CH592365A5 - - Google Patents
Info
- Publication number
- CH592365A5 CH592365A5 CH1675175A CH1675175A CH592365A5 CH 592365 A5 CH592365 A5 CH 592365A5 CH 1675175 A CH1675175 A CH 1675175A CH 1675175 A CH1675175 A CH 1675175A CH 592365 A5 CH592365 A5 CH 592365A5
- Authority
- CH
- Switzerland
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Media Introduction/Drainage Providing Device (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1675175A CH592365A5 (zh) | 1975-12-23 | 1975-12-23 | |
DE19762654471 DE2654471A1 (de) | 1975-12-23 | 1976-12-01 | Kontaktierkopf fuer die herstellung einer drahtverbindung an einem mikroschaltkreis |
US05/750,896 US4069961A (en) | 1975-12-23 | 1976-12-15 | Contacting head for forming a wire connection on an integrated circuit |
FR7638742A FR2336814A1 (fr) | 1975-12-23 | 1976-12-22 | Tete de formation de contacts dans un microcircuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1675175A CH592365A5 (zh) | 1975-12-23 | 1975-12-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH592365A5 true CH592365A5 (zh) | 1977-10-31 |
Family
ID=4419901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1675175A CH592365A5 (zh) | 1975-12-23 | 1975-12-23 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4069961A (zh) |
CH (1) | CH592365A5 (zh) |
DE (1) | DE2654471A1 (zh) |
FR (1) | FR2336814A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3805584A1 (de) * | 1988-02-23 | 1989-08-31 | Dynapert Delvotec Gmbh | Vorrichtung und verfahren zur gesteuerten zufuehrung eines bonddrahtes zum "wedge" oder zur kapillare eines bondkopfes |
US4928871A (en) * | 1988-02-23 | 1990-05-29 | Emhart Deutschland Gmbh | Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head |
CN112917062A (zh) * | 2021-03-11 | 2021-06-08 | 河南省锅炉压力容器安全检测研究院 | 一种密封面堆焊送丝装置 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3023772A1 (de) * | 1979-06-29 | 1981-01-15 | Texas Instruments Inc | Vorrichtung zum andruecken eines werkzeugs gegen eine arbeitsflaeche |
CH636291A5 (fr) * | 1980-07-15 | 1983-05-31 | Charmilles Sa Ateliers | Procede et dispositif pour introduire le bout d'une electrode-fil dans l'orifice de depart d'une piece a decouper par etincelage erosif. |
US4475681A (en) * | 1982-05-24 | 1984-10-09 | The Micromanipulator Co., Inc. | Bonder apparatus |
JPS5950536A (ja) * | 1982-09-16 | 1984-03-23 | Toshiba Corp | ワイヤボンデイング装置 |
DE3672530D1 (de) * | 1985-05-31 | 1990-08-16 | Dynapert Delvotec Sa | Verbindungskopf. |
US4645118A (en) * | 1985-08-29 | 1987-02-24 | Biggs Kenneth L | Method and means for threading wire bonding machines |
US4747814A (en) * | 1986-07-23 | 1988-05-31 | American Filtrona Corporation | Fiber separator |
US5977618A (en) | 1992-07-24 | 1999-11-02 | Tessera, Inc. | Semiconductor connection components and methods with releasable lead support |
US6054756A (en) | 1992-07-24 | 2000-04-25 | Tessera, Inc. | Connection components with frangible leads and bus |
WO1994003036A1 (en) * | 1992-07-24 | 1994-02-03 | Tessera, Inc. | Semiconductor connection components and methods with releasable lead support |
US5390844A (en) * | 1993-07-23 | 1995-02-21 | Tessera, Inc. | Semiconductor inner lead bonding tool |
JP3075100B2 (ja) * | 1994-10-06 | 2000-08-07 | 松下電器産業株式会社 | ワイヤボンディング装置およびワイヤボンディング方法 |
US20020151111A1 (en) * | 1995-05-08 | 2002-10-17 | Tessera, Inc. | P-connection components with frangible leads and bus |
JPH0945721A (ja) * | 1995-08-03 | 1997-02-14 | Kaijo Corp | ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置 |
CN1103179C (zh) | 1995-09-18 | 2003-03-12 | 德塞拉股份有限公司 | 微电子连接元件以及包含该元件的组件 |
US5868301A (en) * | 1996-04-10 | 1999-02-09 | Tessera, Inc. | Semiconductor inner lead bonding tool |
JPH10163246A (ja) * | 1996-11-29 | 1998-06-19 | Shinkawa Ltd | ワイヤボンディング装置 |
US5937276A (en) * | 1996-12-13 | 1999-08-10 | Tessera, Inc. | Bonding lead structure with enhanced encapsulation |
US20090308904A1 (en) * | 2006-11-09 | 2009-12-17 | Kulicke And Soffa Industries, Inc. | Wire feed system and method of operating the same |
US7954689B2 (en) * | 2007-05-04 | 2011-06-07 | Asm Technology Singapore Pte Ltd | Vacuum wire tensioner for wire bonder |
CN101862897B (zh) * | 2010-02-11 | 2013-07-03 | 深圳市贵鸿达电子有限公司 | 一种功率器件的铜线键合方法 |
TWI566875B (zh) * | 2014-02-24 | 2017-01-21 | 新川股份有限公司 | 線張力器 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL142018B (nl) * | 1964-11-26 | 1974-04-16 | Philips Nv | Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze. |
US3319859A (en) * | 1965-03-04 | 1967-05-16 | Basic Products Corp | Capillary wire feed device |
US3342396A (en) * | 1965-03-08 | 1967-09-19 | Basic Products Corp | Air spindle for bonding machines |
US3776447A (en) * | 1969-06-30 | 1973-12-04 | Texas Instruments Inc | Automatic semiconductor bonding machine |
US3643321A (en) * | 1970-06-17 | 1972-02-22 | Kulicke & Soffa Ind Inc | Method and apparatus for tailless wire bonding |
US3672556A (en) * | 1970-07-13 | 1972-06-27 | John C Diepeveen | Wire clamp |
US3727822A (en) * | 1970-10-05 | 1973-04-17 | Gen Electric | Electromagnetic force system for integrated circuit fabrication |
JPS5310425B2 (zh) * | 1974-09-13 | 1978-04-13 |
-
1975
- 1975-12-23 CH CH1675175A patent/CH592365A5/xx not_active IP Right Cessation
-
1976
- 1976-12-01 DE DE19762654471 patent/DE2654471A1/de not_active Withdrawn
- 1976-12-15 US US05/750,896 patent/US4069961A/en not_active Expired - Lifetime
- 1976-12-22 FR FR7638742A patent/FR2336814A1/fr active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3805584A1 (de) * | 1988-02-23 | 1989-08-31 | Dynapert Delvotec Gmbh | Vorrichtung und verfahren zur gesteuerten zufuehrung eines bonddrahtes zum "wedge" oder zur kapillare eines bondkopfes |
US4928871A (en) * | 1988-02-23 | 1990-05-29 | Emhart Deutschland Gmbh | Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head |
CN112917062A (zh) * | 2021-03-11 | 2021-06-08 | 河南省锅炉压力容器安全检测研究院 | 一种密封面堆焊送丝装置 |
CN112917062B (zh) * | 2021-03-11 | 2022-08-02 | 河南省锅炉压力容器安全检测研究院 | 一种密封面堆焊送丝装置 |
Also Published As
Publication number | Publication date |
---|---|
DE2654471A1 (de) | 1977-07-07 |
US4069961A (en) | 1978-01-24 |
FR2336814A1 (fr) | 1977-07-22 |
FR2336814B1 (zh) | 1982-11-19 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |