CH379644A - Verfahren zur Herstellung einer Halbleiterzelle mit lösbar befestigtem Kühlblock - Google Patents

Verfahren zur Herstellung einer Halbleiterzelle mit lösbar befestigtem Kühlblock

Info

Publication number
CH379644A
CH379644A CH1060860A CH1060860A CH379644A CH 379644 A CH379644 A CH 379644A CH 1060860 A CH1060860 A CH 1060860A CH 1060860 A CH1060860 A CH 1060860A CH 379644 A CH379644 A CH 379644A
Authority
CH
Switzerland
Prior art keywords
manufacturing
releasably attached
cooling block
semiconductor cell
attached cooling
Prior art date
Application number
CH1060860A
Other languages
English (en)
Inventor
Adolf Dr Herlet
Arnulf Dr Hoffmann
Nagorsen Hans
Plorin Siegfried
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH379644A publication Critical patent/CH379644A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH1060860A 1959-11-13 1960-09-20 Verfahren zur Herstellung einer Halbleiterzelle mit lösbar befestigtem Kühlblock CH379644A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES65815A DE1117776B (de) 1959-11-13 1959-11-13 Verfahren zur Herstellung einer Halbleiterzelle mit loesbar befestigtem Kuehlblock

Publications (1)

Publication Number Publication Date
CH379644A true CH379644A (de) 1964-07-15

Family

ID=7498326

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1060860A CH379644A (de) 1959-11-13 1960-09-20 Verfahren zur Herstellung einer Halbleiterzelle mit lösbar befestigtem Kühlblock

Country Status (3)

Country Link
CH (1) CH379644A (de)
DE (1) DE1117776B (de)
GB (1) GB902318A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2586103B1 (de) * 2010-09-24 2014-11-26 Siemens Aktiengesellschaft Elektrischer durchverbinder eines unterwasserbehälters

Also Published As

Publication number Publication date
DE1117776B (de) 1961-11-23
GB902318A (en) 1962-08-01

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