GB0508188D0 - Method of forming conductive tracks - Google Patents

Method of forming conductive tracks

Info

Publication number
GB0508188D0
GB0508188D0 GBGB0508188.0A GB0508188A GB0508188D0 GB 0508188 D0 GB0508188 D0 GB 0508188D0 GB 0508188 A GB0508188 A GB 0508188A GB 0508188 D0 GB0508188 D0 GB 0508188D0
Authority
GB
United Kingdom
Prior art keywords
conductive tracks
forming conductive
forming
tracks
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0508188.0A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Priority to GBGB0508188.0A priority Critical patent/GB0508188D0/en
Publication of GB0508188D0 publication Critical patent/GB0508188D0/en
Priority to US11/400,928 priority patent/US20060237321A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
GBGB0508188.0A 2005-04-22 2005-04-22 Method of forming conductive tracks Ceased GB0508188D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB0508188.0A GB0508188D0 (en) 2005-04-22 2005-04-22 Method of forming conductive tracks
US11/400,928 US20060237321A1 (en) 2005-04-22 2006-04-10 Method of forming conductive tracks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0508188.0A GB0508188D0 (en) 2005-04-22 2005-04-22 Method of forming conductive tracks

Publications (1)

Publication Number Publication Date
GB0508188D0 true GB0508188D0 (en) 2005-06-01

Family

ID=34639974

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0508188.0A Ceased GB0508188D0 (en) 2005-04-22 2005-04-22 Method of forming conductive tracks

Country Status (2)

Country Link
US (1) US20060237321A1 (en)
GB (1) GB0508188D0 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070176153A1 (en) * 2006-01-31 2007-08-02 Konica Minolta Medical & Graphic, Inc. Electromagnetic wave shielding film, method of manufacturing the same, electromagnetic wave shielding film for plasma display panel, and optical film
CN102115908A (en) * 2009-12-31 2011-07-06 中国科学院微电子研究所 Method and device for removing resist
CN107164792B (en) * 2017-04-26 2019-06-18 中国原子能科学研究院 Prepare the magnetohydrodynamics electro-deposition method of high-resolution αsource

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL241541A (en) * 1959-07-22
US3424581A (en) * 1966-01-25 1969-01-28 Polaroid Corp Photographic emulsion of silver halide and derivatized gelatin capable of conducting electrical current
US3647456A (en) * 1968-12-23 1972-03-07 Ibm Method of making conductive silver images and emulsion therefor
US3551149A (en) * 1969-01-23 1970-12-29 Polaroid Corp Method of conducting electric current through developed silver halide images
US3839038A (en) * 1970-06-12 1974-10-01 Itek Corp Photosensitive silver halide layers and process
CH566398A5 (en) * 1973-06-15 1975-09-15 Battelle Memorial Institute
DE2410441C2 (en) * 1974-03-01 1982-11-11 Schering Ag, 1000 Berlin Und 4619 Bergkamen Cyanide-free bath and process for the electrodeposition of silver
US4067784A (en) * 1976-06-09 1978-01-10 Oxy Metal Industries Corporation Non-cyanide acidic silver electroplating bath and additive therefore
WO1997050280A1 (en) * 1996-06-27 1997-12-31 Asahi Kasei Kogyo Kabushiki Kaisha Thick-film conductor circuit and production method therefor
US5973387A (en) * 1997-12-18 1999-10-26 Advanced Micro Devices, Inc. Tapered isolated metal profile to reduce dielectric layer cracking
AU2765201A (en) * 2000-01-07 2001-07-24 President And Fellows Of Harvard College Fabrication of metallic microstructures via exposure of photosensitive composition
US7537800B2 (en) * 2002-12-27 2009-05-26 Fujifilm Corporation Method for producing light-transmitting electromagnetic wave-shielding film, light-transmitting electromagnetic wave-shielding film and plasma display panel using the shielding film
GB0518612D0 (en) * 2005-09-13 2005-10-19 Eastman Kodak Co A method of forming conductive tracks

Also Published As

Publication number Publication date
US20060237321A1 (en) 2006-10-26

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)