CH604376A5 - - Google Patents

Info

Publication number
CH604376A5
CH604376A5 CH1131376A CH1131376A CH604376A5 CH 604376 A5 CH604376 A5 CH 604376A5 CH 1131376 A CH1131376 A CH 1131376A CH 1131376 A CH1131376 A CH 1131376A CH 604376 A5 CH604376 A5 CH 604376A5
Authority
CH
Switzerland
Application number
CH1131376A
Inventor
Karl Dipl Phys Breuninger
Detlef Dr Haberland
Roland Herberger
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH604376A5 publication Critical patent/CH604376A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CH1131376A 1975-10-17 1976-09-07 CH604376A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2546736A DE2546736C3 (de) 1975-10-17 1975-10-17 Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
CH604376A5 true CH604376A5 (de) 1978-09-15

Family

ID=5959463

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1131376A CH604376A5 (de) 1975-10-17 1976-09-07

Country Status (7)

Country Link
US (1) US4097685A (de)
JP (1) JPS5279264A (de)
CH (1) CH604376A5 (de)
DE (1) DE2546736C3 (de)
GB (1) GB1548980A (de)
IT (1) IT1077067B (de)
SE (1) SE7611484L (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594873B2 (ja) * 1978-09-26 1984-02-01 松下電器産業株式会社 印刷配線板
JPH0547619U (ja) * 1991-12-03 1993-06-25 株式会社荒井製作所 密封装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3447038A (en) * 1966-08-01 1969-05-27 Us Navy Method and apparatus for interconnecting microelectronic circuit wafers
GB1245972A (en) * 1968-02-08 1971-09-15 Marconi Co Ltd Improvements in or relating to circuit arrangements
AT337292B (de) * 1971-09-02 1977-06-27 Siemens Ag Verfahren zur herstellung einer leiterplatte
JPS5146904B2 (de) * 1971-09-30 1976-12-11
US3806629A (en) * 1972-07-03 1974-04-23 Spacetac Inc Crossover junction

Also Published As

Publication number Publication date
DE2546736A1 (de) 1977-04-21
GB1548980A (en) 1979-07-18
DE2546736B2 (de) 1979-11-08
SE7611484L (sv) 1977-04-18
US4097685A (en) 1978-06-27
IT1077067B (it) 1985-04-27
DE2546736C3 (de) 1980-07-31
JPS5279264A (en) 1977-07-04

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Legal Events

Date Code Title Description
PL Patent ceased