CH616306GA3 - - Google Patents

Info

Publication number
CH616306GA3
CH616306GA3 CH117277A CH117277A CH616306GA3 CH 616306G A3 CH616306G A3 CH 616306GA3 CH 117277 A CH117277 A CH 117277A CH 117277 A CH117277 A CH 117277A CH 616306G A3 CH616306G A3 CH 616306GA3
Authority
CH
Switzerland
Application number
CH117277A
Other versions
CH616306B5 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of CH616306GA3 publication Critical patent/CH616306GA3/xx
Publication of CH616306B5 publication Critical patent/CH616306B5/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H10W70/093—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H10W70/60—
    • H10W72/07173—
    • H10W72/5522—
    • H10W90/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Clocks (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CH117277A 1976-02-03 1977-02-01 Elektronisches modul und verfahren zu seiner herstellung. CH616306B5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/654,749 US4064552A (en) 1976-02-03 1976-02-03 Multilayer flexible printed circuit tape

Publications (2)

Publication Number Publication Date
CH616306GA3 true CH616306GA3 (en:Method) 1980-03-31
CH616306B5 CH616306B5 (de) 1980-09-30

Family

ID=24626098

Family Applications (1)

Application Number Title Priority Date Filing Date
CH117277A CH616306B5 (de) 1976-02-03 1977-02-01 Elektronisches modul und verfahren zu seiner herstellung.

Country Status (5)

Country Link
US (1) US4064552A (en:Method)
JP (1) JPS592378B2 (en:Method)
CH (1) CH616306B5 (en:Method)
DE (1) DE2703358C2 (en:Method)
FR (1) FR2340666A1 (en:Method)

Families Citing this family (62)

