CH427296A - Verfahren zur Herstellung von Polyepoxyden - Google Patents

Verfahren zur Herstellung von Polyepoxyden

Info

Publication number
CH427296A
CH427296A CH78663A CH78663A CH427296A CH 427296 A CH427296 A CH 427296A CH 78663 A CH78663 A CH 78663A CH 78663 A CH78663 A CH 78663A CH 427296 A CH427296 A CH 427296A
Authority
CH
Switzerland
Prior art keywords
polyepoxides
production
Prior art date
Application number
CH78663A
Other languages
English (en)
Inventor
Guenter Dr Frank
Rolf Dr Kubens
Robert Dr Schmitz-Josten
Richard Dr Wegler
Heinz-Adolf Dr Dortmann
Original Assignee
Bayer Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Ag filed Critical Bayer Ag
Publication of CH427296A publication Critical patent/CH427296A/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/22Ethers with hydroxy compounds containing no oxirane rings with monohydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/06Phosphorus compounds without P—C bonds
    • C07F9/08Esters of oxyacids of phosphorus
    • C07F9/09Esters of phosphoric acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CH78663A 1962-02-03 1963-01-23 Verfahren zur Herstellung von Polyepoxyden CH427296A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962F0035921 DE1222076C2 (de) 1962-02-03 1962-02-03 Verfahren zur herstellung von diepoxiden

Publications (1)

Publication Number Publication Date
CH427296A true CH427296A (de) 1966-12-31

Family

ID=7096227

Family Applications (1)

Application Number Title Priority Date Filing Date
CH78663A CH427296A (de) 1962-02-03 1963-01-23 Verfahren zur Herstellung von Polyepoxyden

Country Status (4)

Country Link
US (1) US3316277A (de)
CH (1) CH427296A (de)
DE (1) DE1222076C2 (de)
GB (1) GB1017612A (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109600A (en) * 1977-03-07 1978-09-25 Ueno Seiyaku Oyo Kenkyujo Kk Manufacture of eposy resin
JPS54151928A (en) * 1978-05-22 1979-11-29 Shell Int Research Phenol compound*its preparation and use for epoxy resin setting agent
US4558078A (en) * 1983-08-01 1985-12-10 American Cyanamid Company Curable epoxy resin compositions
US4562217A (en) * 1983-08-01 1985-12-31 American Cyanamid Curable epoxy resin compositions
US4533686A (en) * 1983-08-01 1985-08-06 American Cyanamid Co. Curable epoxy resin compositions
US4623681A (en) 1983-08-01 1986-11-18 American Cyanamid Company Curable epoxy resin compositions
DE3331903A1 (de) * 1983-09-03 1985-03-21 Basf Farben + Fasern Ag, 2000 Hamburg Wasserdispergierbare bindemittel fuer kationische elektrotauchlacke und verfahren zu ihrer herstellung
US4604319B1 (en) * 1984-06-01 1995-07-04 American Cyanamid Co Thermoplastic interleafed resin matrix composites with improved impact strength and toughness
ES2106011T3 (es) * 1986-12-19 1997-11-01 Ciba Geigy Ag Resinas epoxi que contienen un poliester basado en un polialquilenglicol y endurecedores activos a temperaturas elevadas.
EP0353190B1 (de) * 1988-07-28 1995-03-01 Ciba-Geigy Ag Flexibilisatorkombinationen für Epoxidharze
US5202390A (en) * 1988-07-28 1993-04-13 Ciba-Geigy Corporation Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer
DE59010431D1 (de) * 1989-02-02 1996-09-05 Ciba Geigy Ag Zähe Epoxidharze
IE892044A1 (en) * 1989-06-23 1991-01-02 Loctite Ireland Ltd Photoresists formed by polymerisation of di-unsaturated¹monomers
US5182394A (en) * 1992-01-14 1993-01-26 Akzo N.V. Liquid crystalline diglycidyl compounds
US5717054A (en) * 1995-06-07 1998-02-10 National Starch & Chemical Investment Holding Corp. Epoxy resins consisting of flexible chains terminated with glycidyloxyphenyl groups for use in microelectronics adhesives
US5646315A (en) * 1995-06-07 1997-07-08 National Starch And Chemical Investment Holding Corporation Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives
US5770706A (en) * 1995-06-07 1998-06-23 National Starch And Chemical Investment Holding Corporation Snap-cure epoxy adhesives
US6093780A (en) * 1998-10-02 2000-07-25 Loctite Corporation Cyanoacrylate adhesive compositions with improved cured thermal properties
WO2009117476A2 (en) 2008-03-19 2009-09-24 Henkel Corporation Method of fabricating a semiconductor package or circuit assembly using a fluxing underfill composition applied to solder contact points in a dip process
WO2012080185A1 (de) 2010-12-15 2012-06-21 Bayer Materialscience Ag Hochtemperaturbeständige schaumstoffe
CN103619927A (zh) 2011-05-02 2014-03-05 拜耳知识产权有限责任公司 具有低导热性的耐高温泡沫材料
JP6540188B2 (ja) * 2014-05-21 2019-07-10 三菱ケミカル株式会社 エポキシ樹脂用希釈剤、及びエポキシ樹脂組成物
EP3059270A1 (de) 2015-02-20 2016-08-24 Basf Se Temperaturbeständige Schaumstoffe auf Isocyanatbasis mit hoher Flammwidrigkeit
WO2016131878A1 (de) 2015-02-20 2016-08-25 Covestro Deutschland Ag Hochtemperaturbeständige schaumstoffe
WO2017038979A1 (ja) * 2015-09-03 2017-03-09 三菱瓦斯化学株式会社 化合物及びその製造方法、並びに、組成物、光学部品形成用組成物、リソグラフィー用膜形成組成物、レジスト組成物、レジストパターンの形成方法、感放射線性組成物、アモルファス膜の製造方法、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜の製造方法、レジストパターン形成方法、回路パターン形成方法、及び、精製方法
JP7118083B2 (ja) 2017-03-17 2022-08-15 ビーエーエスエフ ソシエタス・ヨーロピア オキサゾリジノン基を含む化合物の製造方法
KR20220085616A (ko) * 2020-12-15 2022-06-22 삼성전자주식회사 에폭시 화합물, 이로부터 얻어지는 조성물, 반도체 장치, 전자 장치, 물품 및 에폭시 화합물 제조 방법
EP4263646A1 (de) 2020-12-21 2023-10-25 Basf Se Stabilisierte epoxy-isocyanat-mischungen und daraus erhaltene oxazolidinonhaltige polymere
KR20240036654A (ko) 2021-07-22 2024-03-20 바스프 에스이 낮은 취성 및 개선된 접착성을 갖는 이소시아네이트-에폭시 하이브리드 발포체
WO2023247278A1 (de) 2022-06-22 2023-12-28 Basf Se Epoxy-terminierte isocyanat-prepolymere und verfahren zu deren herstellung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2089569A (en) * 1932-03-02 1937-08-10 Gen Aniline Works Inc Addition products of glycide to organic compounds
US2925426A (en) * 1955-12-29 1960-02-16 Shell Dev Epoxy ether esters

Also Published As

Publication number Publication date
DE1222076C2 (de) 1976-01-15
DE1222076B (de) 1966-08-04
US3316277A (en) 1967-04-25
GB1017612A (en) 1966-01-19

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