CH647640GA3 - - Google Patents

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Publication number
CH647640GA3
CH647640GA3 CH812581A CH812581A CH647640GA3 CH 647640G A3 CH647640G A3 CH 647640GA3 CH 812581 A CH812581 A CH 812581A CH 812581 A CH812581 A CH 812581A CH 647640G A3 CH647640G A3 CH 647640GA3
Authority
CH
Switzerland
Application number
CH812581A
Other languages
German (de)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of CH647640GA3 publication Critical patent/CH647640GA3/de

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
CH812581A 1980-12-19 1981-12-18 CH647640GA3 (ru)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/218,136 US4391531A (en) 1980-12-19 1980-12-19 Electrooptical display/lead frame subassembly and timepiece module including same

Publications (1)

Publication Number Publication Date
CH647640GA3 true CH647640GA3 (ru) 1985-02-15

Family

ID=22813889

Family Applications (1)

Application Number Title Priority Date Filing Date
CH812581A CH647640GA3 (ru) 1980-12-19 1981-12-18

Country Status (9)

Country Link
US (1) US4391531A (ru)
JP (1) JPS57124782A (ru)
CA (1) CA1170343A (ru)
CH (1) CH647640GA3 (ru)
DE (1) DE3150196A1 (ru)
FR (1) FR2498791B1 (ru)
GB (1) GB2090055B (ru)
HK (1) HK43385A (ru)
IT (1) IT1218263B (ru)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6068639A (ja) * 1983-08-31 1985-04-19 Toshiba Corp 樹脂封止型半導体装置
US4598337A (en) * 1984-09-17 1986-07-01 Timex Corporation Electronic circuit board for a timepiece
GB2203270B (en) * 1987-03-05 1991-09-11 Seiko Epson Corp Timepiece assembly.
US5416752A (en) * 1987-07-21 1995-05-16 Seiko Epson Corporation Timepiece
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
US6218628B1 (en) * 1994-05-18 2001-04-17 Dyconex Patente Ag Foil circuit boards and semifinished products and method for the manufacture thereof
TW382079B (en) * 1998-08-28 2000-02-11 Via Tech Inc Integrated real time clock integrated circuit device and manufacturing method thereof
TW576957B (en) * 2000-11-29 2004-02-21 Ebauchesfabrik Eta Ag Timepiece comprising means for allowing electric access to electric or electronic components of this timepiece
DE10105471B4 (de) * 2001-02-05 2007-07-12 Robert Bosch Gmbh Anzeigevorrichtung
JP2003215278A (ja) * 2002-01-24 2003-07-30 Seiko Instruments Inc 電子時計
EP1544917A1 (en) * 2003-12-15 2005-06-22 Dialog Semiconductor GmbH Integrated battery pack with lead frame connection
US8766435B2 (en) 2004-06-30 2014-07-01 Stmicroelectronics, Inc. Integrated circuit package including embedded thin-film battery