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US4115919A (en) * 1977-10-25 1978-09-26 Amp Incorporated Machine for press fit insertion of chip devices
CH623452B (fr) * 1977-12-14 Fontainemelon Horlogerie Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede.
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
EP0059187A1 (en) * 1980-09-08 1982-09-08 Mostek Corporation Single layer burn-in tape for integrated circuit
JPS57145354A (en) * 1980-11-21 1982-09-08 Gao Ges Automation Org Carrier element for ic module
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
USH416H (en) 1981-08-31 1988-01-05 Rogers Corporation High capacitance flexible circuit
US4386389A (en) * 1981-09-08 1983-05-31 Mostek Corporation Single layer burn-in tape for integrated circuit
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
CH654166GA3 (en:Method) * 1983-10-14 1986-02-14
US4857400A (en) * 1984-02-22 1989-08-15 Gila River Products, Inc. Stratiform press pads and methods for use thereof in laminating flexible printed circuits
US4677528A (en) * 1984-05-31 1987-06-30 Motorola, Inc. Flexible printed circuit board having integrated circuit die or the like affixed thereto
US4598337A (en) * 1984-09-17 1986-07-01 Timex Corporation Electronic circuit board for a timepiece
US4949224A (en) * 1985-09-20 1990-08-14 Sharp Kabushiki Kaisha Structure for mounting a semiconductor device
US4843188A (en) * 1986-03-25 1989-06-27 Western Digital Corporation Integrated circuit chip mounting and packaging assembly
EP0305398B1 (en) * 1986-05-01 1991-09-25 Honeywell Inc. Multiple integrated circuit interconnection arrangement
US5036379A (en) * 1986-10-11 1991-07-30 Microelectronics And Computer Technology Corporation Electrical interconnect tape
US4717989A (en) * 1987-03-30 1988-01-05 Motorola Inc. Heat sink, EMI shield and controller module assembly for a portable radio transceiver
US4933810A (en) * 1987-04-30 1990-06-12 Honeywell Inc. Integrated circuit interconnector
US4914741A (en) * 1987-06-08 1990-04-03 Digital Equipment Corporation Tape automated bonding semiconductor package
US4861648A (en) * 1988-03-14 1989-08-29 Gila River Products, Inc. Materials for laminating flexible printed circuits
US4829405A (en) * 1988-03-14 1989-05-09 International Business Machines Corporation Tape automated bonding package
US5028983A (en) * 1988-10-28 1991-07-02 International Business Machines Corporation Multilevel integrated circuit packaging structures
US4980034A (en) * 1989-04-04 1990-12-25 Massachusetts Institute Of Technology High-density, multi-level interconnects, flex circuits, and tape for TAB
US5106461A (en) * 1989-04-04 1992-04-21 Massachusetts Institute Of Technology High-density, multi-level interconnects, flex circuits, and tape for tab
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5133495A (en) * 1991-08-12 1992-07-28 International Business Machines Corporation Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US5276590A (en) * 1991-10-24 1994-01-04 International Business Machines Corporation Flex circuit electronic cards
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
US5350945A (en) * 1991-12-18 1994-09-27 Casio Computer Co., Ltd. Coin-shaped integrated circuit memory device
JPH0653277A (ja) * 1992-06-04 1994-02-25 Lsi Logic Corp 半導体装置アセンブリおよびその組立方法
US6104280A (en) 1997-10-20 2000-08-15 Micron Technology, Inc. Method of manufacturing and testing an electronic device, and an electronic device
US6356512B1 (en) * 1998-07-20 2002-03-12 Asulab S.A. Subassembly combining an antenna and position sensors on a same support, notably for a horological piece
US8664030B2 (en) 1999-03-30 2014-03-04 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
JP2001255833A (ja) * 2000-03-10 2001-09-21 Seiko Instruments Inc 電子機器用表示装置
US7483274B2 (en) * 2005-09-29 2009-01-27 Welch Allyn, Inc. Galvanic isolation of a signal using capacitive coupling embedded within a circuit board
DE102005053398B4 (de) * 2005-11-09 2008-12-24 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
US9006563B2 (en) 2006-04-13 2015-04-14 Solannex, Inc. Collector grid and interconnect structures for photovoltaic arrays and modules
US8884155B2 (en) 2006-04-13 2014-11-11 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9236512B2 (en) 2006-04-13 2016-01-12 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8822810B2 (en) 2006-04-13 2014-09-02 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9865758B2 (en) 2006-04-13 2018-01-09 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8729385B2 (en) 2006-04-13 2014-05-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
DE102007043001A1 (de) * 2007-09-10 2009-03-12 Siemens Ag Bandverfahren für elektronische Bauelemente, Module und LED-Anwendungen
US20090255565A1 (en) * 2008-01-31 2009-10-15 Global Solar Energy, Inc. Thin film solar cell string
US20090223555A1 (en) * 2008-03-05 2009-09-10 Stalix Llc High Efficiency Concentrating Photovoltaic Module Method and Apparatus
FI20085468A0 (fi) * 2008-05-16 2008-05-16 Polar Electro Oy Sähköpiirijärjestely
DE112009002356T5 (de) * 2008-09-30 2012-01-19 Global Solar Energy, Inc. Dünnschicht-Solarzellenreihe
US8169006B2 (en) * 2008-11-29 2012-05-01 Electronics And Telecommunications Research Institute Bio-sensor chip for detecting target material
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
US8929057B2 (en) * 2011-05-25 2015-01-06 Polar Electro Oy Cover mechanism for casing
WO2013158796A1 (en) 2012-04-17 2013-10-24 Global Solar Energy, Inc. Integrated thin film solar cell interconnection
US9864343B2 (en) * 2013-01-18 2018-01-09 Eta Sa Manufacture Horlogere Suisse Support element for a timepiece sensor
US9362433B2 (en) 2013-01-28 2016-06-07 Hanergy Hi-Tech Power (Hk) Limited Photovoltaic interconnect systems, devices, and methods
US10750620B2 (en) * 2016-12-20 2020-08-18 Philips Healthcare Informatics, Inc. Flexible circuit battery attachment devices, systems, and methods
EP3816734A1 (fr) * 2019-11-04 2021-05-05 ETA SA Manufacture Horlogère Suisse Montre electronique a cellule solaire
US12475339B2 (en) 2020-05-25 2025-11-18 Trackonomy Systems, Inc. System and method for enhanced asset tracking and security for border protection and other applications
US11741822B2 (en) 2020-05-25 2023-08-29 Trackonomy Systems, Inc. System and method of intelligent node detecting events for border protection and security
CN114487869A (zh) * 2020-11-12 2022-05-13 邑流微测股份有限公司 钮扣电池测试装置
US11869994B2 (en) * 2020-12-12 2024-01-09 Trackonomy Systems, Inc. Flexible solar-powered wireless communication device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3433888A (en) * 1967-01-24 1969-03-18 Electro Mechanisms Inc Dimensionally stable flexible laminate and printed circuits made therefrom
DE2623715A1 (de) * 1975-05-29 1977-01-20 Texas Instruments Inc Modulare schaltungsanordnung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3052823A (en) * 1958-06-12 1962-09-04 Rogers Corp Printed circuit structure and method of making the same
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
US3832769A (en) * 1971-05-26 1974-09-03 Minnesota Mining & Mfg Circuitry and method
US3681664A (en) * 1971-08-19 1972-08-01 Jfd Electronics Corp Trimmer capacitor for printed circuit board
US3739232A (en) * 1972-04-10 1973-06-12 Northrop Corp Interconnected electrical circuit board assembly and method of fabrication
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3433888A (en) * 1967-01-24 1969-03-18 Electro Mechanisms Inc Dimensionally stable flexible laminate and printed circuits made therefrom
DE2623715A1 (de) * 1975-05-29 1977-01-20 Texas Instruments Inc Modulare schaltungsanordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JAPAN PLASTIC AGE, Vol. 10, Nr. 8, August 1972, Tokyo, Japan, T. WATANABE et al.: "Copper clad laminated boards for flixible printed circuits", Seiten 52-63 *

Also Published As

Publication number Publication date
JPS592378B2 (ja) 1984-01-18
US4064552A (en) 1977-12-20
FR2340666A1 (fr) 1977-09-02
FR2340666B1 (en:Method) 1982-04-09
DE2703358C2 (de) 1983-11-24
JPS52101469A (en) 1977-08-25
DE2703358A1 (de) 1977-08-18
CH616306B5 (de) 1980-09-30

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Legal Events

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PL Patent ceased
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