CH464303A - Verfahren zur Herstellung einer elektronischen Vorrichtung - Google Patents

Verfahren zur Herstellung einer elektronischen Vorrichtung

Info

Publication number
CH464303A
CH464303A CH1414066A CH1414066A CH464303A CH 464303 A CH464303 A CH 464303A CH 1414066 A CH1414066 A CH 1414066A CH 1414066 A CH1414066 A CH 1414066A CH 464303 A CH464303 A CH 464303A
Authority
CH
Switzerland
Prior art keywords
manufacturing
electronic device
electronic
Prior art date
Application number
CH1414066A
Other languages
German (de)
English (en)
Inventor
W Kreiselmaier Kurt
A Marek Daniel
H Van Tassel James
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CH464303A publication Critical patent/CH464303A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10Glass or silica
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • C23C14/30Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Hall/Mr Elements (AREA)
  • Physical Vapour Deposition (AREA)
CH1414066A 1965-10-01 1966-09-30 Verfahren zur Herstellung einer elektronischen Vorrichtung CH464303A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49233965A 1965-10-01 1965-10-01

Publications (1)

Publication Number Publication Date
CH464303A true CH464303A (de) 1968-10-31

Family

ID=23955878

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1414066A CH464303A (de) 1965-10-01 1966-09-30 Verfahren zur Herstellung einer elektronischen Vorrichtung

Country Status (6)

Country Link
US (1) USB492339I5 (sl)
CH (1) CH464303A (sl)
DE (1) DE1590750B1 (sl)
GB (1) GB1146754A (sl)
NL (1) NL6613837A (sl)
SE (1) SE332665B (sl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8624637D0 (en) * 1986-10-14 1986-11-19 Emi Plc Thorn Electrical device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB315354A (en) * 1928-07-12 1930-09-18 Telefunken Gmbh Improvements in or relating to electric insulating material
DE596124C (de) * 1930-01-16 1934-04-27 Telefunken Gmbh Elektrischer Apparat, bei welchem die sich erhitzenden Teile in ein hauptsaechlich aus Quarz bestehendes Isoliermaterial eingebettet sind
GB393562A (en) * 1930-09-01 1933-06-08 Gen Electric Improvements in and relating to methods of fusing high dielectrics
NL273920A (sl) * 1961-01-25

Also Published As

Publication number Publication date
NL6613837A (sl) 1967-04-03
SE332665B (sl) 1971-02-15
DE1590750B1 (de) 1971-04-22
GB1146754A (en) 1969-03-26
USB492339I5 (sl)

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