CH524690A - Nouveau procédé de dépôt par pulvérisation cathodique, de métaux ou oxydes sur un support métallique et application dudit procédé - Google Patents

Nouveau procédé de dépôt par pulvérisation cathodique, de métaux ou oxydes sur un support métallique et application dudit procédé

Info

Publication number
CH524690A
CH524690A CH372571A CH372571A CH524690A CH 524690 A CH524690 A CH 524690A CH 372571 A CH372571 A CH 372571A CH 372571 A CH372571 A CH 372571A CH 524690 A CH524690 A CH 524690A
Authority
CH
Switzerland
Prior art keywords
oxides
metals
deposition
application
metal support
Prior art date
Application number
CH372571A
Other languages
English (en)
French (fr)
Inventor
Masotti Robert
Original Assignee
Progil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Progil filed Critical Progil
Publication of CH524690A publication Critical patent/CH524690A/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00Particle spectrometers or separator tubes
    • H01J49/44Energy spectrometers, e.g. alpha-, beta-spectrometers
    • H01J49/46Static spectrometers
    • H01J49/48Static spectrometers using electrostatic analysers, e.g. cylindrical sector, Wien filter
    • H01J49/488Static spectrometers using electrostatic analysers, e.g. cylindrical sector, Wien filter with retarding grids
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021Reactive sputtering or evaporation
    • C23C14/0036Reactive sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • C23C14/022Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • C25B11/081Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound the element being a noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Inert Electrodes (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
CH372571A 1970-04-21 1971-03-15 Nouveau procédé de dépôt par pulvérisation cathodique, de métaux ou oxydes sur un support métallique et application dudit procédé CH524690A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7014327A FR2088659A5 (enExample) 1970-04-21 1970-04-21

Publications (1)

Publication Number Publication Date
CH524690A true CH524690A (fr) 1972-06-30

Family

ID=9054289

Family Applications (1)

Application Number Title Priority Date Filing Date
CH372571A CH524690A (fr) 1970-04-21 1971-03-15 Nouveau procédé de dépôt par pulvérisation cathodique, de métaux ou oxydes sur un support métallique et application dudit procédé

Country Status (17)

Country Link
US (1) US3773639A (enExample)
JP (1) JPS5324914B1 (enExample)
AT (1) AT304990B (enExample)
BE (1) BE766023A (enExample)
BR (1) BR7102391D0 (enExample)
CA (1) CA933881A (enExample)
CH (1) CH524690A (enExample)
DE (1) DE2119066A1 (enExample)
ES (1) ES390345A1 (enExample)
FR (1) FR2088659A5 (enExample)
GB (1) GB1307956A (enExample)
IL (1) IL36656A (enExample)
LU (1) LU63024A1 (enExample)
NL (1) NL7105157A (enExample)
PL (1) PL83268B1 (enExample)
RO (1) RO61059A (enExample)
SE (1) SE366345B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2320565A1 (fr) * 1973-04-12 1977-03-04 Radiotechnique Compelec Plaque a transparence selective et son procede de fabrication
AU507748B2 (en) * 1976-06-10 1980-02-28 University Of Sydney, The Reactive sputtering
DE2630883C2 (de) * 1976-07-09 1985-02-07 Basf Ag, 6700 Ludwigshafen Verwendung einer nach dem Plasma- oder Flammspritzverfahren auf einem metallischen Träger aufgebrachten porösen anorganische Oxide enthaltenden Schicht als Diaphragma in einer Elektrolysezelle
AU5889880A (en) * 1979-07-02 1981-01-15 Olin Corporation Manufacture of low overvoltage electrodes by cathodic sputtering
US4400255A (en) * 1981-06-29 1983-08-23 General Motors Corporation Control of electron bombardment of the exhaust oxygen sensor during electrode sputtering
US4420385A (en) * 1983-04-15 1983-12-13 Gryphon Products Apparatus and process for sputter deposition of reacted thin films
EP0446657B1 (en) * 1990-03-02 1995-07-26 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
US5202008A (en) * 1990-03-02 1993-04-13 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
US5391275A (en) * 1990-03-02 1995-02-21 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
US5429843A (en) * 1991-11-21 1995-07-04 Nisshin Steel Co., Ltd. Vapor deposition for formation of plating layer
EP0593372B1 (en) * 1992-10-14 2001-09-19 Daiki Engineering Co., Ltd. Highly durable electrodes for eletrolysis and a method for preparation thereof
CA2154428C (fr) * 1995-07-21 2005-03-22 Robert Schulz Alliages a base de ti, ru, fe et o et usage de ceux-ci pour la fabrication de cathodes pour la synthese electrochimique du chlorate de sodium
FR2861219B1 (fr) * 2003-10-15 2006-04-07 Commissariat Energie Atomique Pile a combustible alcaline comportant une anode comprenant de l'aluminium et du zinc et procede de fabrication de l'anode
US20050205415A1 (en) * 2004-03-19 2005-09-22 Belousov Igor V Multi-component deposition
ITMI20091621A1 (it) * 2009-09-23 2011-03-24 Industrie De Nora Spa Elettrodo per processi elettrolitici con struttura cristallina controllata
JP4734664B1 (ja) * 2010-09-17 2011-07-27 田中貴金属工業株式会社 電解用電極、オゾン電解生成用陽極、過硫酸電解生成用陽極及びクロム電解酸化用陽極
WO2015183128A1 (ru) * 2014-05-30 2015-12-03 Общество С Ограниченной Ответственностью "Эй Ти Энерджи" Способ изготовления катализатора на основе платины и катализатор на основе платины
RU2562462C1 (ru) * 2014-05-30 2015-09-10 Общество с ограниченной ответственностью "Эй Ти Энерджи", ООО "Эй Ти Энерджи" Способ изготовления катализатора на основе платины и катализатор на основе платины

Also Published As

Publication number Publication date
NL7105157A (enExample) 1971-10-25
CA933881A (en) 1973-09-18
GB1307956A (en) 1973-02-21
DE2119066A1 (de) 1971-11-04
RO61059A (enExample) 1976-10-15
BR7102391D0 (pt) 1973-05-03
IL36656A0 (en) 1971-06-23
US3773639A (en) 1973-11-20
PL83268B1 (enExample) 1975-12-31
BE766023A (fr) 1971-10-20
FR2088659A5 (enExample) 1972-01-07
LU63024A1 (enExample) 1972-12-11
SE366345B (enExample) 1974-04-22
AT304990B (de) 1973-02-12
IL36656A (en) 1974-01-14
ES390345A1 (es) 1973-06-01
JPS5324914B1 (enExample) 1978-07-24

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Legal Events

Date Code Title Description
PL Patent ceased