CH512305A - Machine à découper en éléments un matériau fragile, notamment cristallin - Google Patents
Machine à découper en éléments un matériau fragile, notamment cristallinInfo
- Publication number
- CH512305A CH512305A CH1819067A CH1819067A CH512305A CH 512305 A CH512305 A CH 512305A CH 1819067 A CH1819067 A CH 1819067A CH 1819067 A CH1819067 A CH 1819067A CH 512305 A CH512305 A CH 512305A
- Authority
- CH
- Switzerland
- Prior art keywords
- découper
- crystallin
- notamment
- éléments
- machine
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR88986A FR1512501A (fr) | 1966-12-27 | 1966-12-27 | Perfectionnements apportés aux machines à scier des éléments en matériaux fragiles, notamment cristallins |
Publications (1)
Publication Number | Publication Date |
---|---|
CH512305A true CH512305A (it) | 1971-09-15 |
Family
ID=8623000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1819067A CH512305A (it) | 1966-12-27 | 1967-12-27 | Machine à découper en éléments un matériau fragile, notamment cristallin |
Country Status (6)
Country | Link |
---|---|
US (1) | US3525324A (it) |
CH (1) | CH512305A (it) |
DE (1) | DE1652513C3 (it) |
FR (1) | FR1512501A (it) |
GB (1) | GB1158459A (it) |
NL (1) | NL154687B (it) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3831576A (en) * | 1971-11-22 | 1974-08-27 | Motorola Inc | Machine and method for cutting brittle materials using a reciprocating cutting wire |
FR2254948A5 (en) * | 1973-12-18 | 1975-07-11 | Motorola Inc | Brittle material cutting mechanism - has grooved pulleys on axes inclined to each other guiding moving cutting wire |
CH614151A5 (it) * | 1976-12-27 | 1979-11-15 | Meyer & Burger Maschinenfabrik | |
US4185609A (en) * | 1978-06-23 | 1980-01-29 | Frank Petera | Band type lapidary saw |
US4393450A (en) * | 1980-08-11 | 1983-07-12 | Trustees Of Dartmouth College | Three-dimensional model-making system |
US4766875A (en) * | 1982-11-22 | 1988-08-30 | Stanford University | Endless wire saw having material recovery capability |
US4574769A (en) * | 1984-02-18 | 1986-03-11 | Ishikawa Ken Ichi | Multi-wire vibratory cutting method and apparatus |
JPS61168466A (ja) * | 1985-01-21 | 1986-07-30 | Yasunaga Eng Kk | 加工物微速押上装置 |
CH672452A5 (it) * | 1987-08-21 | 1989-11-30 | Photec S A | |
JP2673544B2 (ja) * | 1988-06-14 | 1997-11-05 | 株式会社日平トヤマ | 脆性材料の切断方法 |
US4972680A (en) * | 1989-09-26 | 1990-11-27 | Cox Richard G | Conversion kit for vehicle air conditioning circuit suction throttling valves |
WO1991012915A1 (fr) * | 1990-03-01 | 1991-09-05 | Charles Hauser | Dispositif pour un sciage industriel de pieces en tranches fines |
JP2516717B2 (ja) * | 1991-11-29 | 1996-07-24 | 信越半導体株式会社 | ワイヤソ―及びその切断方法 |
US5564409A (en) * | 1995-06-06 | 1996-10-15 | Corning Incorporated | Apparatus and method for wire cutting glass-ceramic wafers |
CH691038A5 (fr) * | 1996-02-06 | 2001-04-12 | Hct Shaping Systems Sa | Dispositif de sciage par fil pour le découpe de tranches fines. |
CZ283541B6 (cs) * | 1996-03-06 | 1998-04-15 | Trimex Tesla, S.R.O. | Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu |
DE19818484A1 (de) * | 1998-04-24 | 1999-10-28 | Wacker Siltronic Halbleitermat | Verfahren zum Abtrennen einer Halbleiterscheibe |
JP5054943B2 (ja) * | 2006-08-04 | 2012-10-24 | Towa株式会社 | 切断装置及び切断方法 |
JP4995510B2 (ja) * | 2006-08-04 | 2012-08-08 | Towa株式会社 | 切断装置及び切断方法 |
JP2008100298A (ja) * | 2006-10-17 | 2008-05-01 | Seiko Epson Corp | マルチワイヤソー装置及びマルチワイヤソー装置の調整方法 |
US9217118B2 (en) | 2009-10-16 | 2015-12-22 | Dow Global Technologies Llc | Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries |
CN102159691B (zh) | 2009-10-16 | 2013-11-06 | 陶氏环球技术有限责任公司 | 与金刚石线锯联用的含水切削液 |
WO2011044716A1 (en) | 2009-10-16 | 2011-04-21 | Dow Global Technologies Llc | Cutting fluids with improved performance |
WO2014086024A1 (en) | 2012-12-06 | 2014-06-12 | Dow Global Technologies Llc | Aqueous cutting fluid composition |
-
1966
- 1966-12-27 FR FR88986A patent/FR1512501A/fr not_active Expired
-
1967
- 1967-06-15 US US646392A patent/US3525324A/en not_active Expired - Lifetime
- 1967-06-19 GB GB28176/67A patent/GB1158459A/en not_active Expired
- 1967-06-20 DE DE1652513A patent/DE1652513C3/de not_active Expired
- 1967-07-11 NL NL676709582A patent/NL154687B/xx unknown
- 1967-12-27 CH CH1819067A patent/CH512305A/it not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE1652513A1 (de) | 1971-03-25 |
DE1652513C3 (de) | 1975-11-27 |
US3525324A (en) | 1970-08-25 |
NL154687B (nl) | 1977-10-17 |
FR1512501A (fr) | 1968-02-09 |
NL6709582A (it) | 1968-06-28 |
GB1158459A (en) | 1969-07-16 |
DE1652513B2 (de) | 1975-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |