JP2001298293A - Cooling device of integrated circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent degradation in reliability of an electronic apparatus, related to a cooling device of an integrated circuit used for the electronic apparatus, by preventing dewing at the integrated circuit or other low-temperature member even when the integrated circuit is cooled below a room temperature. SOLUTION: There are provided an electronic apparatus comprising an integrated circuit and the like, a cooling unit 8 for cooling the integrated circuit 10, and a heat-insulating material 21 for enclosing the integrated circuit 10 and a low-temperature part of the cooling unit. Thus, unstable calculation due to overheat of the integrated circuit 10 and dewing when the integrated circuit are cooled below a room temperature is avoided, preventing degradation of reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an integrated circuit used in electronic equipment.

[0002]

2. Description of the Related Art With respect to a conventional cooling device for an integrated circuit,
The one described in JP-A-5-299548 is known.

A conventional cooling device for an integrated circuit will be described below with reference to the drawings.

FIG. 8 shows a configuration of a conventional cooling device for an integrated circuit. In FIG. 8, reference numeral 1 denotes a cooling device for an integrated circuit,
It comprises a heat exchanger 4, a blower 5, a control valve 6, a housing 7, and a refrigerator 8, which are connected by a blower tube 3 with the cooling medium 2 sealed therein.

[0005] Inside the housing 7, an integrated circuit 10 soldered to wiring (not shown) on the insulating substrate 9 is accommodated, and arithmetic signals can be input / output from the integrated circuit 10 to the outside of the housing 7. It is connected to the. Inside the heat exchanger 4, a cooling coil 8a of the refrigerator 8 is housed.

The operation of the cooling device 1 for an integrated circuit configured as described above will be described below.

[0007] The cooling medium 2 is cooled to a low temperature in the heat exchanger 4 by the cooling coil 8 a of the refrigerator 8. The cooled cooling medium 2 is blown into the housing 7 by adjusting the flow rate from the blower pipe 3 by the blower 5 and the control valve 6, and further blown into the integrated circuit 10.
Squirted nearby. The jetted cooling medium 2 absorbs and cools the heat of the integrated circuit 10 that has generated heat by performing the operation,
It is returned to the heat exchanger 4.

[0008]

However, in the above-mentioned conventional configuration, when the integrated circuit 10 is cooled to a temperature lower than room temperature, there is a possibility that dew may be formed on the low-temperature member and the reliability of the electronic device may be reduced.

An object of the present invention is to solve the conventional problem, and an object of the present invention is to provide a cooling device for an integrated circuit in which condensation does not occur on a low-temperature member even when the integrated circuit is cooled to room temperature or lower.

Further, in the above-mentioned conventional configuration, since the integrated circuit 10 is cooled by convective heat transfer by the gaseous cooling medium 2, the cooling efficiency is reduced due to a small heat transfer coefficient, and the size of the cooling fins is increased. Could be.

Another object of the present invention is to provide a small and efficient cooling device for an integrated circuit, which cools an integrated circuit by utilizing boiling heat transfer in an evaporator of a vapor compression refrigeration cycle. With the goal.

Further, in the above-described conventional configuration, since the heat generation area of the integrated circuit 10 is small, there is a possibility that the cooling capacity becomes insufficient or the efficiency becomes poor when the calculation load increases and the heat generation increases.

Another object of the present invention is to use a carbon dioxide refrigerant as a refrigerant in a vapor compression refrigeration cycle and to efficiently cool the refrigerant with a small evaporator having a significantly reduced pipe diameter.

Further, in the above-mentioned conventional configuration, in order to cool the integrated circuit 10 to a very low temperature range and improve the operation speed,
Since the cooling is performed using a cooling liquid such as liquid nitrogen, the equipment becomes large, and the operation cost is high because the cooling liquid is continuously supplied.

Another object of the present invention is to cool the integrated circuit 10 to a very low temperature range without using a cooling liquid such as liquid nitrogen, and to perform maintenance-free continuous high-speed operation for a long period of time.

In the above-described conventional configuration, when the amount of the cooling medium 2 ejected in response to the increase in the amount of heat generated by the integrated circuit 10 increases, the vibration of the integrated circuit 10 increases, and the generation of signal noise caused by the vibration, etc. , There is a possibility that the reliability is reduced.

It is another object of the present invention to avoid the occurrence of signal noise due to vibration and to prevent a decrease in reliability.

[0018]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an electronic device including an integrated circuit, a cooler for cooling the integrated circuit, and a low-temperature section of the integrated circuit and the cooler. And heat insulating material surrounding the periphery of the object.

As a result, even if the integrated circuit is cooled to a room temperature or lower, the temperature of the outer wall surface of the heat insulating material can be maintained at the dew point temperature or higher, so that dew condensation can be avoided and reliability can be improved.

According to another aspect of the present invention, there is provided an electronic device comprising an integrated circuit or the like, a cooler for cooling the integrated circuit, a closed casing having a closed space containing the integrated circuit and a low-temperature portion of the cooler. Consists of

As a result, even if the integrated circuit in the closed space is cooled to room temperature or lower, only a small amount of dew condensation of the water vapor contained in the closed space occurs, thereby preventing a reduction in reliability.

In the present invention, the closed space is a vacuum.

Thus, even if the integrated circuit is cooled to a room temperature or lower, vacuum insulation is provided so that dew condensation can be avoided and reliability can be improved.

Further, according to the present invention, there is provided an integrated circuit in which a cooler forms a vapor compression refrigeration cycle including an evaporator, a condenser, a decompressor and a compressor, and the evaporator comes into contact with the integrated circuit to cool the integrated circuit. Cooling device.

Thus, the integrated circuit can be efficiently cooled by utilizing the boiling heat transfer in the evaporator of the vapor compression refrigeration cycle.

Further, the present invention is a cooling device for an integrated circuit, wherein the cooler for cooling the integrated circuit is a refrigeration cycle using carbon dioxide as a refrigerant.

Thus, by using carbon dioxide as the refrigerant of the vapor compression refrigeration cycle, it is possible to efficiently cool an integrated circuit having a small heat generating area with a small evaporator having a significantly reduced pipe diameter.

Further, the present invention is a cooling device for an integrated circuit, wherein the cooler for cooling the integrated circuit is a Stirling refrigerator.

As a result, the integrated circuit can be cooled to an extremely low temperature range without using a cooling liquid such as liquid nitrogen or the like, and long-term continuous high-speed operation can be performed without maintenance.

Further, the present invention is a cooling device for an integrated circuit, wherein the cooler for cooling the integrated circuit is a pulse tube refrigerator.

As a result, the integrated circuit can be cooled to an extremely low temperature range, maintenance-free, long-term continuous high-speed operation can be performed, and since there is no movable portion in the low temperature portion, generation of signal noise due to vibration can be avoided, and reliability can be reduced. Can be improved.

[0032]

According to the first aspect of the present invention, there is provided an electronic apparatus including an integrated circuit, a cooler for cooling the integrated circuit, and the integrated circuit. And a heat insulator surrounding the low-temperature portion of the cooler. Even if the integrated circuit is cooled to a room temperature or less, the heat insulating material causes the low-temperature portion of the integrated circuit and the cooler and the atmosphere air in the heat insulator. Since the temperature is kept low, electronic components such as integrated circuits have an effect of preventing condensation.

According to a second aspect of the present invention, there is provided an electronic apparatus including an integrated circuit, a cooler for cooling the integrated circuit, and a hermetically sealed housing containing the integrated circuit and a low-temperature portion of the cooler. And a closed casing having a space, even if the integrated circuit in the closed space is cooled to room temperature or less, only slight condensation of water vapor contained in the closed space is generated,
This has the effect of preventing a decrease in reliability.

According to a third aspect of the present invention, in the second aspect, the closed space is evacuated. Even when the integrated circuit is cooled to a room temperature or lower, the inside of the closed space remains vacuum. There is no condensation, and the outside of the closed space is also insulated by vacuum insulation, so there is no condensation. Therefore, there is an effect that the reliability of electronic components such as integrated circuits can be prevented from lowering.

[0035] According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the cooler is a vapor compression type comprising an evaporator, a condenser, a decompressor and a compressor. It forms a refrigeration cycle and cools it.Evaporators in a vapor compression refrigeration cycle can efficiently cool an integrated circuit by utilizing boiling heat transfer, increasing the operation speed and improving reliability. Have.

According to a fifth aspect of the present invention, in the fourth aspect, the cooler for cooling the integrated circuit is a refrigeration cycle using carbon dioxide as a refrigerant. A small evaporator having a significantly reduced pipe diameter has an effect of efficiently cooling an integrated circuit having a small heat generating area.

According to a sixth aspect of the present invention, in the invention according to any one of the first to third aspects, the cooler for cooling the integrated circuit is a Stirling refrigerator, and a cooling head of the Stirling refrigerator. By directly cooling the integrated circuit, the integrated circuit can be cooled to an extremely low temperature range without using a cooling liquid such as liquid nitrogen, and has an effect that maintenance-free continuous high-speed operation can be performed for a long period of time.

According to a seventh aspect of the present invention, in the invention according to any one of the first to third aspects, the cooler for cooling the integrated circuit is a pulse tube refrigerator, and the cooling head of the refrigerator is provided. In this way, the integrated circuit can be cooled directly to the ultra-low temperature range, maintenance-free, long-term continuous high-speed operation can be performed, and since there is no moving part in the low-temperature part of the refrigerator, the generation of signal noise due to vibration can be avoided, and reliability is reduced. It has the effect of being able to improve.

[0039]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a cooling device for an integrated circuit according to the present invention will be described below with reference to the drawings. The same components as those in the related art are denoted by the same reference numerals, and detailed description is omitted.

(Embodiment 1) FIG. 1 is a configuration diagram of a cooling device for an integrated circuit according to Embodiment 1 of the present invention. In FIG. 1, reference numeral 20 denotes a cooling device for an integrated circuit, and a cooling coil 8a
It comprises a refrigerator 8 for cooling the cooling water inside and a heat insulating material 21.
An integrated circuit 10 soldered to a wiring (not shown) on the insulating substrate 9 and a cooling coil 8a disposed near the integrated circuit 10 are housed inside the heat insulating material 21. The apparatus 22 is connected to input / output an arithmetic signal.

The operation of the cooling device 20 for an integrated circuit configured as described above will be described below.

The cooling water in the cooling coil 8a is circulated after being cooled to a room temperature or lower by the refrigerator 8, and after the cooling water is discharged from the refrigerator 8, it passes near the integrated circuit 10 in the heat insulating material 21. After that, it is returned to the refrigerator 8.

At this time, the integrated circuit 10 which is generating heat by performing the calculation in the heat insulating material 21 radiates heat to the cooling water and is cooled to a normal temperature or lower, and the calculation does not become unstable due to overheating or the like. Further, even when the integrated circuit 10 is cooled to a room temperature or lower, it is insulated by the heat insulating material 21 and the inside of the heat insulating material 21 is kept at a low temperature and the outside is kept at room temperature. Is cooled below the dew point temperature and does not condense.

Accordingly, unstable operations caused by overheating of the integrated circuit 10 and dew condensation when the integrated circuit 10 is cooled to room temperature or lower can be avoided, and a decrease in reliability can be prevented.

As described above, the cooling device for an integrated circuit according to the present embodiment includes an electronic device including an integrated circuit, a cooler for cooling the integrated circuit, and a low-temperature portion of the integrated circuit and the cooler. With the heat insulating material surrounding the periphery, the integrated circuit 1
It is possible to avoid instability of calculation caused by overheating of 0 and dew condensation when the integrated circuit 10 is cooled to room temperature or lower, thereby preventing a decrease in reliability.

In this embodiment, cooling water cooled by a refrigerator is used as a cooler for the integrated circuit. However, a cooler other than the main cooling method may be used as long as the integrated circuit can be cooled to room temperature or lower.

(Embodiment 2) FIG. 2 is a configuration diagram of an integrated circuit cooling device according to Embodiment 2 of the present invention. In FIG. 2, reference numeral 23 denotes a closed casing, which has a closed space 24. In the closed space 24, an integrated circuit 10 soldered to wiring (not shown) on the insulating substrate 9 and a cooling coil 8a arranged in the vicinity thereof are accommodated. The operation signal is connected to the device 22 so that the operation signal can be input and output.

