download PDF

Info

Publication number
WO2012136210A3
WO2012136210A3 PCT/DK2012/000032 DK2012000032W WO2012136210A3 WO 2012136210 A3 WO2012136210 A3 WO 2012136210A3 DK 2012000032 W DK2012000032 W DK 2012000032W WO 2012136210 A3 WO2012136210 A3 WO 2012136210A3
Authority
WO
WIPO (PCT)
Prior art keywords
flow path
pressure
power module
cooling system
space
Prior art date
Application number
PCT/DK2012/000032
Other languages
French (fr)
Other versions
WO2012136210A2 (en
Inventor
Klaus Olesen
Jørgen HOLST
Georg FÖSEL
Peter Brandt
Peter Jensen
Steen Hornsleth
Carsten Rothmann
Original Assignee
Danfoss Drives A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Drives A/S filed Critical Danfoss Drives A/S
Priority to US14/007,801 priority Critical patent/US20140076522A1/en
Priority to CN201280016278.7A priority patent/CN103460828B/en
Priority to EP12720778.5A priority patent/EP2695504A2/en
Priority to JP2014502992A priority patent/JP5836476B2/en
Publication of WO2012136210A2 publication Critical patent/WO2012136210A2/en
Publication of WO2012136210A3 publication Critical patent/WO2012136210A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cooling system for a power module (or some other power electronics device) is described, the cooling system having a closed flow path for circulating a cooling fluid, the flow path having a pressure that is reduced to below atmospheric pressure. The cooling fluid is circulated along the flow path to provide cooling of the power module. The flow path is delimited from the exterior environment by a space provided between the flow path and the exterior environment, said space being sealed off from the cooling flow path, and said space being sealed off towards the exterior environment. The flow path has a pressure below atmospheric pressure and the space between the flow path and the exterior environment is evacuated and typically has a pressure lower than the pressure in the flow path.
PCT/DK2012/000032 2011-04-04 2012-04-02 Cooling system for a power module WO2012136210A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US14/007,801 US20140076522A1 (en) 2011-04-04 2012-04-02 Cooling system for a power module
CN201280016278.7A CN103460828B (en) 2011-04-04 2012-04-02 For the cooling system of power model
EP12720778.5A EP2695504A2 (en) 2011-04-04 2012-04-02 Cooling system for a power module
JP2014502992A JP5836476B2 (en) 2011-04-04 2012-04-02 Cooling system for power module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DKPA201100253 2011-04-04
DKPA201100253 2011-04-04
US201161482398P 2011-05-04 2011-05-04
US61/482,398 2011-05-04

Publications (2)

Publication Number Publication Date
WO2012136210A2 WO2012136210A2 (en) 2012-10-11
WO2012136210A3 true WO2012136210A3 (en) 2012-11-29

Family

ID=46969612

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK2012/000032 WO2012136210A2 (en) 2011-04-04 2012-04-02 Cooling system for a power module

Country Status (5)

Country Link
US (1) US20140076522A1 (en)
EP (1) EP2695504A2 (en)
JP (1) JP5836476B2 (en)
CN (1) CN103460828B (en)
WO (1) WO2012136210A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2653386B1 (en) * 2012-04-17 2014-12-10 Airbus Operations GmbH Heat dissipation of power electronics of a cooling unit
EP2719985B1 (en) * 2012-10-09 2015-08-26 Danfoss Silicon Power GmbH A flow distribution module with a patterned cover plate
ITBO20130537A1 (en) * 2013-09-30 2015-03-31 Elenos Srl PERFECT DEVICE FOR COOLING OF ELECTRIC AND ELECTRONIC POWER COMPONENTS
DE202014106063U1 (en) * 2014-12-16 2015-02-12 Danfoss Silicon Power Gmbh Cooling pan, radiator and power module assembly
US10638648B2 (en) 2016-04-28 2020-04-28 Ge Energy Power Conversion Technology Ltd. Cooling system with pressure regulation
US9894815B1 (en) 2016-08-08 2018-02-13 General Electric Company Heat removal assembly for use with a power converter
US10453777B2 (en) * 2018-01-30 2019-10-22 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies with cio bonding layers and double sided cooling, and vehicles incorporating the same
JP2019160831A (en) * 2018-03-07 2019-09-19 富士通株式会社 Cooling plate and information processing apparatus
JP2020044865A (en) * 2018-09-14 2020-03-26 三菱重工サーマルシステムズ株式会社 Heating medium heater and vehicle air conditioner

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5871042A (en) * 1997-11-04 1999-02-16 Teradyne, Inc. Liquid cooling apparatus for use with electronic equipment
EP1528619A2 (en) * 2003-10-31 2005-05-04 Raytheon Company Method and apparatus for cooling heat-generating structure
EP1796447A2 (en) * 2005-11-30 2007-06-13 Raython Company System and method for electronic chassis and rack mounted electronics with an integrated subambient cooling system
WO2009039057A1 (en) * 2007-09-21 2009-03-26 Raytheon Company Topping cycle for a sub-ambient cooling system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0534373Y2 (en) * 1987-02-23 1993-08-31
JPH0640571U (en) * 1992-11-06 1994-05-31 石川島播磨重工業株式会社 Vacuum flange joint
JPH10122718A (en) * 1996-10-15 1998-05-15 Tlv Co Ltd Rotary vaporizing cooler
JP2001298293A (en) * 2000-04-13 2001-10-26 Matsushita Refrig Co Ltd Cooling device of integrated circuit
JP2005325973A (en) * 2004-05-17 2005-11-24 Sigma Meltec Ltd Sealing structure for processing chamber device
JP4126029B2 (en) * 2004-05-19 2008-07-30 富士通株式会社 High frequency circuit cooling device
US20070119572A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
JP4620617B2 (en) * 2006-03-17 2011-01-26 三菱電機株式会社 Directly cooled power semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5871042A (en) * 1997-11-04 1999-02-16 Teradyne, Inc. Liquid cooling apparatus for use with electronic equipment
EP1528619A2 (en) * 2003-10-31 2005-05-04 Raytheon Company Method and apparatus for cooling heat-generating structure
EP1796447A2 (en) * 2005-11-30 2007-06-13 Raython Company System and method for electronic chassis and rack mounted electronics with an integrated subambient cooling system
WO2009039057A1 (en) * 2007-09-21 2009-03-26 Raytheon Company Topping cycle for a sub-ambient cooling system

Also Published As

Publication number Publication date
WO2012136210A2 (en) 2012-10-11
JP5836476B2 (en) 2015-12-24
US20140076522A1 (en) 2014-03-20
CN103460828B (en) 2016-03-23
JP2014515816A (en) 2014-07-03
CN103460828A (en) 2013-12-18
EP2695504A2 (en) 2014-02-12

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