AR066470A1 - Sistemas y metodos de manejo termico para componentes electronicos en una envolvente cerrada - Google Patents
Sistemas y metodos de manejo termico para componentes electronicos en una envolvente cerradaInfo
- Publication number
- AR066470A1 AR066470A1 ARP080101929A ARP080101929A AR066470A1 AR 066470 A1 AR066470 A1 AR 066470A1 AR P080101929 A ARP080101929 A AR P080101929A AR P080101929 A ARP080101929 A AR P080101929A AR 066470 A1 AR066470 A1 AR 066470A1
- Authority
- AR
- Argentina
- Prior art keywords
- envelope
- electronic components
- systems
- methods
- handling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/025—Cabinets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/03—Power distribution arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/206—Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Se proporcionan sistemas y métodos para el manejo térmico de componentes electronicos en una envolvente sellada. En una modalidad, un sistema de manejo térmico para componentes electronicos en una envolvente sellada comprende: una envolvente paraalojar componentes electronicos, la envolvente sellada de un ambiente externo; un armazon de tarjetas alojado dentro de la envolvente; al menos una tarjeta de dispositivo electronico instalada en el armazon de tarjetas; y al menos un deflectorconfigurado para formar un canal de flujo de aire a través de al menos parte de la armazon de tarjetas, en donde el canal de flujo de aire dirige el aire calentado por energía térmica desde la al menos una tarjeta de dispositivo electronico paraseguir una trayectoria circular a lo largo de una superficie interna de la envolvente, en donde la superficie interna se configura para remover calor por conduccion desde el aire hacia el ambiente externo hacia la envolvente.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/746,199 US20080278912A1 (en) | 2007-05-09 | 2007-05-09 | Thermal management systems and methods for electronic components in a sealed enclosure |
Publications (1)
Publication Number | Publication Date |
---|---|
AR066470A1 true AR066470A1 (es) | 2009-08-19 |
Family
ID=39771420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ARP080101929A AR066470A1 (es) | 2007-05-09 | 2008-05-07 | Sistemas y metodos de manejo termico para componentes electronicos en una envolvente cerrada |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080278912A1 (es) |
AR (1) | AR066470A1 (es) |
CL (1) | CL2008001366A1 (es) |
TW (1) | TW200850138A (es) |
WO (1) | WO2008141170A1 (es) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2456294B1 (en) * | 2007-11-28 | 2015-04-08 | Robert Bosch GmbH | Inverter |
US8141965B2 (en) * | 2008-06-11 | 2012-03-27 | Adc Telecommunications, Inc. | L-shaped door with three-surface seal for endplates |
US8549741B2 (en) * | 2008-06-11 | 2013-10-08 | Adc Telecommunications, Inc. | Suspension method for compliant thermal contact of electronics modules |
US7724521B2 (en) * | 2008-06-11 | 2010-05-25 | Adc Telecommunications, Inc. | Systems and methods for Venturi fan-assisted cooling |
US8083302B2 (en) * | 2008-06-11 | 2011-12-27 | Adc Telecommunications, Inc. | L-shaped doors with trapezoidal seal |
US8254850B2 (en) * | 2008-06-11 | 2012-08-28 | Adc Telecommunications, Inc. | Communication module component assemblies |
US7812254B2 (en) * | 2008-06-11 | 2010-10-12 | Adc Telecommunications, Inc. | Solar shields |
US8031470B2 (en) * | 2008-06-11 | 2011-10-04 | Adc Telecommunications, Inc. | Systems and methods for thermal management |
US20110162822A1 (en) * | 2008-09-08 | 2011-07-07 | Hewlett-Packard Development Company, L.P. | Cooling System |
US7893365B2 (en) * | 2008-11-10 | 2011-02-22 | Adc Telecommunications, Inc. | Weather resistant variable enclosure frame |
US8068338B1 (en) * | 2009-03-24 | 2011-11-29 | Qlogic, Corporation | Network device with baffle for redirecting cooling air and associated methods |
US9442540B2 (en) * | 2009-08-28 | 2016-09-13 | Advanced Green Computing Machines-Ip, Limited | High density multi node computer with integrated shared resources |
