CH499628A - Verfahren zum Aufwachsen von dünnen, nichtleitenden Schichten - Google Patents
Verfahren zum Aufwachsen von dünnen, nichtleitenden SchichtenInfo
- Publication number
- CH499628A CH499628A CH1376868A CH1376868A CH499628A CH 499628 A CH499628 A CH 499628A CH 1376868 A CH1376868 A CH 1376868A CH 1376868 A CH1376868 A CH 1376868A CH 499628 A CH499628 A CH 499628A
- Authority
- CH
- Switzerland
- Prior art keywords
- conductive layers
- growing thin
- growing
- thin
- conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66811467A | 1967-09-15 | 1967-09-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH499628A true CH499628A (de) | 1970-11-30 |
Family
ID=24681074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1376868A CH499628A (de) | 1967-09-15 | 1968-09-13 | Verfahren zum Aufwachsen von dünnen, nichtleitenden Schichten |
Country Status (7)
Country | Link |
---|---|
US (1) | US3617459A (de) |
CH (1) | CH499628A (de) |
DE (1) | DE1790094B1 (de) |
FR (1) | FR1586445A (de) |
GB (1) | GB1181560A (de) |
NL (1) | NL163367C (de) |
SE (1) | SE359719B (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3767551A (en) * | 1971-11-01 | 1973-10-23 | Varian Associates | Radio frequency sputter apparatus and method |
US3860507A (en) * | 1972-11-29 | 1975-01-14 | Rca Corp | Rf sputtering apparatus and method |
GB1485266A (en) * | 1973-11-20 | 1977-09-08 | Atomic Energy Authority Uk | Storage of material |
US4131533A (en) * | 1977-12-30 | 1978-12-26 | International Business Machines Corporation | RF sputtering apparatus having floating anode shield |
US4268374A (en) * | 1979-08-09 | 1981-05-19 | Bell Telephone Laboratories, Incorporated | High capacity sputter-etching apparatus |
US4333814A (en) * | 1979-12-26 | 1982-06-08 | Western Electric Company, Inc. | Methods and apparatus for improving an RF excited reactive gas plasma |
US4693805A (en) * | 1986-02-14 | 1987-09-15 | Boe Limited | Method and apparatus for sputtering a dielectric target or for reactive sputtering |
US4818359A (en) * | 1986-08-27 | 1989-04-04 | International Business Machines Corporation | Low contamination RF sputter deposition apparatus |
JPS6358834A (ja) * | 1986-08-27 | 1988-03-14 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | スパッタリング装置 |
US4802968A (en) * | 1988-01-29 | 1989-02-07 | International Business Machines Corporation | RF plasma processing apparatus |
DE3821207A1 (de) * | 1988-06-23 | 1989-12-28 | Leybold Ag | Anordnung zum beschichten eines substrats mit dielektrika |
US5946013A (en) * | 1992-12-22 | 1999-08-31 | Canon Kabushiki Kaisha | Ink jet head having a protective layer with a controlled argon content |
DE4301189C2 (de) * | 1993-01-19 | 2000-12-14 | Leybold Ag | Vorrichtung zum Beschichten von Substraten |
DE4301188C2 (de) * | 1993-01-19 | 2001-05-31 | Leybold Ag | Vorrichtung zum Beschichten oder Ätzen von Substraten |
US5849372A (en) * | 1993-09-17 | 1998-12-15 | Isis Innovation Limited | RF plasma reactor and methods of generating RF plasma |
WO1996034124A1 (en) * | 1995-04-25 | 1996-10-31 | The Boc Group, Inc. | Sputtering system using cylindrical rotating magnetron electrically powered using alternating current |
EP0774772A1 (de) * | 1995-11-17 | 1997-05-21 | Applied Materials, Inc. | Verfahren zum physikalischen Ätzen von elektrisch leitenden Siliziumoberflächen |
US6095084A (en) * | 1996-02-02 | 2000-08-01 | Applied Materials, Inc. | High density plasma process chamber |
US6478924B1 (en) | 2000-03-07 | 2002-11-12 | Applied Materials, Inc. | Plasma chamber support having dual electrodes |
US6730609B2 (en) * | 2001-10-09 | 2004-05-04 | Micron Technology, Inc. | Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device |
US6843880B2 (en) * | 2002-05-24 | 2005-01-18 | International Business Machines Corporation | Enhanced endpoint detection for wet etch process control |
US7767056B2 (en) * | 2003-01-14 | 2010-08-03 | Canon Anelva Corporation | High-frequency plasma processing apparatus |
JP4326895B2 (ja) * | 2003-09-25 | 2009-09-09 | キヤノンアネルバ株式会社 | スパッタリング装置 |
US8052799B2 (en) * | 2006-10-12 | 2011-11-08 | International Business Machines Corporation | By-product collecting processes for cleaning processes |
JP4317888B2 (ja) * | 2007-08-31 | 2009-08-19 | 富士フイルム株式会社 | スパッタ方法およびスパッタ装置 |
US8540851B2 (en) * | 2009-02-19 | 2013-09-24 | Fujifilm Corporation | Physical vapor deposition with impedance matching network |
US8557088B2 (en) * | 2009-02-19 | 2013-10-15 | Fujifilm Corporation | Physical vapor deposition with phase shift |
US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
JP5596402B2 (ja) * | 2010-04-19 | 2014-09-24 | 株式会社日立ハイテクノロジーズ | 分析装置、イオン化装置及び分析方法 |
US10964590B2 (en) * | 2017-11-15 | 2021-03-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Contact metallization process |
US10790466B2 (en) * | 2018-12-11 | 2020-09-29 | Feng-wen Yen | In-line system for mass production of organic optoelectronic device and manufacturing method using the same system |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL136984C (de) * | 1964-06-04 | |||
US3451917A (en) * | 1966-01-10 | 1969-06-24 | Bendix Corp | Radio frequency sputtering apparatus |
US3461054A (en) * | 1966-03-24 | 1969-08-12 | Bell Telephone Labor Inc | Cathodic sputtering from a cathodically biased target electrode having an rf potential superimposed on the cathodic bias |
-
1967
- 1967-09-15 US US668114A patent/US3617459A/en not_active Expired - Lifetime
-
1968
- 1968-08-19 FR FR1586445D patent/FR1586445A/fr not_active Expired
- 1968-08-26 NL NL6812114.A patent/NL163367C/xx not_active IP Right Cessation
- 1968-09-11 DE DE19681790094 patent/DE1790094B1/de not_active Withdrawn
- 1968-09-12 GB GB43382/68A patent/GB1181560A/en not_active Expired
- 1968-09-13 CH CH1376868A patent/CH499628A/de not_active IP Right Cessation
- 1968-09-13 SE SE12357/68A patent/SE359719B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
NL163367C (nl) | 1980-08-15 |
DE1790094B1 (de) | 1972-02-03 |
GB1181560A (en) | 1970-02-18 |
SE359719B (de) | 1973-09-03 |
FR1586445A (de) | 1970-02-20 |
NL163367B (nl) | 1980-03-17 |
US3617459A (en) | 1971-11-02 |
NL6812114A (de) | 1969-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |