CH488289A - Verfahren zur Herstellung einer mehrlagigen mikroelektronischen Schaltung - Google Patents

Verfahren zur Herstellung einer mehrlagigen mikroelektronischen Schaltung

Info

Publication number
CH488289A
CH488289A CH822269A CH822269A CH488289A CH 488289 A CH488289 A CH 488289A CH 822269 A CH822269 A CH 822269A CH 822269 A CH822269 A CH 822269A CH 488289 A CH488289 A CH 488289A
Authority
CH
Switzerland
Prior art keywords
manufacturing
microelectronic circuit
multilayer microelectronic
multilayer
circuit
Prior art date
Application number
CH822269A
Other languages
English (en)
Inventor
Martin Dr Schmidtke
Winfried Dr Ruettenauer
Penzl Reinhold
Vollmer Brigitte
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH488289A publication Critical patent/CH488289A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CH822269A 1968-08-27 1969-05-29 Verfahren zur Herstellung einer mehrlagigen mikroelektronischen Schaltung CH488289A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1790023 1968-08-27

Publications (1)

Publication Number Publication Date
CH488289A true CH488289A (de) 1970-03-31

Family

ID=5706845

Family Applications (1)

Application Number Title Priority Date Filing Date
CH822269A CH488289A (de) 1968-08-27 1969-05-29 Verfahren zur Herstellung einer mehrlagigen mikroelektronischen Schaltung

Country Status (6)

Country Link
US (1) US3646305A (de)
BE (1) BE738049A (de)
CH (1) CH488289A (de)
FR (1) FR2016436A1 (de)
GB (1) GB1237481A (de)
NL (1) NL6911985A (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1349174A (en) * 1971-08-05 1974-03-27 Electricity Council Making of connections in electrical power distribution systems
US3842489A (en) * 1971-10-18 1974-10-22 Nuclear Battery Corp Process for treating thermopile
US4350866A (en) * 1977-10-11 1982-09-21 Fujitsu Limited Discharge device and method for use in processing semiconductor devices
US4216423A (en) * 1977-11-21 1980-08-05 Mb Associates Apparatus and method for enhancing electrical conductivity of conductive composites and products thereof
US4383942A (en) * 1977-11-21 1983-05-17 Mb Associates Apparatus and method for enhancing electrical conductivity of conductive composites and products thereof
US4458129A (en) * 1979-11-29 1984-07-03 Fujitsu, Limited Discharge device and method for use in processing semiconductor devices
US4543594A (en) * 1982-09-07 1985-09-24 Intel Corporation Fusible link employing capacitor structure
US4570046A (en) * 1983-09-09 1986-02-11 Gte Products Corporation Method of processing PTC heater
US20180099347A1 (en) * 2016-10-07 2018-04-12 GM Global Technology Operations LLC Apparatus for Improving Weld Uniformity

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3073943A (en) * 1954-05-11 1963-01-15 Int Standard Electric Corp Manufacture of electrical capacitors
US3324706A (en) * 1960-06-15 1967-06-13 Microdot Inc Apparatus for temperature compensation of strain gages
US3206340A (en) * 1960-06-22 1965-09-14 Westinghouse Electric Corp Process for treating semiconductors
US3261082A (en) * 1962-03-27 1966-07-19 Ibm Method of tailoring thin film impedance devices
US3271591A (en) * 1963-09-20 1966-09-06 Energy Conversion Devices Inc Symmetrical current controlling device
US3308528A (en) * 1963-11-06 1967-03-14 Ibm Fabrication of cermet film resistors to close tolerances
US3402448A (en) * 1966-05-04 1968-09-24 Bunker Ramo Thin film capacitor and method of adjusting the capacitance thereof
US3457637A (en) * 1967-02-06 1969-07-29 Gen Instrument Corp Method for trimming cermet resistors

Also Published As

Publication number Publication date
US3646305A (en) 1972-02-29
NL6911985A (de) 1970-03-03
FR2016436A1 (de) 1970-05-08
BE738049A (de) 1970-02-27
GB1237481A (en) 1971-06-30

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Legal Events

Date Code Title Description
PL Patent ceased