CH647640GA3 - - Google Patents

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Publication number
CH647640GA3
CH647640GA3 CH812581A CH812581A CH647640GA3 CH 647640G A3 CH647640G A3 CH 647640GA3 CH 812581 A CH812581 A CH 812581A CH 812581 A CH812581 A CH 812581A CH 647640G A3 CH647640G A3 CH 647640GA3
Authority
CH
Switzerland
Application number
CH812581A
Other languages
German (de)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of CH647640GA3 publication Critical patent/CH647640GA3/de

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electromechanical Clocks (AREA)
  • Liquid Crystal (AREA)
CH812581A 1980-12-19 1981-12-18 CH647640GA3 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/218,136 US4391531A (en) 1980-12-19 1980-12-19 Electrooptical display/lead frame subassembly and timepiece module including same

Publications (1)

Publication Number Publication Date
CH647640GA3 true CH647640GA3 (enrdf_load_stackoverflow) 1985-02-15

Family

ID=22813889

Family Applications (1)

Application Number Title Priority Date Filing Date
CH812581A CH647640GA3 (enrdf_load_stackoverflow) 1980-12-19 1981-12-18

Country Status (9)

Country Link
US (1) US4391531A (enrdf_load_stackoverflow)
JP (1) JPS57124782A (enrdf_load_stackoverflow)
CA (1) CA1170343A (enrdf_load_stackoverflow)
CH (1) CH647640GA3 (enrdf_load_stackoverflow)
DE (1) DE3150196A1 (enrdf_load_stackoverflow)
FR (1) FR2498791B1 (enrdf_load_stackoverflow)
GB (1) GB2090055B (enrdf_load_stackoverflow)
HK (1) HK43385A (enrdf_load_stackoverflow)
IT (1) IT1218263B (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6068639A (ja) * 1983-08-31 1985-04-19 Toshiba Corp 樹脂封止型半導体装置
US4598337A (en) * 1984-09-17 1986-07-01 Timex Corporation Electronic circuit board for a timepiece
GB2203270B (en) * 1987-03-05 1991-09-11 Seiko Epson Corp Timepiece assembly.
US5416752A (en) * 1987-07-21 1995-05-16 Seiko Epson Corporation Timepiece
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
DE59410348D1 (de) * 1994-05-18 2004-02-05 Dyconex Ag Bassersdorf Verfahren zur herstellung von folienleiterplatten oder halbzeugen für folienleiterplatten sowie nach dem verfahren hergestellte folienleiterplatten und halbzeuge
TW382079B (en) * 1998-08-28 2000-02-11 Via Tech Inc Integrated real time clock integrated circuit device and manufacturing method thereof
TW576957B (en) * 2000-11-29 2004-02-21 Ebauchesfabrik Eta Ag Timepiece comprising means for allowing electric access to electric or electronic components of this timepiece
DE10105471B4 (de) * 2001-02-05 2007-07-12 Robert Bosch Gmbh Anzeigevorrichtung
JP2003215278A (ja) * 2002-01-24 2003-07-30 Seiko Instruments Inc 電子時計
EP1544917A1 (en) * 2003-12-15 2005-06-22 Dialog Semiconductor GmbH Integrated battery pack with lead frame connection
US8766435B2 (en) * 2004-06-30 2014-07-01 Stmicroelectronics, Inc. Integrated circuit package including embedded thin-film battery

