CH416764A - Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen - Google Patents

Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen

Info

Publication number
CH416764A
CH416764A CH1493163A CH1493163A CH416764A CH 416764 A CH416764 A CH 416764A CH 1493163 A CH1493163 A CH 1493163A CH 1493163 A CH1493163 A CH 1493163A CH 416764 A CH416764 A CH 416764A
Authority
CH
Switzerland
Prior art keywords
production
electronic components
electronic
components
Prior art date
Application number
CH1493163A
Other languages
English (en)
Inventor
Kurt Dipl Ing Ehrat
Eckstein Dieter
Original Assignee
Gretag Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gretag Ag filed Critical Gretag Ag
Priority to CH1493163A priority Critical patent/CH416764A/de
Priority to DEG42105A priority patent/DE1237189B/de
Priority to US414727A priority patent/US3310867A/en
Priority to FR997533A priority patent/FR1419964A/fr
Priority to NL6414111A priority patent/NL6414111A/xx
Priority to GB49549/64A priority patent/GB1042799A/en
Publication of CH416764A publication Critical patent/CH416764A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CH1493163A 1963-12-05 1963-12-05 Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen CH416764A (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH1493163A CH416764A (de) 1963-12-05 1963-12-05 Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen
DEG42105A DE1237189B (de) 1963-12-05 1964-11-25 Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen
US414727A US3310867A (en) 1963-12-05 1964-11-30 Method and a jig for assembling a plurality of wire-ended, electrical components into a module
FR997533A FR1419964A (fr) 1963-12-05 1964-12-04 Procédé et dispositif de fabrication de blocs électroniques tout montés
NL6414111A NL6414111A (de) 1963-12-05 1964-12-04
GB49549/64A GB1042799A (en) 1963-12-05 1964-12-04 A method and a jig for assembling a plurality of wire-ended, electrical components into a module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1493163A CH416764A (de) 1963-12-05 1963-12-05 Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen

Publications (1)

Publication Number Publication Date
CH416764A true CH416764A (de) 1966-07-15

Family

ID=4404951

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1493163A CH416764A (de) 1963-12-05 1963-12-05 Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen

Country Status (5)

Country Link
US (1) US3310867A (de)
CH (1) CH416764A (de)
DE (1) DE1237189B (de)
GB (1) GB1042799A (de)
NL (1) NL6414111A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3392256A (en) * 1965-06-24 1968-07-09 Texas Instruments Inc Method and apparatus for assembling electronic components to printed circuit boards
US3451129A (en) * 1966-01-05 1969-06-24 Massachusetts Inst Technology Process for manufacturing digital computer memories
US4146166A (en) * 1978-01-30 1979-03-27 Western Electric Co., Inc. Simultaneous soldering of a plurality of devices
US4234118A (en) * 1978-12-18 1980-11-18 Western Electric Company, Inc. Apparatus for simultaneous soldering of a plurality of devices
US4907342A (en) * 1989-01-18 1990-03-13 General Electric Company Method of assembling a molded case circuit breaker current transformer assembly
US7043829B2 (en) * 2002-12-09 2006-05-16 Dell Products L.P. Method for assembly of a motherboard into an information handling system chassis

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2921550A (en) * 1957-11-29 1960-01-19 Hughes Aircraft Co Assembly apparatus for electronic modules
GB868877A (en) * 1958-05-20 1961-05-25 Samuel Adam Francis High density electronic packaging
US3088728A (en) * 1958-12-31 1963-05-07 Malcolm A Sanborn Apparatus for assembling electrical circuitry

Also Published As

Publication number Publication date
DE1237189B (de) 1967-03-23
US3310867A (en) 1967-03-28
GB1042799A (en) 1966-09-14
NL6414111A (de) 1965-06-07

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