The operation of the cooling device for an integrated circuit configured as described above will be described below.

The cooling water in the cooling coil 8a is circulated after being cooled by the refrigerator 8 to a temperature lower than room temperature. After the cooling water is discharged from the refrigerator 8, it passes near the integrated circuit 10 in the closed casing 23. After that, it is returned to the refrigerator 8.

At this time, the integrated circuit 10 that is generating heat by performing the operation in the heat insulating material 21 radiates heat to the cooling water and is cooled to a room temperature or lower, and the operation does not become unstable due to overheating or the like. Further, even if the condition where the integrated circuit 10 is cooled to a room temperature or less and dew condensation occurs in the sealed space 24 occurs, the dew condensation hardly occurs because the water vapor contained in the sealed space 24 is small.

Accordingly, unstable operations caused by overheating of the integrated circuit 10 and dew condensation when the integrated circuit 10 is cooled to room temperature or lower can be avoided, and a decrease in reliability can be prevented.

As described above, the cooling device for an integrated circuit according to the present embodiment includes an electronic device including an integrated circuit, a cooler for cooling the integrated circuit, and a low-temperature section of the integrated circuit and the cooler. The provision of the closed casing having the enclosed space accommodated therein prevents unstable operation caused by overheating of the integrated circuit 10 and dew condensation when the integrated circuit 10 is cooled to room temperature or lower, thereby preventing a reduction in reliability. .

In this embodiment, cooling water cooled by a refrigerator is used as a cooler for the integrated circuit. However, a cooler other than the main cooling method may be used as long as the integrated circuit can be cooled to room temperature or lower.

Further, in the present embodiment, when a desiccant is put in the closed space, or when the closed casing is sealed, dry air or other dry gas is sealed to reduce the amount of water vapor in the closed space, so that more dew condensation can be achieved. Needless to say, it will not be difficult. (Embodiment 3) FIG. 3 is a configuration diagram of an integrated circuit cooling device according to Embodiment 3 of the present invention. In FIG. 3, reference numeral 30 denotes a vacuum sealed space, in which the sealed space 24 of the cooling device for an integrated circuit according to the second embodiment is evacuated.

The operation of the cooling device for an integrated circuit configured as described above will be described below.

The cooling water in the cooling coil 8a is circulated after being cooled to below room temperature by the refrigerator 8, and after the cooling water is discharged from the refrigerator 8, it passes near the integrated circuit 10 in the closed casing 23. After that, it is returned to the refrigerator 8.

At this time, the integrated circuit 10 which is generating heat by performing the operation in the heat insulating material 21 radiates heat to the cooling water and is cooled to a room temperature or lower, and the operation does not become unstable due to overheating or the like. Further, even when the integrated circuit 10 is cooled to a room temperature or less,
There is no condensation in the closed space 30 due to the vacuum, and no condensation occurs because the outside of the closed space 30 is also insulated by the vacuum insulation.

Accordingly, unstable operations caused by overheating of the integrated circuit 10 and dew condensation when the integrated circuit 10 is cooled to room temperature or lower can be avoided, and a decrease in reliability can be prevented.

As described above, the cooling device for an integrated circuit according to the present embodiment is provided with the closed casing in which the closed space is vacuum, so that the operation of the integrated circuit 10 becomes unstable due to overheating, In the following, dew condensation at the time of cooling can be avoided, and a decrease in reliability can be prevented.

In this embodiment, cooling water cooled by a refrigerator is used as a cooler for the integrated circuit. However, a cooler other than the main cooling method may be used as long as the integrated circuit can be cooled to room temperature or lower. (Embodiment 4) FIG. 4 is a configuration diagram of an integrated circuit cooling device according to Embodiment 4 of the present invention. In FIG. 4, reference numeral 40 denotes an integrated circuit cooling device, in which a plate-type evaporator 41, a condenser 42, a decompressor 43, and a compressor 44 are connected by a pipe 45, and a refrigerant is sealed to form a vapor compression refrigeration cycle. are doing. The plate-type evaporator 41 has a refrigerant passage 46 and is arranged so as to be in contact with the integrated circuit 10.
As described above, in the present embodiment, the cooler of the integrated circuit cooling device according to the first to third embodiments is a vapor compression refrigeration cycle.

The operation of the cooling device for an integrated circuit configured as described above will be described below.

The high-pressure gas refrigerant compressed by the compressor 44 is radiated and condensed by the condenser 42 and decompressed by the decompressor 43.
It becomes a low-pressure liquid refrigerant, and the integrated circuit 1 is
The heat generated by the execution of the calculation of 0 is absorbed and evaporated. At this time, heat is absorbed by boiling heat transfer in the refrigerant passage 46 of the plate type evaporator 41, and the integrated circuit 10 can be efficiently cooled.

As described above, in the cooling device for an integrated circuit according to this embodiment, the cooler forms a vapor compression refrigeration cycle including an evaporator, a condenser, a decompressor, and a compressor. Since cooling is performed in contact with the circuit, the integrated circuit can be efficiently cooled by utilizing the boiling heat transfer in the evaporator of the vapor compression refrigeration cycle, so that the operation speed is increased and the reliability is improved. (Embodiment 5) FIG. 5 is a configuration diagram of an integrated circuit cooling device according to Embodiment 5 of the present invention. In FIG. 5, reference numeral 50 denotes a cooling device for an integrated circuit of a vapor compression refrigeration cycle using carbon dioxide as a refrigerant.
2. The decompressor 53 and the compressor 54 are connected by a pipe 55, and form a vapor compression refrigeration cycle by filling a carbon dioxide refrigerant. The plate type evaporator 51 has a refrigerant passage 56 and is arranged so as to be in contact with the integrated circuit 10. As described above, in the present embodiment, the refrigerant in the vapor compression refrigeration cycle of the cooling device for an integrated circuit according to the fourth embodiment is carbon dioxide.

The operation of the cooling device for an integrated circuit configured as described above will be described below.

The carbon dioxide in the state of the high-pressure gas compressed by the compressor 54 is radiated and condensed in the condenser 52,
3, the pressure is reduced to a low-pressure liquid state, and the plate-type evaporator 51 absorbs heat generated by the arithmetic operation of the integrated circuit 10 to evaporate.

At this time, the plate-type evaporator 51 cools the integrated circuit 10 by absorbing heat by boiling heat transfer in the refrigerant passage 56. However, the plate-type evaporator 51 has characteristics of a carbon dioxide refrigerant having a large heat transfer coefficient and a small pressure loss. By applying the corresponding plate type evaporator 51, more efficient cooling becomes possible.

For example, in an evaporator of the same size, HCFC22
Compared to refrigerant, carbon dioxide refrigerant has twice the heat transfer coefficient and one-fifth the pressure loss. That is, comparing the sizes of the evaporators with the same heat exchange performance, the carbon dioxide refrigerant can be significantly reduced in size, so that an integrated circuit having a small heat generating area can be cooled more efficiently.

As described above, the cooling device for an integrated circuit according to the present embodiment is a cooling device for an integrated circuit of a vapor compression refrigeration cycle using carbon dioxide as a refrigerant, and has a high heat transfer rate and a low pressure loss of a carbon dioxide refrigerant. Since a small evaporator to which the above characteristics are applied can be used, an integrated circuit having a small heat-generating area can be cooled more efficiently, the operation speed is increased, and the reliability is improved.

Although a plate-type evaporator is used in this embodiment, any other type of evaporator can be used as long as it can efficiently cool the integrated circuit. (Embodiment 6) FIG. 6 is a configuration diagram of an integrated circuit cooling device according to Embodiment 6 of the present invention. In FIG. 6, reference numeral 60 denotes a Stirling refrigerator, which is arranged such that a cooling head 61 contacts an integrated circuit. As described above, in the present embodiment, the cooler of the cooling device for the integrated circuit according to the first to third embodiments includes:
It is a Stirling refrigerator.

The operation of the cooling device for an integrated circuit configured as described above will be described below.

