CH550255A - Verfahren zur stromlosen verkupferung von oberflaechen. - Google Patents

Verfahren zur stromlosen verkupferung von oberflaechen.

Info

Publication number
CH550255A
CH550255A CH1511570A CH1511570A CH550255A CH 550255 A CH550255 A CH 550255A CH 1511570 A CH1511570 A CH 1511570A CH 1511570 A CH1511570 A CH 1511570A CH 550255 A CH550255 A CH 550255A
Authority
CH
Switzerland
Prior art keywords
copper plating
electrically
electrically copper
plating
copper
Prior art date
Application number
CH1511570A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH550255A publication Critical patent/CH550255A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH1511570A 1969-10-16 1970-10-13 Verfahren zur stromlosen verkupferung von oberflaechen. CH550255A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6915718A NL6915718A (de) 1969-10-16 1969-10-16

Publications (1)

Publication Number Publication Date
CH550255A true CH550255A (de) 1974-06-14

Family

ID=19808149

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1511570A CH550255A (de) 1969-10-16 1970-10-13 Verfahren zur stromlosen verkupferung von oberflaechen.

Country Status (11)

Country Link
US (1) US3804638A (de)
AT (1) AT311145B (de)
AU (1) AU2101370A (de)
BE (1) BE757573A (de)
CA (1) CA947458A (de)
CH (1) CH550255A (de)
DE (1) DE2049061C3 (de)
FR (1) FR2065996A5 (de)
GB (1) GB1330332A (de)
HK (1) HK49576A (de)
NL (1) NL6915718A (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (de) * 1975-03-14 1981-06-25
US4171225A (en) 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
CA1184359A (en) * 1981-10-23 1985-03-26 Donald A. Arcilesi Metallic impurity control for electroless copper plating
IT1157006B (it) * 1982-03-09 1987-02-11 Alfachimici Spa Miscela stabilizzante per un bagno di rame chimico
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
US4563217A (en) * 1983-07-25 1986-01-07 Hitachi, Ltd. Electroless copper plating solution
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) * 1994-01-31 1999-07-20 Matsushita Electric Works, Ltd. Method of coating a copper film on a ceramic substrate
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) * 2003-07-23 2005-01-27 Jon Bengston Stabilizer for electroless copper plating solution
EP1664381A1 (de) * 2003-09-19 2006-06-07 Applied Materials, Inc. Vorrichtung und verfahren zur endpunktsbestimmung bei stromloser abscheidung
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) * 2004-09-17 2006-03-23 Applied Materials, Inc Patterned wafer thickness detection system
KR20060128739A (ko) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 비-전도성 기판의 직접적인 금속화 방법
CN105008587B (zh) * 2013-03-27 2018-04-17 埃托特克德国有限公司 化学镀铜溶液
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (zh) * 2019-08-15 2019-11-26 深南电路股份有限公司 印制线路板废水的处理方法及处理装置
CN113388829A (zh) * 2021-06-11 2021-09-14 惠州金晟新电子科技有限公司 化学镀铜液以及利用化学镀铜液镀铜基板的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US3300335A (en) * 1963-11-20 1967-01-24 Dow Chemical Co Electroless metal plating with foam
US3485643A (en) * 1966-05-06 1969-12-23 Photocircuits Corp Electroless copper plating
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating
US3515563A (en) * 1967-12-28 1970-06-02 Photocircuits Corp Autocatalytic metal plating solutions

Also Published As

Publication number Publication date
NL6915718A (de) 1971-04-20
AT311145B (de) 1973-10-25
HK49576A (en) 1976-08-06
FR2065996A5 (de) 1971-08-06
BE757573A (fr) 1971-04-15
CA947458A (en) 1974-05-21
GB1330332A (en) 1973-09-19
DE2049061B2 (de) 1980-07-24
DE2049061A1 (de) 1971-04-29
US3804638A (en) 1974-04-16
DE2049061C3 (de) 1981-04-30
AU2101370A (en) 1972-04-20

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Legal Events

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