CH320932A - Bulb for electronic components, in particular for transistors - Google Patents

Bulb for electronic components, in particular for transistors

Info

Publication number
CH320932A
CH320932A CH320932DA CH320932A CH 320932 A CH320932 A CH 320932A CH 320932D A CH320932D A CH 320932DA CH 320932 A CH320932 A CH 320932A
Authority
CH
Switzerland
Prior art keywords
bulb
transistors
charac terized
ampoule according
seal
Prior art date
Application number
Other languages
French (fr)
Inventor
Aeschmann Nicolas
Original Assignee
Omega Brandt & Freres Sa Louis
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omega Brandt & Freres Sa Louis filed Critical Omega Brandt & Freres Sa Louis
Publication of CH320932A publication Critical patent/CH320932A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)

Description

  

  Ampoule pour organes électroniques, notamment pour     transistors       La présente invention a pour objet une am  poule pour organes électroniques, notamment  pour transistors.  



  Depuis la création des transistors et des  diodes, on cherche à diminuer les dimensions  extérieures des ampoules contenant ces orga  nes électroniques, car la partie active de ces  derniers occupe un très petit volume, ayant des  dimensions de l'ordre de 2 X 2 X 1 mm. On  est limité dans cette diminution par le fait que  l'enveloppe doit être absolument étanche, ce  qui exclut presque toutes les matières plasti  ques. Seuls restent le verre, la céramique ou le  métal pour la fabrication de ces ampoules.  L'étanchéité est nécessaire pour éviter toute  pénétration dans l'ampoule d'humidité, de  poussière, etc., qui changent les caractéristiques  de l'organe électronique.  



  Les ampoules fabriquées jusqu'à présent  étaient faites en verre soudé à chaud ou en  métal soudé électriquement. Or, les procédés  de soudure du verre et du métal nécessitent  l'emploi de fortes sources calorifiques, et les  cristaux employés dans les transistors et les  diodes sont très sensibles aux températures su  périeures à     100,)    C. Les ampoules de verre ou  de métal. devaient par suite être assez grandes  pour permettre une soudure suffisamment éloi  gnée des cristaux, de façon à ne pas les altérer.  



  On a aussi proposé de fermer les ampoules  par des procédés de sertissage, mais ceux-ci    sont actuellement en voie d'abandon,     car    ils ne  permettent pas d'obtenir une étanchéité suffi  sante.  



  ' La présente invention vise à remédier à ces  inconvénients. A cet effet, l'ampoule qui en  fait l'objet comporte au moins deux parties as  semblées de façon hermétique, les surfaces de  contact, formant joint, étant coniques et rodées.  



  Le dessin annexé représente, à titre d'exem  ple, une forme d'exécution de l'ampoule objet  de l'invention.  



  La figure unique en est une vue en coupe  axiale.  



  L'ampoule représentée au dessin comporte  deux parties, à savoir une enveloppe 1 et un  bouchon 2, assemblées de façon hermétique.  Les parties 1 et- 2 sont en verre ou en cérami  que. Dans la masse du bouchon 2 sont noyés  les fils 3 reliés à l'organe électronique 4.  



  L'enveloppe 1 a la forme d'un cylindre  creux ouvert à l'une de ses     extrémités.    La paroi  5 limitant cette ouverture-est conique et rodée,  et sa conicité est faible (inférieure à 100). Le.  bouchon 2 présente également une surface co  nique rodée 6 dont la conicité est la même que  celle de la paroi 5. Les deux surfaces 5 et 6  viennent ainsi en contact l'une avec l'autre et  assurent un coincement des deux pièces 1 et 2  de l'ampoule. Le coefficient de dilatation des      pièces 1 et 2 doit être le même pour assurer le  coincement à toutes les températures.  



  On obtient les surfaces coniques 5 et 6 de  la même façon que les cônes des bouchons dits    émeris  . Le verre ou la céramique, pressé  ou moulé en forme, est ensuite soigneusement  rodé à l'émeri ou au corindon. Les cônes sont  donc absolument identiques et forment un  joint parfait. On peut     améliorer    encore l'adhé  rence du joint en enduisant les surfaces en con  tact d'une substance visqueuse. Les substances  visqueuses entrant en considération peuvent       être    des huiles ou des graisses déshydratées ou  bien des-     silicones.     



  L'assemblage des parties 1 et 2 peut se faire  sous vide ou dans une atmosphère gazeuse con  trôlée.  



  On voit l'avantage que représente cette am  poule hermétique dont les dimensions peuvent  être ainsi ramenées à leur minimum possible,  du fait qu'aucune chaleur n'est nécessaire pour  leur assemblage.



  Bulb for electronic components, in particular for transistors The present invention relates to a bulb for electronic components, in particular for transistors.



  Since the creation of transistors and diodes, attempts have been made to reduce the external dimensions of the bulbs containing these electronic organs, because the active part of the latter occupies a very small volume, having dimensions of the order of 2 X 2 X 1 mm. This reduction is limited by the fact that the casing must be absolutely waterproof, which excludes almost all plastics. Only glass, ceramic or metal remain for the manufacture of these bulbs. Sealing is necessary to prevent moisture, dust, etc. from entering the bulb, which changes the characteristics of the electronic component.



  The bulbs manufactured until now were made of heat-welded glass or electrically welded metal. However, glass and metal soldering processes require the use of strong heat sources, and the crystals used in transistors and diodes are very sensitive to temperatures above 100,) C. Glass or metal bulbs . therefore had to be large enough to allow a weld sufficiently distant from the crystals, so as not to alter them.



  It has also been proposed to close the ampoules by crimping processes, but these are currently being abandoned, because they do not make it possible to obtain sufficient sealing.



  The present invention aims to remedy these drawbacks. To this end, the bulb which is the subject thereof comprises at least two parts as seemed hermetically, the contact surfaces, forming a seal, being conical and lapped.



  The appended drawing represents, by way of example, an embodiment of the bulb which is the subject of the invention.



  The single figure is a view in axial section.



  The bulb shown in the drawing has two parts, namely an envelope 1 and a cap 2, assembled in a hermetic manner. Parts 1 and 2 are made of glass or ceramic. In the mass of the plug 2 are embedded the wires 3 connected to the electronic device 4.



  The casing 1 has the shape of a hollow cylinder open at one of its ends. The wall 5 limiting this opening is conical and lapped, and its taper is low (less than 100). The. stopper 2 also has a lapped conical surface 6, the taper of which is the same as that of the wall 5. The two surfaces 5 and 6 thus come into contact with one another and ensure a wedging of the two parts 1 and 2 of the bulb. The coefficient of expansion of parts 1 and 2 must be the same to ensure jamming at all temperatures.



  The conical surfaces 5 and 6 are obtained in the same way as the cones of so-called emery stoppers. The glass or ceramic, pressed or molded into shape, is then carefully lapped with emery or corundum. The cones are therefore absolutely identical and form a perfect seal. The adhesion of the joint can be further improved by coating the mating surfaces with a viscous substance. The viscous substances which can be considered can be dehydrated oils or fats or silicones.



  The assembly of parts 1 and 2 can be carried out under vacuum or in a controlled gas atmosphere.



  We can see the advantage represented by this hermetic hen, the dimensions of which can be reduced to their minimum possible, because no heat is required for their assembly.

 

Claims (1)

REVENDICATION Ampoule pour organes électroniques, no tamment pour transistors, caractérisée en ce qu'elle comporte au moins deux parties assem blées de façon hermétique, les surfaces de con tact, formant joint, étant coniques et rodées. SOUS-REVENDICATIONS 1. Ampoule selon la revendication, carac térisée en ce qu'elle comporte une enveloppe, ayant la forme d'un cylindre creux ouvert à l'une de ses extrémités, et un bouchon fermant cette ouverture. 2. Ampoule selon la revendication, carac térisée en ce que ses parties constituantes sont en verre. 3. Ampoule selon la revendication, carac térisée en ce que ses parties constituantes sont en céramique. 4. Ampoule selon la revendication, carac térisée en ce que la conicité des surfaces de contact, formant joint, est inférieure à 100. 5. CLAIM Bulb for electronic components, in particular for transistors, characterized in that it comprises at least two parts assembled hermetically, the contact surfaces, forming a seal, being conical and lapped. SUB-CLAIMS 1. Ampoule according to claim, charac terized in that it comprises an envelope, having the shape of a hollow cylinder open at one of its ends, and a stopper closing this opening. 2. Ampoule according to claim, charac terized in that its constituent parts are made of glass. 3. Bulb according to claim, charac terized in that its constituent parts are ceramic. 4. Ampoule according to claim, charac terized in that the taper of the contact surfaces, forming a seal, is less than 100. 5. Ampoule selon la revendication, caracté risée en ce que l'adhérence du joint est amé liorée par le fait que les surfaces de contact sont enduites d'une substance visqueuse. 6. Ampoule selon la revendication, carac térisée en ce que le coefficient de dilatation de ses pièces constituantes est le même, pour assu rer leur coincement à toutes les températures. Ampoule according to claim, characterized in that the adhesion of the seal is improved by the fact that the contact surfaces are coated with a viscous substance. 6. Ampoule according to claim, charac terized in that the coefficient of expansion of its constituent parts is the same, to ensure their jamming at all temperatures.
CH320932D 1954-11-01 1954-11-01 Bulb for electronic components, in particular for transistors CH320932A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH320932T 1954-11-01

Publications (1)

Publication Number Publication Date
CH320932A true CH320932A (en) 1957-04-15

Family

ID=4498191

Family Applications (1)

Application Number Title Priority Date Filing Date
CH320932D CH320932A (en) 1954-11-01 1954-11-01 Bulb for electronic components, in particular for transistors

Country Status (1)

Country Link
CH (1) CH320932A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1239020B (en) * 1960-12-15 1967-04-20 Corning Glass Works A method of manufacturing a semiconductor device having feed lines sealed to the housing
DE1279852B (en) * 1963-08-05 1968-10-10 Semikron Gleichrichterbau Process for the production of semiconductor devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1239020B (en) * 1960-12-15 1967-04-20 Corning Glass Works A method of manufacturing a semiconductor device having feed lines sealed to the housing
DE1279852B (en) * 1963-08-05 1968-10-10 Semikron Gleichrichterbau Process for the production of semiconductor devices

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