CH444317A - Verfahren zum Umhüllen eines Halbleiterbauteils - Google Patents

Verfahren zum Umhüllen eines Halbleiterbauteils

Info

Publication number
CH444317A
CH444317A CH223166A CH223166A CH444317A CH 444317 A CH444317 A CH 444317A CH 223166 A CH223166 A CH 223166A CH 223166 A CH223166 A CH 223166A CH 444317 A CH444317 A CH 444317A
Authority
CH
Switzerland
Prior art keywords
encasing
semiconductor component
semiconductor
component
Prior art date
Application number
CH223166A
Other languages
German (de)
English (en)
Inventor
Eggers Lieselotte
Weisz Herbert
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH444317A publication Critical patent/CH444317A/de

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16FSPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/28Counterweights, i.e. additional weights counterbalancing inertia forces induced by the reciprocating movement of masses in the system, e.g. of pistons attached to an engine crankshaft; Attaching or mounting same
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H51/00Levers of gearing mechanisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermistors And Varistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CH223166A 1965-02-19 1966-02-16 Verfahren zum Umhüllen eines Halbleiterbauteils CH444317A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEP0036106 1965-02-19

Publications (1)

Publication Number Publication Date
CH444317A true CH444317A (de) 1967-09-30

Family

ID=7374567

Family Applications (1)

Application Number Title Priority Date Filing Date
CH223166A CH444317A (de) 1965-02-19 1966-02-16 Verfahren zum Umhüllen eines Halbleiterbauteils

Country Status (5)

Country Link
BE (1) BE676665A (en))
CH (1) CH444317A (en))
DE (1) DE1571114A1 (en))
GB (1) GB1082331A (en))
NL (1) NL6601892A (en))

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9865373B2 (en) * 2015-02-25 2018-01-09 Te Connectivity Corporation Electrical wire with conductive particles

Also Published As

Publication number Publication date
DE1571114A1 (de) 1970-11-26
BE676665A (en)) 1966-08-17
GB1082331A (en) 1967-09-06
NL6601892A (en)) 1966-08-22

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