FR2794284B1 - Procede et outillage de coupe de produits semiconducteurs - Google Patents

Procede et outillage de coupe de produits semiconducteurs

Info

Publication number
FR2794284B1
FR2794284B1 FR9907022A FR9907022A FR2794284B1 FR 2794284 B1 FR2794284 B1 FR 2794284B1 FR 9907022 A FR9907022 A FR 9907022A FR 9907022 A FR9907022 A FR 9907022A FR 2794284 B1 FR2794284 B1 FR 2794284B1
Authority
FR
France
Prior art keywords
tools
semiconductor products
cutting semiconductor
cutting
products
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9907022A
Other languages
English (en)
Other versions
FR2794284A1 (fr
Inventor
Andre Dubois
Jean Pierre Levivier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR9907022A priority Critical patent/FR2794284B1/fr
Priority to US09/580,240 priority patent/US6418922B1/en
Publication of FR2794284A1 publication Critical patent/FR2794284A1/fr
Application granted granted Critical
Publication of FR2794284B1 publication Critical patent/FR2794284B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/329—Plural breakers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y10T225/379—Breaking tool intermediate spaced work supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR9907022A 1999-05-31 1999-05-31 Procede et outillage de coupe de produits semiconducteurs Expired - Fee Related FR2794284B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9907022A FR2794284B1 (fr) 1999-05-31 1999-05-31 Procede et outillage de coupe de produits semiconducteurs
US09/580,240 US6418922B1 (en) 1999-05-31 2000-05-26 Method and tools for cutting semiconductor products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9907022A FR2794284B1 (fr) 1999-05-31 1999-05-31 Procede et outillage de coupe de produits semiconducteurs

Publications (2)

Publication Number Publication Date
FR2794284A1 FR2794284A1 (fr) 2000-12-01
FR2794284B1 true FR2794284B1 (fr) 2001-08-10

Family

ID=9546338

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9907022A Expired - Fee Related FR2794284B1 (fr) 1999-05-31 1999-05-31 Procede et outillage de coupe de produits semiconducteurs

Country Status (2)

Country Link
US (1) US6418922B1 (fr)
FR (1) FR2794284B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW565688B (en) * 2002-09-25 2003-12-11 Au Optronics Corp Equal-arm linear glass breaker device
US7131248B2 (en) * 2003-07-14 2006-11-07 Peak Plastic & Metal Products (Int'l) Limited Wafer shipper with orientation control
US20070187286A1 (en) * 2006-02-16 2007-08-16 Pylant James D Wafer storage container and apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4044937A (en) * 1975-10-21 1977-08-30 International Business Machines Corporation Multiple ball element wafer breaking apparatus
JPH0725463B2 (ja) * 1986-07-02 1995-03-22 富士通株式会社 半導体装置の製造方法
JPS63104442A (ja) * 1986-10-22 1988-05-09 Mitsubishi Electric Corp ウエハブレ−ク装置
JP2678487B2 (ja) * 1988-12-02 1997-11-17 株式会社ディスコ 切削方法
JPH0555373A (ja) * 1991-08-26 1993-03-05 Rohm Co Ltd ウエハクラツキング方法およびその装置
US5601128A (en) * 1995-09-05 1997-02-11 Furphy; Charles F. Ampule breaking method and apparatus
US6205994B1 (en) * 1998-12-23 2001-03-27 Lucent Technologies, Inc. Scriber adapter plate

Also Published As

Publication number Publication date
US6418922B1 (en) 2002-07-16
FR2794284A1 (fr) 2000-12-01

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080131