CH456773A - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
CH456773A
CH456773A CH21665A CH21665A CH456773A CH 456773 A CH456773 A CH 456773A CH 21665 A CH21665 A CH 21665A CH 21665 A CH21665 A CH 21665A CH 456773 A CH456773 A CH 456773A
Authority
CH
Switzerland
Prior art keywords
base
semiconductor
junction
emitter
collector
Prior art date
Application number
CH21665A
Other languages
German (de)
English (en)
Inventor
Henry Grinich Victor
Sah Chih-Tang
Original Assignee
Fairchild Camera Instr Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera Instr Co filed Critical Fairchild Camera Instr Co
Publication of CH456773A publication Critical patent/CH456773A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402Field plates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4918Disposition being disposed on at least two different sides of the body, e.g. dual array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
CH21665A 1964-02-04 1965-01-08 Halbleiterbauelement CH456773A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34249564A 1964-02-04 1964-02-04

Publications (1)

Publication Number Publication Date
CH456773A true CH456773A (de) 1968-07-31

Family

ID=23342075

Family Applications (1)

Application Number Title Priority Date Filing Date
CH21665A CH456773A (de) 1964-02-04 1965-01-08 Halbleiterbauelement

Country Status (4)

Country Link
BE (1) BE656774A (US20100223739A1-20100909-C00025.png)
CH (1) CH456773A (US20100223739A1-20100909-C00025.png)
ES (1) ES308304A1 (US20100223739A1-20100909-C00025.png)
NL (1) NL6413894A (US20100223739A1-20100909-C00025.png)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3463977A (en) * 1966-04-21 1969-08-26 Fairchild Camera Instr Co Optimized double-ring semiconductor device
US3423606A (en) * 1966-07-21 1969-01-21 Gen Instrument Corp Diode with sharp reverse-bias breakdown characteristic
US3432731A (en) * 1966-10-31 1969-03-11 Fairchild Camera Instr Co Planar high voltage four layer structures
DE3141203A1 (de) * 1981-10-16 1983-04-28 Siemens AG, 1000 Berlin und 8000 München Planares halbleiterbauelement
DE3201545A1 (de) * 1982-01-20 1983-07-28 Robert Bosch Gmbh, 7000 Stuttgart Planare halbleiteranordnung
DE3227536A1 (de) * 1982-01-20 1983-07-28 Robert Bosch Gmbh, 7000 Stuttgart Darlington-transistorschaltung
EP0711457A1 (en) * 1993-07-29 1996-05-15 SIEMENS COMPONENTS, Inc. A reverse field plate, junction-terminating structure
US5750414A (en) * 1993-09-29 1998-05-12 Siemens Components, Inc. Method of fabricating a semiconductor device

Also Published As

Publication number Publication date
ES308304A1 (es) 1965-04-16
NL6413894A (US20100223739A1-20100909-C00025.png) 1965-08-05
BE656774A (US20100223739A1-20100909-C00025.png) 1965-04-01

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