CH488263A - Verfahren zur Herstellung eines magnetischen Bauteiles mit einem Magnetkern und denselben umgebenden Wicklungen - Google Patents

Verfahren zur Herstellung eines magnetischen Bauteiles mit einem Magnetkern und denselben umgebenden Wicklungen

Info

Publication number
CH488263A
CH488263A CH1858968A CH1858968A CH488263A CH 488263 A CH488263 A CH 488263A CH 1858968 A CH1858968 A CH 1858968A CH 1858968 A CH1858968 A CH 1858968A CH 488263 A CH488263 A CH 488263A
Authority
CH
Switzerland
Prior art keywords
production
same
magnetic
windings surrounding
magnetic core
Prior art date
Application number
CH1858968A
Other languages
German (de)
English (en)
Inventor
Clark Kendall
Edwin Herrmann Karl
Allen Klein William
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH488263A publication Critical patent/CH488263A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/007—Electroplating using magnetic fields, e.g. magnets
    • C25D5/009—Deposition of ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
CH1858968A 1967-12-26 1968-12-16 Verfahren zur Herstellung eines magnetischen Bauteiles mit einem Magnetkern und denselben umgebenden Wicklungen CH488263A (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US69337567A 1967-12-26 1967-12-26
US69803168A 1968-01-15 1968-01-15
US2570870A 1970-04-06 1970-04-06

Publications (1)

Publication Number Publication Date
CH488263A true CH488263A (de) 1970-03-31

Family

ID=27362610

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1858968A CH488263A (de) 1967-12-26 1968-12-16 Verfahren zur Herstellung eines magnetischen Bauteiles mit einem Magnetkern und denselben umgebenden Wicklungen

Country Status (5)

