CH427039A - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
CH427039A
CH427039A CH1224863A CH1224863A CH427039A CH 427039 A CH427039 A CH 427039A CH 1224863 A CH1224863 A CH 1224863A CH 1224863 A CH1224863 A CH 1224863A CH 427039 A CH427039 A CH 427039A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH1224863A
Other languages
German (de)
English (en)
Inventor
Eric Andersson Nils
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Publication of CH427039A publication Critical patent/CH427039A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
CH1224863A 1962-10-15 1963-10-03 Halbleiteranordnung CH427039A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE10998/62A SE311196B (enExample) 1962-10-15 1962-10-15

Publications (1)

Publication Number Publication Date
CH427039A true CH427039A (de) 1966-12-31

Family

ID=20293189

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1224863A CH427039A (de) 1962-10-15 1963-10-03 Halbleiteranordnung

Country Status (5)

Country Link
CH (1) CH427039A (enExample)
DE (1) DE1464425A1 (enExample)
GB (1) GB1052449A (enExample)
NL (1) NL299250A (enExample)
SE (1) SE311196B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620215A (en) * 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation

Also Published As

Publication number Publication date
SE311196B (enExample) 1969-06-02
NL299250A (enExample)
GB1052449A (enExample)
DE1464425A1 (enExample) 1968-10-24

Similar Documents

Publication Publication Date Title
CH417775A (de) Halbleiteranordnung
CH406434A (de) Halbleitervorrichtung
CH426016A (de) Halbleiteranordnung
NL286774A (nl) Halfgeleiderinrichting
CH409270A (de) Serviervorrichtung
CH468719A (de) Halbleitervorrichtung
AT265382B (de) Photoempfindliche Halbleitereinrichtung
CH406443A (de) Halbleiteranordnung
FR1377764A (fr) Dispositif semi-conducteur
CH429973A (de) Steuerbare Halbleiteranordnung
CH377004A (de) Halbleiteranordnung
CH402193A (de) Halbleiteranordnung
CH408218A (de) Halbleiteranordnung
CH396220A (de) Halbleiteranordnung
CH427043A (de) Halbleitervorrichtung
CH396221A (de) Halbleiteranordnung
FR1350412A (fr) Dispositif semi-conducteur
CH416840A (de) Halbleiteranordnung
AT250210B (de) Zeichengerät
CH399601A (de) Halbleiteranordnung
FR1348742A (fr) Dispositif semi-conducteur
CH396222A (de) Halbleiteranordnung
CH377940A (de) Halbleiteranordnung
AT238320B (de) Halbleitervorrichtung
FR1372216A (fr) Dispositif semi-conducteur