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1684973A (en) * 1925-09-12 1928-09-18 Naylor Radio Corp Contact-protecting means for vacuum tubes
US1994849A (en) * 1930-01-04 1935-03-19 Bauza Jacques Product for the protection of contacts in electric circuits
US1925856A (en) * 1930-08-08 1933-09-05 Westinghouse Electric & Mfg Co Contact terminal
GB820900A (en) * 1956-11-20 1959-09-30 Texas Instruments Inc Method of fixing electric leads to a silicon element and article resulting therefrom
JPS5549273B2 (enrdf_load_stackoverflow) * 1972-07-19 1980-12-11
JPS5616393B2 (enrdf_load_stackoverflow) * 1972-08-03 1981-04-16
JPS56756B2 (enrdf_load_stackoverflow) * 1972-10-07 1981-01-09
US4064689A (en) * 1973-07-20 1977-12-27 Citizen Watch Co., Ltd. Electronic timepiece with electro-optical display
GB1468243A (en) * 1973-07-20 1977-03-23 Citizen Watch Co Ltd Electronic optical display timepiece
GB1479779A (en) * 1973-09-25 1977-07-13 Citizen Watch Co Ltd Liquid crystal display wrist watch
US4065851A (en) * 1974-04-20 1978-01-03 W. C. Heraeus Gmbh Method of making metallic support carrier for semiconductor elements
US4075825A (en) * 1974-06-28 1978-02-28 Citizen Watch Co., Ltd. Electronic timepiece substratum
US4012117A (en) * 1974-07-29 1977-03-15 Rca Corporation Liquid crystal module
US3975899A (en) * 1975-05-05 1976-08-24 Haber Terry M Multi-function watch casing
US3984166A (en) * 1975-05-07 1976-10-05 Burroughs Corporation Semiconductor device package having lead frame structure with integral spring contacts
US3986334A (en) * 1975-05-29 1976-10-19 Texas Instruments Incorporated Electronic watch and its method of fabrication
US3986335A (en) * 1975-05-29 1976-10-19 Texas Instruments Incorporated Electronic watch module and its method of fabrication
US3992870A (en) * 1975-08-14 1976-11-23 Joseph Dekel Watertight nonconductive electronic watchcase including conductive internal plate
JPS5242765A (en) * 1975-09-30 1977-04-02 Seiko Instr & Electronics Ltd Electronic watch
US4144705A (en) * 1975-10-15 1979-03-20 Citizen Watch Co. Ltd. Timepiece circuit device
US4120147A (en) * 1976-01-08 1978-10-17 Citizen Watch Company Limited Watch module assembly
JPS5292368A (en) * 1976-01-29 1977-08-03 Seiko Instr & Electronics Electronic wrist watch substrate mounting structure
AT345326B (de) * 1976-02-04 1978-09-11 Plasser Bahnbaumasch Franz Einrichtung zum loesen von stopfwerkzeugen aus deren halterung bei gleisstopfmaschinen
US4183629A (en) * 1976-07-21 1980-01-15 Citizen Watch Co. Ltd. Electronic optical display device and method of manufacturing the same
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
NL7610306A (nl) * 1976-09-16 1978-03-20 Du Pont Contactinrichting voor een geintegreerde schakeling.
US4142287A (en) * 1976-12-27 1979-03-06 Amp Incorporated Electrical devices such as watches and method of construction thereof
US4165607A (en) * 1977-01-28 1979-08-28 Motorola, Inc. Watch module
US4104086A (en) * 1977-08-15 1978-08-01 International Business Machines Corporation Method for forming isolated regions of silicon utilizing reactive ion etching
US4204317A (en) * 1977-11-18 1980-05-27 The Arnold Engineering Company Method of making a lead frame
US4177554A (en) * 1978-04-26 1979-12-11 Western Electric Co., Inc. Assembling leads to a substrate
GB1601520A (en) * 1978-05-31 1981-10-28 Gen Electric Co Ltd Electric circuit arrangements
US4219448A (en) * 1978-06-08 1980-08-26 Bernd Ross Screenable contact structure and method for semiconductor devices
US4185882A (en) * 1978-07-14 1980-01-29 Teledyne Industries, Inc. Electrical connector for printed circuit boards or the like
US4224637A (en) * 1978-08-10 1980-09-23 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device
US4232815A (en) * 1978-11-06 1980-11-11 Kyocera International, Inc. Integrated circuit lead coupling device and method
US4335501A (en) * 1979-10-31 1982-06-22 The General Electric Company Limited Manufacture of monolithic LED arrays for electroluminescent display devices

Also Published As

Publication number Publication date
US4391531A (en) 1983-07-05
IT8149950A0 (it) 1981-12-18
JPS57124782A (en) 1982-08-03
GB2090055B (en) 1985-01-09
DE3150196A1 (de) 1982-07-15
FR2498791A1 (fr) 1982-07-30
HK43385A (en) 1985-06-14
FR2498791B1 (fr) 1987-12-24
CA1170343A (en) 1984-07-03
IT1218263B (it) 1990-04-12
GB2090055A (en) 1982-06-30

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