CH606500A5 - - Google Patents

Info

Publication number
CH606500A5
CH606500A5 CH1243074A CH1243074A CH606500A5 CH 606500 A5 CH606500 A5 CH 606500A5 CH 1243074 A CH1243074 A CH 1243074A CH 1243074 A CH1243074 A CH 1243074A CH 606500 A5 CH606500 A5 CH 606500A5
Authority
CH
Switzerland
Application number
CH1243074A
Inventor
Josif Dr Culjkovic
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of CH606500A5 publication Critical patent/CH606500A5/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Conductive Materials (AREA)
CH1243074A 1974-03-01 1974-09-12 CH606500A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2410441A DE2410441C2 (de) 1974-03-01 1974-03-01 Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Silber

Publications (1)

Publication Number Publication Date
CH606500A5 true CH606500A5 (xx) 1978-10-31

Family

ID=5909129

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1243074A CH606500A5 (xx) 1974-03-01 1974-09-12

Country Status (22)

Country Link
US (1) US3984292A (xx)
JP (1) JPS5413213B2 (xx)
AR (1) AR209761A1 (xx)
AT (1) AT332694B (xx)
AU (1) AU497419B2 (xx)
CA (1) CA1042836A (xx)
CH (1) CH606500A5 (xx)
CS (1) CS178182B2 (xx)
DD (1) DD114283A5 (xx)
DE (1) DE2410441C2 (xx)
ES (1) ES431700A1 (xx)
FR (1) FR2262705B1 (xx)
GB (1) GB1449792A (xx)
HU (1) HU171683B (xx)
IE (1) IE40688B1 (xx)
IT (1) IT1033325B (xx)
NL (1) NL7502446A (xx)
RO (1) RO68472A (xx)
SE (1) SE413038B (xx)
SU (1) SU612641A3 (xx)
YU (1) YU36764B (xx)
ZA (1) ZA751274B (xx)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153519A (en) * 1976-02-04 1979-05-08 Hitachi, Ltd. Silver-electroplating method using thiocyanic solution
US4067784A (en) * 1976-06-09 1978-01-10 Oxy Metal Industries Corporation Non-cyanide acidic silver electroplating bath and additive therefore
CA1081651A (en) * 1976-06-09 1980-07-15 John M. Deuber Non-cyanide electrodeposition of silver
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method
US4155817A (en) * 1978-08-11 1979-05-22 American Chemical And Refining Company, Inc. Low free cyanide high purity silver electroplating bath and method
BR8001854A (pt) * 1979-04-04 1980-11-18 Engelhard Min & Chem Banho de revestimento de prata ou liga da mesma e respectivo processo de estabilizacao
US4376682A (en) * 1980-04-07 1983-03-15 Tdc Technology Development Corporation Method for producing smooth coherent metal chalconide films
JPS61195986A (ja) * 1985-02-25 1986-08-30 Nippon Engeruharudo Kk 無光沢高速銀めつき液
JPS61195985A (ja) * 1985-02-25 1986-08-30 Nippon Engeruharudo Kk 無光沢高速銀めつき液
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
GB0508188D0 (en) * 2005-04-22 2005-06-01 Eastman Kodak Co Method of forming conductive tracks
DE102006004826B4 (de) * 2006-01-31 2013-12-05 Qimonda Ag Metall- und Cyanid-Ionen-freie Ätzlösung zur nasschemischen Strukturierung von Metallschichten in der Halbleiterindustrie und deren Verwendung in einem Ätzverfahren
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
CN103866355A (zh) * 2014-04-03 2014-06-18 苏州大学 无氰电镀银溶液及其电镀方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1857507A (en) * 1929-10-22 1932-05-10 Eastman Kodak Co Process for the separation of silver by electrolysis

Also Published As

Publication number Publication date
RO68472A (ro) 1981-09-24
YU287374A (en) 1982-06-18
JPS50120435A (xx) 1975-09-20
ZA751274B (en) 1976-01-28
DE2410441C2 (de) 1982-11-11
GB1449792A (en) 1976-09-15
HU171683B (hu) 1978-02-28
SU612641A3 (ru) 1978-06-25
IE40688B1 (en) 1979-08-01
CA1042836A (en) 1978-11-21
FR2262705A1 (xx) 1975-09-26
AU7860575A (en) 1976-08-26
DE2410441A1 (de) 1975-09-04
CS178182B2 (xx) 1977-08-31
AT332694B (de) 1976-10-11
YU36764B (en) 1984-08-31
IE40688L (en) 1975-09-01
ATA152075A (de) 1976-01-15
IT1033325B (it) 1979-07-10
NL7502446A (nl) 1975-09-03
ES431700A1 (es) 1976-09-16
US3984292A (en) 1976-10-05
DD114283A5 (xx) 1975-07-20
JPS5413213B2 (xx) 1979-05-29
AU497419B2 (en) 1978-12-14
FR2262705B1 (xx) 1978-04-21
SE413038B (sv) 1980-03-31
AR209761A1 (es) 1977-05-31

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Legal Events

Date Code Title Description
PL Patent ceased