Country Link
US (2) US3477051A (fr)
CH (1) CH488263A (fr)
FR (2) FR1593893A (fr)
GB (2) GB1189074A (fr)
NL (1) NL6900382A (fr)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103267A (en) * 1977-06-13 1978-07-25 Burr-Brown Research Corporation Hybrid transformer device
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US4509024A (en) * 1983-01-26 1985-04-02 Safetran Systems Corporation Impedance bond
EP0188095A1 (fr) * 1984-12-13 1986-07-23 East Rock Technology Inc. Procédé pour la fabrication d'un ballast inductif toroidal et machine utilisant ce procédé
US4696729A (en) * 1986-02-28 1987-09-29 International Business Machines Electroplating cell
FR2656951A1 (fr) * 1990-01-05 1991-07-12 Scherrer Fernand Transformateur de type torique.
DE4027994A1 (de) * 1990-09-04 1992-03-05 Gw Elektronik Gmbh Hf-magnetspulenanordnung und verfahren zu ihrer herstellung
US5312532A (en) * 1993-01-15 1994-05-17 International Business Machines Corporation Multi-compartment eletroplating system
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US5516412A (en) * 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
US5522975A (en) * 1995-05-16 1996-06-04 International Business Machines Corporation Electroplating workpiece fixture
US6946716B2 (en) * 1995-12-29 2005-09-20 International Business Machines Corporation Electroplated interconnection structures on integrated circuit chips
US6709562B1 (en) 1995-12-29 2004-03-23 International Business Machines Corporation Method of making electroplated interconnection structures on integrated circuit chips
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer
US6106687A (en) * 1998-04-28 2000-08-22 International Business Machines Corporation Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US6251251B1 (en) 1998-11-16 2001-06-26 International Business Machines Corporation Anode design for semiconductor deposition
AU1731000A (en) * 1998-11-18 2000-07-12 Johns Hopkins University, The Bismuth thin film structure and method of construction
US6113759A (en) * 1998-12-18 2000-09-05 International Business Machines Corporation Anode design for semiconductor deposition having novel electrical contact assembly
US6261426B1 (en) 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
US6454918B1 (en) * 1999-03-23 2002-09-24 Electroplating Engineers Of Japan Limited Cup type plating apparatus
KR19990064747A (ko) * 1999-05-06 1999-08-05 이종구 Ｎｉ-Ｆｅ 합금 박판 제조방법 및 그 장치
US6547937B1 (en) * 2000-01-03 2003-04-15 Semitool, Inc. Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
US8475636B2 (en) * 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US7622024B1 (en) * 2000-05-10 2009-11-24 Novellus Systems, Inc. High resistance ionic current source
US6527920B1 (en) 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
US6669833B2 (en) * 2000-10-30 2003-12-30 International Business Machines Corporation Process and apparatus for electroplating microscopic features uniformly across a large substrate
US6869515B2 (en) 2001-03-30 2005-03-22 Uri Cohen Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings
US7682498B1 (en) 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
US7569131B2 (en) * 2002-08-12 2009-08-04 International Business Machines Corporation Method for producing multiple magnetic layers of materials with known thickness and composition using a one-step electrodeposition process
US6955747B2 (en) * 2002-09-23 2005-10-18 International Business Machines Corporation Cam driven paddle assembly for a plating cell
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US20040084318A1 (en) * 2002-11-05 2004-05-06 Uri Cohen Methods and apparatus for activating openings and for jets plating
US20050050767A1 (en) * 2003-06-06 2005-03-10 Hanson Kyle M. Wet chemical processing chambers for processing microfeature workpieces
US7313462B2 (en) * 2003-06-06 2007-12-25 Semitool, Inc. Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces
US7390382B2 (en) * 2003-07-01 2008-06-24 Semitool, Inc. Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
US7393439B2 (en) * 2003-06-06 2008-07-01 Semitool, Inc. Integrated microfeature workpiece processing tools with registration systems for paddle reactors
WO2004110698A2 (fr) * 2003-06-06 2004-12-23 Semitool, Inc. Procedes et systemes de traitement de pieces a microtraits avec des agitateurs de flux et/ou des electrodes multiples
US20050063798A1 (en) * 2003-06-06 2005-03-24 Davis Jeffry Alan Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces
US6881437B2 (en) * 2003-06-16 2005-04-19 Blue29 Llc Methods and system for processing a microelectronic topography
US20070144912A1 (en) * 2003-07-01 2007-06-28 Woodruff Daniel J Linearly translating agitators for processing microfeature workpieces, and associated methods
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
WO2006033315A1 (fr) * 2004-09-24 2006-03-30 Ibiden Co., Ltd. Procede et appareil de placage
DE112006003151T5 (de) * 2005-11-23 2008-12-24 Semitool, Inc., Kalispell Vorrichtung und Verfahren zum Bewegen von Flüssigkeiten in nasschemischen Prozessen von Mikrostruktur-Werkstücken
JP5270576B2 (ja) * 2007-01-11 2013-08-21 プラナーマグ インコーポレイテッド 平面型広帯域トランス
US20080178460A1 (en) * 2007-01-29 2008-07-31 Woodruff Daniel J Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods
US7799684B1 (en) 2007-03-05 2010-09-21 Novellus Systems, Inc. Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US20090134039A1 (en) * 2007-11-28 2009-05-28 Mehlin Dean Matthews System and method for isotope selective chemical reacations
US8177944B2 (en) * 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
US7964506B1 (en) 2008-03-06 2011-06-21 Novellus Systems, Inc. Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8703615B1 (en) 2008-03-06 2014-04-22 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8513124B1 (en) 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
JP5155755B2 (ja) * 2008-07-10 2013-03-06 株式会社荏原製作所 磁性体膜めっき装置及びめっき処理設備
US8475637B2 (en) * 2008-12-17 2013-07-02 Novellus Systems, Inc. Electroplating apparatus with vented electrolyte manifold
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US9664711B2 (en) * 2009-07-31 2017-05-30 Pulse Electronics, Inc. Current sensing devices and methods
US9151782B2 (en) * 2009-07-31 2015-10-06 Pulse Electronics, Inc. Current sensing devices and methods
US9823274B2 (en) * 2009-07-31 2017-11-21 Pulse Electronics, Inc. Current sensing inductive devices
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
FR2966282B1 (fr) 2010-10-18 2013-02-15 Nexcis Controle de la stoechiometrie de couches i-iii-vi pour des applications photovoltaiques a partir de conditions d'electrolyse perfectionnees.
US20120249107A1 (en) * 2011-04-01 2012-10-04 Cowley Nicholas P Coupled inductor to facilitate integrated power delivery
US8575028B2 (en) 2011-04-15 2013-11-05 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
US9304149B2 (en) 2012-05-31 2016-04-05 Pulse Electronics, Inc. Current sensing devices and methods
US8920616B2 (en) * 2012-06-18 2014-12-30 Headway Technologies, Inc. Paddle for electroplating for selectively depositing greater thickness
US20140125446A1 (en) 2012-11-07 2014-05-08 Pulse Electronics, Inc. Substrate inductive device methods and apparatus
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9677190B2 (en) 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
JP6411943B2 (ja) * 2014-05-26 2018-10-24 株式会社荏原製作所 基板電解処理装置、および該基板電解処理装置に使用されるパドル
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
DE102015104838B4 (de) * 2015-03-30 2018-07-19 Harting Electric Gmbh & Co. Kg Sensormodul eines modularen Steckverbinders
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
DE102015213499A1 (de) * 2015-07-17 2017-01-19 SUMIDA Components & Modules GmbH Spulenkörper
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US10573458B2 (en) * 2016-10-05 2020-02-25 The Boeing Company Superconducting air core inductor systems and methods
DE102017109499A1 (de) * 2017-05-03 2018-11-08 Valeo Siemens Eautomotive Germany Gmbh Inverter
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
JP6790016B2 (ja) * 2018-04-10 2020-11-25 上村工業株式会社 表面処理装置、表面処理方法及びパドル
CN108893771B (zh) * 2018-07-25 2020-01-17 河南理工大学 一种正多边形柱体阳极及电沉积制备大面积金属微结构的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2826747A (en) * 1956-10-24 1958-03-11 Dinion Coil Co Inc Pulse transformer construction
US3008108A (en) * 1956-11-13 1961-11-07 Burroughs Corp Toroidal coils
US2982888A (en) * 1957-05-23 1961-05-02 Rea Magnet Wire Company Inc Sleeve type encapsulated electrical component
BE638864A (fr) * 1962-10-31
US3319207A (en) * 1963-07-18 1967-05-09 Davis Jesse Grooved toroidal body with metal filling
US3287795A (en) * 1964-06-05 1966-11-29 Western Electric Co Methods of assembling electrical components with circuits
US3377699A (en) * 1965-05-03 1968-04-16 Western Electric Co Fluidized bed coating a core containing metal board, including circuit forming, core wiring and connecting steps
US3316517A (en) * 1965-05-19 1967-04-25 Cons Electronics Ind Variable transformer with winding holding core housing
US3427231A (en) * 1965-07-21 1969-02-11 Litton Systems Inc Method of electroplating and electroforming gold in an ultrasonic field
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly

Also Published As

Publication number Publication date
DE1900392A1 (de) 1969-07-31
FR1593898A (fr) 1970-06-01
GB1189074A (en) 1970-04-22
US3477051A (en) 1969-11-04
US3652442A (en) 1972-03-28
DE1900392B2 (de) 1972-07-06
FR1593893A (fr) 1970-06-01
GB1242080A (en) 1971-08-11
NL6900382A (fr) 1969-07-17

Similar Documents

Publication Publication Date Title
CH488263A (de) Verfahren zur Herstellung eines magnetischen Bauteiles mit einem Magnetkern und denselben umgebenden Wicklungen
CH456790A (de) Verfahren zur Herstellung eines Supraleiters
CH457627A (de) Halbleiterbauelement mit einem Metallkontakt und Verfahren zur Herstellung eines Halbleiterbauelementes
AT282802B (de) Verfahren und Vorrichtung zur Herstellung eines Fadenbandes
AT295878B (de) Verfahren zur Herstellung eines magnetischen Übertragers
AT290265B (de) Verfahren zur Herstellung eines Blechpaketes
CH530453A (de) Verfahren zur Herstellung eines Kunstharzlackes
AT286086B (de) Verfahren zur Herstellung eines Präparates mit Fleischgeschmack
AT279186B (de) Verfahren zur Herstellung eines Laminants
CH454292A (de) Verfahren zur Herstellung eines nuklearen Brennstoffelementes
CH510127A (de) Verfahren zur Herstellung einer Nickel-Molybdän-Eisen-Legierung mit grossem Induktionshub und grosser Impulspermeabilität
AT241138B (de) Verfahren zur Herstellung eines Magnetkernes mit nahezu rechteckiger Hystereseschleife
AT273523B (de) Verfahren zur Herstellung eines Magnetkopfes
AT259243B (de) Verfahren zur Herstellung eines magnetischen Materials
CH404778A (de) Verfahren zur Herstellung eines supraleitenden Körpers
CH437558A (de) Verfahren zur Herstellung eines Magnetkerns und nach diesem Verfahren hergestellter Magnetkern
AT276567B (de) Verfahren zur Herstellung eines Hochspannungsgleichrichters
AT276979B (de) Verfahren zur Herstellung eines Reifendeckenbandes
AT270247B (de) Verfahren zur Herstellung eines Supraleiters
AT271657B (de) Verfahren zur Herstellung von wenigstens einer Wicklung mit mehreren Windungen auf einem geschlossenen Ringkern
CH455957A (de) Verfahren zur Herstellung eines ringförmigen Magnetkerns
AT267198B (de) Verfahren zur Herstellung eines Supraleiters
CH517544A (de) Verfahren zur Herstellung eines ferromagnetischen Werkstoffs
AT296646B (de) Verfahren zur Herstellung eines Magnetkopfes
AT287635B (de) Verfahren zur Herstellung eines Fadenmaterials

Legal Events

Date Code Title Description
PL Patent ceased