US8214086B2 (en) | 2010-04-01 | 2012-07-03 | Adc Telecommunications, Inc. | Systems and methods for retractable fan cooling of electronic enclosures |
WO2012011957A2 (en) * | 2010-07-22 | 2012-01-26 | Telecommunication Systems, Inc. | Thermal management of environmentally-sealed electronics enclosure |
TWI392997B (zh) * | 2010-11-05 | 2013-04-11 | Inventec Corp | 伺服器之冷卻循環系統 |
US8687363B2 (en) * | 2012-05-01 | 2014-04-01 | General Electric Company | Enclosure with duct mounted electronic components |
US9167730B2 (en) * | 2012-05-07 | 2015-10-20 | Abb Technology Oy | Electronics compartment |
US20130294026A1 (en) * | 2012-05-07 | 2013-11-07 | Abb Oy | Electronics compartment |
US9333599B2 (en) * | 2013-12-20 | 2016-05-10 | General Electric Company | Electronics chassis and method of fabricating the same |
US10477724B2 (en) * | 2015-03-09 | 2019-11-12 | Datalogic IP Tech, S.r.l. | Efficient heat exchange systems and methods |
US10349557B2 (en) * | 2016-02-24 | 2019-07-09 | Thermal Corp. | Electronics rack with compliant heat pipe |
US10136556B2 (en) | 2016-02-24 | 2018-11-20 | Thermal Corp. | Electronics rack with selective engagement of heat sink |
US11188037B2 (en) * | 2016-03-24 | 2021-11-30 | Siemens Aktiengesellschaft | Controlling methods, control systems, and plants using semantic models for quality criteria or adaptation of control rules |
US10291698B2 (en) * | 2017-07-14 | 2019-05-14 | Amazon Technologies, Inc. | Antenna structures and isolation chambers of a multi-radio, multi-channel (MRMC) mesh network device |
US10615514B2 (en) | 2017-07-14 | 2020-04-07 | Amazon Technologies, Inc. | Antenna structures of a multi-radio, multi-channel (MRMC) mesh network device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD212871A1 (de) * | 1982-12-21 | 1984-08-22 | Elektroprojekt Anlagenbau Veb | Anordnung zur waermeabfuehrung aus geschlossenen gehaeusen |
US6082441A (en) * | 1997-06-13 | 2000-07-04 | Knuerr-Mechanik Fuer Die Elektronik Aktiengellschaft | Cabinet for electric and electronic systems |
US6088225A (en) * | 1998-03-17 | 2000-07-11 | Northern Telecom Limited | Cabinet with enhanced convection cooling |
DE19812117A1 (de) * | 1998-03-19 | 1999-09-23 | Knuerr Mechanik Ag | Geräteschrank |
JP3408424B2 (ja) * | 1998-07-28 | 2003-05-19 | 日本電気株式会社 | 電子機器の冷却構造 |
US6127663A (en) * | 1998-10-09 | 2000-10-03 | Ericsson Inc. | Electronics cabinet cooling system |
US6164369A (en) * | 1999-07-13 | 2000-12-26 | Lucent Technologies Inc. | Door mounted heat exchanger for outdoor equipment enclosure |
US6781831B1 (en) * | 2002-02-14 | 2004-08-24 | Mercury Computer Systems, Inc. | Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers |
US6877551B2 (en) * | 2002-07-11 | 2005-04-12 | Avaya Technology Corp. | Systems and methods for weatherproof cabinets with variably cooled compartments |
US6854275B2 (en) * | 2002-08-08 | 2005-02-15 | International Business Machines Corporation | Method for cooling automated storage library media using thermoelectric cooler |
US6788535B2 (en) * | 2002-12-12 | 2004-09-07 | 3M Innovative Properties Company | Outdoor electronic equipment cabinet |
US7100385B2 (en) * | 2004-08-03 | 2006-09-05 | Lucent Technologies Inc. | Thermal management system for electrical enclosures |
US7212403B2 (en) * | 2004-10-25 | 2007-05-01 | Rocky Research | Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection |
DE202004016492U1 (de) * | 2004-10-25 | 2004-12-30 | Knürr AG | Geräte- und Netzwerkschrank |
US7245485B1 (en) * | 2004-11-15 | 2007-07-17 | Utstarcom, Inc. | Electronics cabinet with internal air-to-air heat exchanger |
-
2007
- 2007-05-09 US US11/746,199 patent/US20080278912A1/en not_active Abandoned
-
2008
- 2008-05-07 AR ARP080101929A patent/AR066470A1/es unknown
- 2008-05-08 TW TW097116951A patent/TW200850138A/zh unknown
- 2008-05-09 WO PCT/US2008/063233 patent/WO2008141170A1/en active Application Filing
- 2008-05-09 CL CL2008001366A patent/CL2008001366A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
US20080278912A1 (en) | 2008-11-13 |
CL2008001366A1 (es) | 2009-01-09 |
WO2008141170A1 (en) | 2008-11-20 |
TW200850138A (en) | 2008-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FB | Suspension of granting procedure |