CH600569A5 - - Google Patents
Info
- Publication number
- CH600569A5 CH600569A5 CH1279776A CH1279776A CH600569A5 CH 600569 A5 CH600569 A5 CH 600569A5 CH 1279776 A CH1279776 A CH 1279776A CH 1279776 A CH1279776 A CH 1279776A CH 600569 A5 CH600569 A5 CH 600569A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y10T225/325—With means to apply moment of force to weakened work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/329—Plural breakers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/624,632 US4044937A (en) | 1975-10-21 | 1975-10-21 | Multiple ball element wafer breaking apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH600569A5 true CH600569A5 (US06653308-20031125-C00199.png) | 1978-06-15 |
Family
ID=24502723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1279776A CH600569A5 (US06653308-20031125-C00199.png) | 1975-10-21 | 1976-10-08 |
Country Status (6)
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63214365A (ja) * | 1987-03-02 | 1988-09-07 | Takeuchi Tekko Kk | 車室内薬液噴霧装置 |
| JPS63214364A (ja) * | 1987-03-02 | 1988-09-07 | Takeuchi Tekko Kk | 車室内薬液噴霧装置 |
| DE69204828T2 (de) * | 1992-06-09 | 1996-05-02 | Ibm | Herstellung von Laserdioden mit durch Spaltung erzeugten Stirnflächen auf einem vollständigen Wafer. |
| IT1274540B (it) * | 1995-05-22 | 1997-07-17 | Alcatel Italia | Metodo e dispositivo per eseguire la sfaldatura in ultra-vuoto di porzioni di wafer di semiconduttore processato |
| JP3228140B2 (ja) * | 1996-08-19 | 2001-11-12 | 松下電器産業株式会社 | 導電性ボールの搭載方法 |
| US6048747A (en) * | 1998-05-01 | 2000-04-11 | Lucent Technologies, Inc. | Laser bar cleaving apparatus |
| FR2794284B1 (fr) * | 1999-05-31 | 2001-08-10 | St Microelectronics Sa | Procede et outillage de coupe de produits semiconducteurs |
| US6551048B1 (en) * | 2000-07-12 | 2003-04-22 | National Semiconductor Corporation | Off-load system for semiconductor devices |
| JP2006024591A (ja) * | 2004-07-06 | 2006-01-26 | Hugle Electronics Inc | ブレーキングエキスパンダ |
| JP6462414B2 (ja) * | 2015-02-27 | 2019-01-30 | 株式会社ディスコ | 分割装置 |
| JP6629096B2 (ja) * | 2016-02-24 | 2020-01-15 | 株式会社ディスコ | 板状物の分割装置 |
| CN110304633B (zh) * | 2019-07-17 | 2020-12-15 | 亚洲硅业(青海)股份有限公司 | 一种还原炉硅棒出炉装置 |
| JP7309191B2 (ja) * | 2019-11-06 | 2023-07-18 | 中村留精密工業株式会社 | ウェハー分割装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3917139A (en) * | 1975-01-22 | 1975-11-04 | Nikolai Pavlovich Kabanov | Apparatus for cutting shapes out of glass sheets |
| US3040489A (en) * | 1959-03-13 | 1962-06-26 | Motorola Inc | Semiconductor dicing |
| US3562058A (en) * | 1967-05-16 | 1971-02-09 | Texas Instruments Inc | Method for breaking and separating substrate material |
| US3493155A (en) * | 1969-05-05 | 1970-02-03 | Nasa | Apparatus and method for separating a semiconductor wafer |
| US3687345A (en) * | 1970-11-23 | 1972-08-29 | Signetics Corp | Method and apparatus for aligning and breaking wafers |
| US3918150A (en) * | 1974-02-08 | 1975-11-11 | Gen Electric | System for separating a semiconductor wafer into discrete pellets |
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1975
- 1975-10-21 US US05/624,632 patent/US4044937A/en not_active Expired - Lifetime
-
1976
- 1976-09-14 FR FR7628376A patent/FR2328555A1/fr active Granted
- 1976-09-16 GB GB38424/76A patent/GB1492000A/en not_active Expired
- 1976-09-29 JP JP11607976A patent/JPS5250685A/ja active Granted
- 1976-10-08 CH CH1279776A patent/CH600569A5/xx not_active IP Right Cessation
- 1976-10-20 ES ES452562A patent/ES452562A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1492000A (en) | 1977-11-16 |
| JPS5250685A (en) | 1977-04-22 |
| JPS5320378B2 (US06653308-20031125-C00199.png) | 1978-06-26 |
| US4044937A (en) | 1977-08-30 |
| FR2328555A1 (fr) | 1977-05-20 |
| FR2328555B1 (US06653308-20031125-C00199.png) | 1978-12-15 |
| ES452562A1 (es) | 1977-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |