CH601917A5 - - Google Patents

Info

Publication number
CH601917A5
CH601917A5 CH1352176A CH1352176A CH601917A5 CH 601917 A5 CH601917 A5 CH 601917A5 CH 1352176 A CH1352176 A CH 1352176A CH 1352176 A CH1352176 A CH 1352176A CH 601917 A5 CH601917 A5 CH 601917A5
Authority
CH
Switzerland
Application number
CH1352176A
Inventor
Patrick Dipl Ing Debruyne
Lutz Dr Niemeyer
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1352176A priority Critical patent/CH601917A5/xx
Priority to DE19762652348 priority patent/DE2652348A1/de
Priority to DE2661120A priority patent/DE2661120C2/de
Priority to JP52079777A priority patent/JPS6053469B2/ja
Priority to US05/834,263 priority patent/US4162514A/en
Priority to FR7732076A priority patent/FR2369773A1/fr
Priority to GB44330/77A priority patent/GB1552876A/en
Publication of CH601917A5 publication Critical patent/CH601917A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
CH1352176A 1976-10-27 1976-10-27 CH601917A5 (https=)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CH1352176A CH601917A5 (https=) 1976-10-27 1976-10-27
DE19762652348 DE2652348A1 (de) 1976-10-27 1976-11-17 Anordnung fuer halbleiter-hochleistungsbauelemente
DE2661120A DE2661120C2 (https=) 1976-10-27 1976-11-17
JP52079777A JPS6053469B2 (ja) 1976-10-27 1977-07-04 高電力半導体素子装置
US05/834,263 US4162514A (en) 1976-10-27 1977-09-19 Arrangement for semiconductor power components
FR7732076A FR2369773A1 (fr) 1976-10-27 1977-10-25 Montage de composant a semi-conducteurs de grande puissance
GB44330/77A GB1552876A (en) 1976-10-27 1977-10-25 Arrangement for semiconductor power components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1352176A CH601917A5 (https=) 1976-10-27 1976-10-27

Publications (1)

Publication Number Publication Date
CH601917A5 true CH601917A5 (https=) 1978-07-14

Family

ID=4393129

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1352176A CH601917A5 (https=) 1976-10-27 1976-10-27

Country Status (6)

Country Link
US (1) US4162514A (https=)
JP (1) JPS6053469B2 (https=)
CH (1) CH601917A5 (https=)
DE (2) DE2652348A1 (https=)
FR (1) FR2369773A1 (https=)
GB (1) GB1552876A (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
JPS5750008Y2 (https=) * 1978-04-22 1982-11-02
JPS54151337A (en) * 1978-05-09 1979-11-28 Fujitsu Ltd Data collector unit
CH630490A5 (de) * 1978-06-30 1982-06-15 Bbc Brown Boveri & Cie Gehaeuse fuer ein halbleiter-hochleistungsbauelement.
DE2915862C2 (de) * 1979-04-19 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenförmigem Gehäuse
JPS5635443A (en) * 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
JPS59215627A (ja) * 1983-05-23 1984-12-05 三菱電機株式会社 開閉器
JPS60100439A (ja) * 1983-11-05 1985-06-04 Mitsubishi Electric Corp 樹脂封止形半導体装置
US4931906A (en) * 1988-03-25 1990-06-05 Unitrode Corporation Hermetically sealed, surface mountable component and carrier for semiconductor devices
DE3941041A1 (de) * 1989-07-31 1991-02-07 Siemens Ag Anordnung mit einem halbleiterbauelement
DE8909244U1 (de) * 1989-07-31 1989-09-21 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement
DE9114268U1 (de) * 1991-11-15 1992-01-09 Siemens AG, 8000 München Hochspannungs-Isolierscheibe
JPH0563761U (ja) * 1992-02-12 1993-08-24 株式会社イチグチ 研磨具
DE19534607C2 (de) * 1995-09-18 2002-02-07 Eupec Gmbh & Co Kg Gehäuse mit Leistungs-Halbleiterbauelementen
DE19839422A1 (de) * 1998-08-29 2000-03-02 Asea Brown Boveri Explosionsschutz für Halbleitermodule
DE10306767A1 (de) 2003-02-18 2004-08-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleitermodul
US8183674B2 (en) 2006-09-14 2012-05-22 Siemens Aktiengesellschaft Power semiconductor module comprising an explosion protection system
DE112006004135A5 (de) * 2006-09-14 2009-08-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Leistungshalbleitermodul für die Energieverteilung mit Explosionsschutz
WO2011018106A1 (en) * 2009-08-11 2011-02-17 Abb Research Ltd. Gateway device and communication system in a process control system
CN103635998B (zh) * 2011-06-21 2016-08-17 Abb技术有限公司 具有接触机构的功率半导体壳体
WO2015172956A1 (en) * 2014-05-14 2015-11-19 Abb Technology Ag Power semiconductor device
DE102016202734A1 (de) * 2016-02-23 2017-08-24 Siemens Aktiengesellschaft Elektrische Einrichtung mit elektrischen Modulen
WO2020157960A1 (ja) * 2019-02-01 2020-08-06 三菱電機株式会社 半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA484965A (en) * 1947-03-20 1952-07-15 J. Berberich Leo Circuit interrupters embodying polytetrafluoroethylene
US2883574A (en) * 1958-04-07 1959-04-21 Ralph R Pittman Lightning arrester
US3230411A (en) * 1963-04-01 1966-01-18 Gen Electric Low voltage protective gaps provided with arc running surfaces for circulating arcs
US3274458A (en) * 1964-04-02 1966-09-20 Int Rectifier Corp Extremely high voltage silicon device
US3415963A (en) * 1964-05-15 1968-12-10 Dow Chemical Co Ethyl cellulose composition for use in arc extinguishing apparatus
GB1277201A (en) * 1968-05-24 1972-06-07 English Electric Co Ltd Improvements in semi-conductor components
US3581160A (en) * 1968-12-23 1971-05-25 Gen Electric Semiconductor rectifier assembly having high explosion rating
US3632926A (en) * 1970-04-20 1972-01-04 Gen Electric Current-limiting circuit breaker having arc extinguishing means which includes improved arc initiation and extinguishing chamber construction
US3885243A (en) * 1971-06-25 1975-05-20 Bbc Brown Boveri & Cie Semiconductor device
LU66762A1 (https=) * 1972-04-27 1973-03-15
DE2364728A1 (de) * 1973-12-27 1975-07-03 Licentia Gmbh Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung

Also Published As

Publication number Publication date
JPS6053469B2 (ja) 1985-11-26
DE2661120C2 (https=) 1990-07-12
DE2652348A1 (de) 1978-05-03
DE2652348C2 (https=) 1990-03-08
FR2369773A1 (fr) 1978-05-26
JPS5353963A (en) 1978-05-16
FR2369773B1 (https=) 1983-11-04
GB1552876A (en) 1979-09-19
US4162514A (en) 1979-07-24

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Legal Events

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