The Stirling refrigerator 60 forms a reverse Stirling cycle inside the refrigerator, and
Can be cooled from room temperature to a very low temperature range of about 4K. The cooled cooling head 61 can cool the integrated circuit 10 to a low temperature by absorbing the heat generated by performing the operation of the integrated circuit 10.

Therefore, by directly cooling the integrated circuit by the cooling head 61 of the Stirling refrigerator, the integrated circuit can be cooled to an extremely low temperature range without using a cooling liquid such as liquid nitrogen.
Maintenance-free, long-term continuous high-speed operation is possible.

As described above, the cooling device for an integrated circuit of this embodiment is such that the cooling device of the cooling device for the integrated circuit is a Stirling refrigerator, and the integrated circuit is directly cooled by the cooling head 61 of the Stirling refrigerator. By doing so, the integrated circuit can be cooled down to an ultra-low temperature range without using a cooling liquid such as liquid nitrogen or the like, and long-term continuous high-speed operation can be performed without maintenance.

In this embodiment, the Stirling refrigerator is arranged below the integrated circuit. However, any arrangement may be used as long as the cooling head contacts the integrated circuit. (Embodiment 7) FIG. 7 is a configuration diagram of an integrated circuit cooling device according to Embodiment 7 of the present invention. In FIG. 7, reference numeral 70 denotes a pulse tube refrigerator, which is disposed so that a cooling head 71 contacts an integrated circuit. As described above, in this embodiment, the cooler of the integrated circuit cooling device according to the first to third embodiments is a pulse tube refrigerator.

The operation of the cooling device for an integrated circuit configured as described above will be described below.

The pulse tube refrigerator 70 forms a pulse tube refrigeration cycle inside the refrigerator, and can cool the cooling head 71 from a room temperature to an extremely low temperature range of about 4K minimum temperature. The cooled cooling head 71 can cool the integrated circuit 10 to a low temperature by absorbing heat generated by the execution of the operation of the integrated circuit 10.

Therefore, by directly cooling the integrated circuit by the cooling head 71 of the pulse tube refrigerator, the integrated circuit can be cooled to an ultra-low temperature range without using a cooling liquid such as liquid nitrogen, and is maintenance-free and has a long-term continuous high-speed operation. Can be. Further, in the pulse tube refrigerator, since there is no movable part in the low temperature part of the refrigerator, generation of signal noise due to vibration can be avoided, and reliability can be improved.

As described above, the cooling device for an integrated circuit according to the present embodiment is such that the cooling device of the cooling device for the integrated circuit is a pulse tube refrigerator, and the integrated circuit is directly cooled by the cooling head 71 of the pulse tube refrigerator. Cooling the integrated circuit to an ultra-low temperature range without using a cooling liquid such as liquid nitrogen, maintenance-free, long-term continuous high-speed operation, and vibration due to no moving parts in the low-temperature part of the refrigerator. The occurrence of signal noise due to this can be avoided, and the reliability can be improved.

In this embodiment, the pulse tube refrigerator is arranged below the integrated circuit. However, any arrangement is possible as long as the cooling head contacts the integrated circuit.

[0080]

As described above, according to the first aspect of the present invention, there is provided an electronic apparatus including an integrated circuit, a cooler for cooling the integrated circuit, and a low-temperature section of the integrated circuit and the cooler. By providing a heat insulating material surrounding the periphery of the integrated circuit, it is possible to avoid unstable operations caused by overheating of the integrated circuit and dew condensation when the integrated circuit is cooled to room temperature or lower, thereby preventing a reduction in reliability.

According to a second aspect of the present invention, there is provided an electronic device including an integrated circuit, a cooler for cooling the integrated circuit, and a sealed space containing the integrated circuit and a low-temperature portion of the cooler. And the sealed casing having the
Dew condensation in the closed space when 0 is cooled to room temperature or less can be avoided, and a decrease in reliability can be prevented.

The third aspect of the present invention is directed to the second embodiment.
The closed space according to the invention is evacuated, and even if the integrated circuit is cooled to a room temperature or lower, the inside of the closed space is not vacuum-condensed even if the integrated circuit is cooled to room temperature or lower, and the outside of the closed space is also insulated by the vacuum insulation to prevent condensation Therefore, a decrease in reliability can be prevented.