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1684973A (en) * 1925-09-12 1928-09-18 Naylor Radio Corp Contact-protecting means for vacuum tubes
US1994849A (en) * 1930-01-04 1935-03-19 Bauza Jacques Product for the protection of contacts in electric circuits
US1925856A (en) * 1930-08-08 1933-09-05 Westinghouse Electric & Mfg Co Contact terminal
GB820900A (en) * 1956-11-20 1959-09-30 Texas Instruments Inc Method of fixing electric leads to a silicon element and article resulting therefrom
JPS5549273B2 (ru) * 1972-07-19 1980-12-11
JPS5616393B2 (ru) * 1972-08-03 1981-04-16
JPS56756B2 (ru) * 1972-10-07 1981-01-09
US4064689A (en) * 1973-07-20 1977-12-27 Citizen Watch Co., Ltd. Electronic timepiece with electro-optical display
GB1468243A (en) * 1973-07-20 1977-03-23 Citizen Watch Co Ltd Electronic optical display timepiece
GB1479779A (en) * 1973-09-25 1977-07-13 Citizen Watch Co Ltd Liquid crystal display wrist watch
US4065851A (en) * 1974-04-20 1978-01-03 W. C. Heraeus Gmbh Method of making metallic support carrier for semiconductor elements
US4075825A (en) * 1974-06-28 1978-02-28 Citizen Watch Co., Ltd. Electronic timepiece substratum
US4012117A (en) * 1974-07-29 1977-03-15 Rca Corporation Liquid crystal module
US3975899A (en) * 1975-05-05 1976-08-24 Haber Terry M Multi-function watch casing
US3984166A (en) * 1975-05-07 1976-10-05 Burroughs Corporation Semiconductor device package having lead frame structure with integral spring contacts
US3986335A (en) * 1975-05-29 1976-10-19 Texas Instruments Incorporated Electronic watch module and its method of fabrication
US3986334A (en) * 1975-05-29 1976-10-19 Texas Instruments Incorporated Electronic watch and its method of fabrication
US3992870A (en) * 1975-08-14 1976-11-23 Joseph Dekel Watertight nonconductive electronic watchcase including conductive internal plate
JPS5242765A (en) * 1975-09-30 1977-04-02 Seiko Instr & Electronics Ltd Electronic watch
US4144705A (en) * 1975-10-15 1979-03-20 Citizen Watch Co. Ltd. Timepiece circuit device
US4120147A (en) * 1976-01-08 1978-10-17 Citizen Watch Company Limited Watch module assembly
JPS5292368A (en) * 1976-01-29 1977-08-03 Seiko Instr & Electronics Electronic wrist watch substrate mounting structure
AT345326B (de) * 1976-02-04 1978-09-11 Plasser Bahnbaumasch Franz Einrichtung zum loesen von stopfwerkzeugen aus deren halterung bei gleisstopfmaschinen
US4183629A (en) * 1976-07-21 1980-01-15 Citizen Watch Co. Ltd. Electronic optical display device and method of manufacturing the same
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
NL7610306A (nl) * 1976-09-16 1978-03-20 Du Pont Contactinrichting voor een geintegreerde schakeling.
US4142287A (en) * 1976-12-27 1979-03-06 Amp Incorporated Electrical devices such as watches and method of construction thereof
US4165607A (en) * 1977-01-28 1979-08-28 Motorola, Inc. Watch module
US4104086A (en) * 1977-08-15 1978-08-01 International Business Machines Corporation Method for forming isolated regions of silicon utilizing reactive ion etching
US4204317A (en) * 1977-11-18 1980-05-27 The Arnold Engineering Company Method of making a lead frame
US4177554A (en) * 1978-04-26 1979-12-11 Western Electric Co., Inc. Assembling leads to a substrate
GB1601520A (en) * 1978-05-31 1981-10-28 Gen Electric Co Ltd Electric circuit arrangements
US4219448A (en) * 1978-06-08 1980-08-26 Bernd Ross Screenable contact structure and method for semiconductor devices
US4185882A (en) * 1978-07-14 1980-01-29 Teledyne Industries, Inc. Electrical connector for printed circuit boards or the like
US4224637A (en) * 1978-08-10 1980-09-23 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device
US4232815A (en) * 1978-11-06 1980-11-11 Kyocera International, Inc. Integrated circuit lead coupling device and method
US4335501A (en) * 1979-10-31 1982-06-22 The General Electric Company Limited Manufacture of monolithic LED arrays for electroluminescent display devices

Also Published As

Publication number Publication date
CA1170343A (en) 1984-07-03
IT8149950A0 (it) 1981-12-18
GB2090055B (en) 1985-01-09
HK43385A (en) 1985-06-14
GB2090055A (en) 1982-06-30
US4391531A (en) 1983-07-05
JPS57124782A (en) 1982-08-03
DE3150196A1 (de) 1982-07-15
IT1218263B (it) 1990-04-12
FR2498791A1 (fr) 1982-07-30
FR2498791B1 (fr) 1987-12-24

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