CH616306GA3 - - Google Patents

Info

Publication number
CH616306GA3
CH616306GA3 CH117277A CH117277A CH616306GA3 CH 616306G A3 CH616306G A3 CH 616306GA3 CH 117277 A CH117277 A CH 117277A CH 117277 A CH117277 A CH 117277A CH 616306G A3 CH616306G A3 CH 616306GA3
Authority
CH
Switzerland
Application number
CH117277A
Other versions
CH616306B5 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of CH616306GA3 publication Critical patent/CH616306GA3/xx
Publication of CH616306B5 publication Critical patent/CH616306B5/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Clocks (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
CH117277A 1976-02-03 1977-02-01 Elektronisches modul und verfahren zu seiner herstellung. CH616306B5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/654,749 US4064552A (en) 1976-02-03 1976-02-03 Multilayer flexible printed circuit tape

Publications (2)

Publication Number Publication Date
CH616306GA3 true CH616306GA3 (ca) 1980-03-31
CH616306B5 CH616306B5 (de) 1980-09-30

Family

ID=24626098

Family Applications (1)

Application Number Title Priority Date Filing Date
CH117277A CH616306B5 (de) 1976-02-03 1977-02-01 Elektronisches modul und verfahren zu seiner herstellung.

Country Status (5)

Country Link
US (1) US4064552A (ca)
JP (1) JPS592378B2 (ca)
CH (1) CH616306B5 (ca)
DE (1) DE2703358C2 (ca)
FR (1) FR2340666A1 (ca)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4115919A (en) * 1977-10-25 1978-09-26 Amp Incorporated Machine for press fit insertion of chip devices
CH623452B (fr) * 1977-12-14 Fontainemelon Horlogerie Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede.
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
WO1982000937A1 (en) * 1980-09-08 1982-03-18 Proebsting R Single layer burn-in tape for integrated circuit
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
JPS57145354A (en) * 1980-11-21 1982-09-08 Gao Ges Automation Org Carrier element for ic module
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
USH416H (en) 1981-08-31 1988-01-05 Rogers Corporation High capacitance flexible circuit
US4386389A (en) * 1981-09-08 1983-05-31 Mostek Corporation Single layer burn-in tape for integrated circuit
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
CH654166GA3 (ca) * 1983-10-14 1986-02-14
US4857400A (en) * 1984-02-22 1989-08-15 Gila River Products, Inc. Stratiform press pads and methods for use thereof in laminating flexible printed circuits
US4677528A (en) * 1984-05-31 1987-06-30 Motorola, Inc. Flexible printed circuit board having integrated circuit die or the like affixed thereto
US4598337A (en) * 1984-09-17 1986-07-01 Timex Corporation Electronic circuit board for a timepiece
US4949224A (en) * 1985-09-20 1990-08-14 Sharp Kabushiki Kaisha Structure for mounting a semiconductor device
US4843188A (en) * 1986-03-25 1989-06-27 Western Digital Corporation Integrated circuit chip mounting and packaging assembly
JPH01503663A (ja) * 1986-05-01 1989-12-07 ハネウエル・インコーポレーテツド 多重集積回路相互接続装置
US5036379A (en) * 1986-10-11 1991-07-30 Microelectronics And Computer Technology Corporation Electrical interconnect tape
US4717989A (en) * 1987-03-30 1988-01-05 Motorola Inc. Heat sink, EMI shield and controller module assembly for a portable radio transceiver
US4933810A (en) * 1987-04-30 1990-06-12 Honeywell Inc. Integrated circuit interconnector
US4914741A (en) * 1987-06-08 1990-04-03 Digital Equipment Corporation Tape automated bonding semiconductor package
US4861648A (en) * 1988-03-14 1989-08-29 Gila River Products, Inc. Materials for laminating flexible printed circuits
US4829405A (en) * 1988-03-14 1989-05-09 International Business Machines Corporation Tape automated bonding package
US5028983A (en) * 1988-10-28 1991-07-02 International Business Machines Corporation Multilevel integrated circuit packaging structures
US5106461A (en) * 1989-04-04 1992-04-21 Massachusetts Institute Of Technology High-density, multi-level interconnects, flex circuits, and tape for tab
US4980034A (en) * 1989-04-04 1990-12-25 Massachusetts Institute Of Technology High-density, multi-level interconnects, flex circuits, and tape for TAB
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5133495A (en) * 1991-08-12 1992-07-28 International Business Machines Corporation Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US5276590A (en) * 1991-10-24 1994-01-04 International Business Machines Corporation Flex circuit electronic cards
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
US5350945A (en) * 1991-12-18 1994-09-27 Casio Computer Co., Ltd. Coin-shaped integrated circuit memory device
JPH0653277A (ja) * 1992-06-04 1994-02-25 Lsi Logic Corp 半導体装置アセンブリおよびその組立方法
US6104280A (en) 1997-10-20 2000-08-15 Micron Technology, Inc. Method of manufacturing and testing an electronic device, and an electronic device
EP0974878A1 (fr) * 1998-07-20 2000-01-26 Asulab S.A. Sous-ensemble combinant une antenne et des capteurs de position sur un même support, notamment pour pièce d'horlogerie
US8664030B2 (en) 1999-03-30 2014-03-04 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
JP2001255833A (ja) * 2000-03-10 2001-09-21 Seiko Instruments Inc 電子機器用表示装置
US7483274B2 (en) * 2005-09-29 2009-01-27 Welch Allyn, Inc. Galvanic isolation of a signal using capacitive coupling embedded within a circuit board
DE102005053398B4 (de) * 2005-11-09 2008-12-24 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
US8729385B2 (en) 2006-04-13 2014-05-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9006563B2 (en) 2006-04-13 2015-04-14 Solannex, Inc. Collector grid and interconnect structures for photovoltaic arrays and modules
US9236512B2 (en) 2006-04-13 2016-01-12 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8822810B2 (en) 2006-04-13 2014-09-02 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9865758B2 (en) 2006-04-13 2018-01-09 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8884155B2 (en) 2006-04-13 2014-11-11 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
DE102007043001A1 (de) * 2007-09-10 2009-03-12 Siemens Ag Bandverfahren für elektronische Bauelemente, Module und LED-Anwendungen
DE212009000025U1 (de) * 2008-01-31 2010-09-23 Global Solar Energy. Inc., Tuscon Dünnschicht-Solarzellen-Abfolge
US20090223555A1 (en) * 2008-03-05 2009-09-10 Stalix Llc High Efficiency Concentrating Photovoltaic Module Method and Apparatus
FI20085468A0 (fi) * 2008-05-16 2008-05-16 Polar Electro Oy Sähköpiirijärjestely
WO2010039245A1 (en) * 2008-09-30 2010-04-08 Global Solar Energy, Inc. Thin film solar cell string
US8169006B2 (en) * 2008-11-29 2012-05-01 Electronics And Telecommunications Research Institute Bio-sensor chip for detecting target material
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
US8929057B2 (en) * 2011-05-25 2015-01-06 Polar Electro Oy Cover mechanism for casing
WO2013158796A1 (en) 2012-04-17 2013-10-24 Global Solar Energy, Inc. Integrated thin film solar cell interconnection
US9864343B2 (en) * 2013-01-18 2018-01-09 Eta Sa Manufacture Horlogere Suisse Support element for a timepiece sensor
CN105164816B (zh) 2013-01-28 2017-03-08 环球太阳能公司 光伏互连系统、装置和方法
US10750620B2 (en) 2016-12-20 2020-08-18 Philips Healthcare Informatics, Inc. Flexible circuit battery attachment devices, systems, and methods
EP3816734A1 (fr) * 2019-11-04 2021-05-05 ETA SA Manufacture Horlogère Suisse Montre electronique a cellule solaire
US11741822B2 (en) 2020-05-25 2023-08-29 Trackonomy Systems, Inc. System and method of intelligent node detecting events for border protection and security
US12475339B2 (en) 2020-05-25 2025-11-18 Trackonomy Systems, Inc. System and method for enhanced asset tracking and security for border protection and other applications
CN114487869A (zh) * 2020-11-12 2022-05-13 邑流微测股份有限公司 钮扣电池测试装置
US11869994B2 (en) * 2020-12-12 2024-01-09 Trackonomy Systems, Inc. Flexible solar-powered wireless communication device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3433888A (en) * 1967-01-24 1969-03-18 Electro Mechanisms Inc Dimensionally stable flexible laminate and printed circuits made therefrom
DE2623715A1 (de) * 1975-05-29 1977-01-20 Texas Instruments Inc Modulare schaltungsanordnung

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US3052823A (en) * 1958-06-12 1962-09-04 Rogers Corp Printed circuit structure and method of making the same
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
US3832769A (en) * 1971-05-26 1974-09-03 Minnesota Mining & Mfg Circuitry and method
US3681664A (en) * 1971-08-19 1972-08-01 Jfd Electronics Corp Trimmer capacitor for printed circuit board
US3739232A (en) * 1972-04-10 1973-06-12 Northrop Corp Interconnected electrical circuit board assembly and method of fabrication
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3433888A (en) * 1967-01-24 1969-03-18 Electro Mechanisms Inc Dimensionally stable flexible laminate and printed circuits made therefrom
DE2623715A1 (de) * 1975-05-29 1977-01-20 Texas Instruments Inc Modulare schaltungsanordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JAPAN PLASTIC AGE, Vol. 10, Nr. 8, August 1972, Tokyo, Japan, T. WATANABE et al.: "Copper clad laminated boards for flixible printed circuits", Seiten 52-63 *

Also Published As

Publication number Publication date
JPS592378B2 (ja) 1984-01-18
CH616306B5 (de) 1980-09-30
DE2703358A1 (de) 1977-08-18
FR2340666B1 (ca) 1982-04-09
DE2703358C2 (de) 1983-11-24
US4064552A (en) 1977-12-20
FR2340666A1 (fr) 1977-09-02
JPS52101469A (en) 1977-08-25

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Legal Events

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