The invention according to claim 4 is the same as that of the first embodiment.
To the evaporator, the condenser,
A vapor compression refrigeration cycle comprising a decompressor and a compressor is formed, and the evaporator contacts and cools the integrated circuit, so that the evaporator of the vapor compression refrigeration cycle utilizes the boiling heat transfer to form an integrated circuit. Since cooling can be performed efficiently, the calculation speed can be increased and the reliability can be improved.

Further, the invention described in claim 5 is the same as claim 4
The present invention is a vapor compression refrigeration cycle in which carbon dioxide is used as a refrigerant in the described invention, and a small evaporator to which characteristics of high heat transfer coefficient and low pressure loss of carbon dioxide refrigerant can be used can be used. The integrated circuit having a small size can be cooled more efficiently, the operation speed can be increased, and the reliability can be improved.

The invention according to claim 6 relates to the first embodiment.
The cooling device of the invention according to Embodiment 3 is a Stirling refrigerator, which can cool an integrated circuit to an ultra-low temperature range without using a cooling liquid such as liquid nitrogen, and can perform continuous high-speed operation for a long time without maintenance. .

The invention described in claim 7 is the same as that of the first embodiment.
The pulse cooler of the invention according to the third embodiment is a pulse tube refrigerator. The integrated circuit can be cooled to an ultra-low temperature range without using a cooling liquid such as liquid nitrogen, and maintenance-free and long-term continuous high-speed operation can be performed. In addition, since there is no movable part in the low-temperature part of the refrigerator, it is possible to avoid the generation of signal noise due to vibration and improve the reliability.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a first embodiment of an integrated circuit cooling device according to the present invention;

FIG. 2 is a configuration diagram of an integrated circuit cooling device according to a second embodiment of the present invention;

FIG. 3 is a configuration diagram of a third embodiment of an integrated circuit cooling device according to the present invention;

FIG. 4 is a configuration diagram of an integrated circuit cooling device according to a fourth embodiment of the present invention;

FIG. 5 is a configuration diagram of an integrated circuit cooling device according to a fifth embodiment of the present invention.

FIG. 6 is a configuration diagram of Embodiment 6 of an integrated circuit cooling device according to the present invention.

FIG. 7 is a configuration diagram of an integrated circuit cooling device according to a seventh embodiment of the present invention.

FIG. 8 is a configuration diagram of a conventional integrated circuit cooling device.

[Explanation of symbols]

 8a cooler 10 integrated circuit 21 heat insulating material 23 closed casing 24 closed space 41 evaporator 42 condenser 43 decompressor 44 compressor 60 Stirling refrigerator 70 pulse tube refrigerator

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) F25B 9/14 520 F25B 9/14 520 H01L 23/473 H01L 23/46 Z F-term (Reference) 5E322 AA05 AB11 CA02 CA06 DB02 DB06 EA11 FA01 5F036 BA26 BA28 BB43 BB53 BB56 BB60

Claims (7)

[Claims] An electronic device comprising an integrated circuit or the like,
A cooling device for an integrated circuit, comprising: a cooler for cooling the integrated circuit; and a heat insulating material surrounding a periphery of a low temperature portion of the cooler. 2. An electronic device comprising an integrated circuit or the like;
A cooling device for an integrated circuit, comprising: a cooler for cooling the integrated circuit; and a closed casing having a closed space accommodating the integrated circuit and a low-temperature portion of the cooler. 3. The cooling device for an integrated circuit according to claim 2, wherein the closed space is a vacuum. 4. The cooler according to claim 1, wherein the cooler forms a vapor compression refrigeration cycle including an evaporator, a condenser, a decompressor, and a compressor, and the evaporator contacts and cools the integrated circuit. 4. The cooling device for an integrated circuit according to claim 3. 5. The integrated circuit cooling device according to claim 4, wherein the cooler for cooling the integrated circuit is a refrigeration cycle using carbon dioxide as a refrigerant. 6. The cooling device for an integrated circuit according to claim 1, wherein the cooler for cooling the integrated circuit is a Stirling refrigerator. 7. The integrated circuit cooling device according to claim 1, wherein the cooler for cooling the integrated circuit is a pulse tube refrigerator.