CH611059A5 - - Google Patents

Info

Publication number
CH611059A5
CH611059A5 CH684378A CH684378A CH611059A5 CH 611059 A5 CH611059 A5 CH 611059A5 CH 684378 A CH684378 A CH 684378A CH 684378 A CH684378 A CH 684378A CH 611059 A5 CH611059 A5 CH 611059A5
Authority
CH
Switzerland
Application number
CH684378A
Inventor
Friedrich Guth
Original Assignee
Texas Instruments Deutschland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Deutschland filed Critical Texas Instruments Deutschland
Publication of CH611059A5 publication Critical patent/CH611059A5/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/70Determining position or orientation of objects or cameras
    • G06T7/73Determining position or orientation of objects or cameras using feature-based methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30204Marker
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/20Image preprocessing
    • G06V10/24Aligning, centring, orientation detection or correction of the image
    • G06V10/245Aligning, centring, orientation detection or correction of the image by locating a pattern; Special marks for positioning
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Image Input (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CH684378A 1978-01-27 1978-06-22 CH611059A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2803653A DE2803653C3 (de) 1978-01-27 1978-01-27 Ausrichtvorrichtung

Publications (1)

Publication Number Publication Date
CH611059A5 true CH611059A5 (de) 1979-05-15

Family

ID=6030582

Family Applications (1)

Application Number Title Priority Date Filing Date
CH684378A CH611059A5 (de) 1978-01-27 1978-06-22

Country Status (9)

Country Link
US (2) US4352125A (de)
JP (1) JPS54148326A (de)
CH (1) CH611059A5 (de)
DE (1) DE2803653C3 (de)
ES (1) ES477151A1 (de)
FR (1) FR2434535B1 (de)
GB (1) GB2013365B (de)
IT (1) IT1114484B (de)
PT (1) PT69143A (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016673B2 (ja) * 1978-12-25 1985-04-26 川崎重工業株式会社 サ−ボ系における被検体認識装置
DE2910580C3 (de) * 1979-03-17 1982-01-21 Texas Instruments Deutschland Gmbh, 8050 Freising Ausrichtvorrichtung
US4450579A (en) * 1980-06-10 1984-05-22 Fujitsu Limited Recognition method and apparatus
DD158824A1 (de) * 1980-11-03 1983-02-02 Adelbrecht Schorcht Anordnung zur automatischen justierung mindestens eines gegenstandes
JPS57152073A (en) * 1981-03-16 1982-09-20 Ando Electric Co Ltd Original profiling reader
US4414573A (en) * 1981-04-08 1983-11-08 Ampex Corporation Pattern recognition circuit for reliably distinguishing between different portions of a diascope pattern during video camera setup
US4479145A (en) * 1981-07-29 1984-10-23 Nippon Kogaku K.K. Apparatus for detecting the defect of pattern
US4500968A (en) * 1982-06-29 1985-02-19 Domtar Inc. Paper machine wet line control
US4550374A (en) * 1982-11-15 1985-10-29 Tre Semiconductor Equipment Corporation High speed alignment method for wafer stepper
GB2131162B (en) * 1982-11-27 1986-04-30 Ferranti Plc Aligning objects
JPS59157505A (ja) * 1983-02-28 1984-09-06 Hitachi Ltd パタ−ン検査装置
JPS60122304A (ja) * 1983-11-09 1985-06-29 Shinetsu Eng Kk 自動寸法測定装置
DE3377934D1 (en) * 1983-12-28 1988-10-13 Ibm Process and equipment for the automatic alignment of an object in respect of a reference
US4688088A (en) * 1984-04-20 1987-08-18 Canon Kabushiki Kaisha Position detecting device and method
FR2570913B1 (fr) * 1984-09-24 1988-06-10 Aerospatiale Procede et dispositif d'aide au positionnement de pieces par superposition d'images
JPH0616013B2 (ja) * 1984-11-22 1994-03-02 肇産業株式会社 自動検査装置
JPH0666241B2 (ja) * 1985-10-14 1994-08-24 株式会社日立製作所 位置検出方法
US4651203A (en) * 1985-10-29 1987-03-17 At&T Technologies, Inc. Video controlled article positioning system
US4949390A (en) * 1987-04-16 1990-08-14 Applied Vision Systems, Inc. Interconnect verification using serial neighborhood processors
US4896206A (en) * 1987-12-14 1990-01-23 Electro Science Industries, Inc. Video detection system
US4998005A (en) * 1989-05-15 1991-03-05 General Electric Company Machine vision system
US5113565A (en) 1990-07-06 1992-05-19 International Business Machines Corp. Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames
US5097602A (en) * 1990-07-09 1992-03-24 Westinghouse Electric Corp. Apparatus and method for automated inspection of a surface contour on a workpiece
JPH0724278B2 (ja) * 1991-01-10 1995-03-15 信越半導体株式会社 パターンシフト測定方法
US6320624B1 (en) 1998-01-16 2001-11-20 ECOLE POLYTECHNIQUE FéDéRALE Method and system for combining video sequences with spatio-temporal alignment
US7843510B1 (en) 1998-01-16 2010-11-30 Ecole Polytechnique Federale De Lausanne Method and system for combining video sequences with spatio-temporal alignment
CN100349188C (zh) * 1999-11-24 2007-11-14 伊摩信科技有限公司 以时空同步整合视频序列的方法及系统
CH694931A5 (de) * 2000-03-17 2005-09-15 Esec Trading Sa Einrichtung fuer die Montage von Halbleiterchips auf einem Substrat.
US7392287B2 (en) 2001-03-27 2008-06-24 Hemisphere Ii Investment Lp Method and apparatus for sharing information using a handheld device
US7112812B2 (en) * 2001-12-28 2006-09-26 Applied Materials, Inc. Optical measurement apparatus
DE102006003228A1 (de) * 2006-01-24 2007-08-02 Sick Ag Vorrichtung zur Überwachung eines Schutzfeldes
JP6534316B2 (ja) * 2015-08-25 2019-06-26 日機装株式会社 漏血検出装置およびそれを用いた漏血検出方法
KR102566136B1 (ko) 2016-10-14 2023-08-10 삼성전자주식회사 계측 시스템 및 이를 사용하는 스테이지 제어 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3515877A (en) * 1965-12-13 1970-06-02 John W Massing Electro-optical positioner
US3562423A (en) * 1967-08-15 1971-02-09 Univ Northwestern Dictorial tracking and recognition system which provides display of target identified by brilliance and spatial characteristics
US3899634A (en) * 1971-05-26 1975-08-12 Western Electric Co Video controlled positioning method and apparatus
CA968439A (en) * 1971-05-26 1975-05-27 Western Electric Company, Incorporated Video controlled positioning method and apparatus
GB1401179A (en) * 1971-09-22 1975-07-16 Image Analysing Computers Ltd Automated image analysis employing automatic fucussing
JPS5214112B2 (de) * 1973-02-22 1977-04-19
US3814845A (en) * 1973-03-01 1974-06-04 Bell Telephone Labor Inc Object positioning
JPS5425782B2 (de) * 1973-03-28 1979-08-30
US3870814A (en) * 1973-09-11 1975-03-11 Mosler Safe Co Image positioning apparatus and method
US3903363A (en) * 1974-05-31 1975-09-02 Western Electric Co Automatic positioning system and method
US3958740A (en) * 1974-07-08 1976-05-25 Dixon Automation, Inc. Automatic component assembly machine and method relating thereto
US3988535A (en) * 1975-11-04 1976-10-26 Western Electric Company, Inc. Automated positioning
US4041286A (en) * 1975-11-20 1977-08-09 The Bendix Corporation Method and apparatus for detecting characteristic features of surfaces
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector
CH643959A5 (de) * 1978-04-14 1984-06-29 Siemens Ag Verfahren und vorrichtung zur automatischen lageerkennung von halbleiterchips.
US4253111A (en) * 1978-09-25 1981-02-24 Gca Corporation Apparatus for bonding leads to semiconductor chips

Also Published As

Publication number Publication date
ES477151A1 (es) 1979-07-01
JPS641832B2 (de) 1989-01-12
JPS54148326A (en) 1979-11-20
DE2803653C3 (de) 1986-05-28
GB2013365A (en) 1979-08-08
GB2013365B (en) 1982-08-18
FR2434535B1 (fr) 1986-06-27
US4364086A (en) 1982-12-14
FR2434535A1 (fr) 1980-03-21
DE2803653A1 (de) 1979-08-02
IT7947798A0 (it) 1979-01-26
DE2803653B2 (de) 1980-06-04
IT1114484B (it) 1986-01-27
PT69143A (en) 1979-02-01
US4352125A (en) 1982-09-28

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Legal Events

Date Code Title Description
PL Patent ceased