CA989076A - Method of contacting semiconductor devices - Google Patents

Method of contacting semiconductor devices

Info

Publication number
CA989076A
CA989076A CA183,425A CA183425A CA989076A CA 989076 A CA989076 A CA 989076A CA 183425 A CA183425 A CA 183425A CA 989076 A CA989076 A CA 989076A
Authority
CA
Canada
Prior art keywords
semiconductor devices
contacting semiconductor
contacting
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA183,425A
Other languages
English (en)
Other versions
CA183425S (en
Inventor
Toyoki Takemoto
Hiroshi Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of CA989076A publication Critical patent/CA989076A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
CA183,425A 1972-10-16 1973-10-15 Method of contacting semiconductor devices Expired CA989076A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47104283A JPS4960870A (US07534539-20090519-C00280.png) 1972-10-16 1972-10-16

Publications (1)

Publication Number Publication Date
CA989076A true CA989076A (en) 1976-05-11

Family

ID=14376586

Family Applications (1)

Application Number Title Priority Date Filing Date
CA183,425A Expired CA989076A (en) 1972-10-16 1973-10-15 Method of contacting semiconductor devices

Country Status (7)

Country Link
US (1) US3945347A (US07534539-20090519-C00280.png)
JP (1) JPS4960870A (US07534539-20090519-C00280.png)
CA (1) CA989076A (US07534539-20090519-C00280.png)
DE (1) DE2351943B2 (US07534539-20090519-C00280.png)
FR (1) FR2203175B1 (US07534539-20090519-C00280.png)
GB (1) GB1418969A (US07534539-20090519-C00280.png)
NL (1) NL158026B (US07534539-20090519-C00280.png)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096623A (en) * 1974-07-01 1978-06-27 Siemens Aktiengesellschaft Thyristor and method of producing the same
FR2284981A1 (fr) * 1974-09-10 1976-04-09 Radiotechnique Compelec Procede d'obtention d'un circuit integre semiconducteur
US3985597A (en) * 1975-05-01 1976-10-12 International Business Machines Corporation Process for forming passivated metal interconnection system with a planar surface
US4045594A (en) * 1975-12-31 1977-08-30 Ibm Corporation Planar insulation of conductive patterns by chemical vapor deposition and sputtering
FR2340620A1 (fr) * 1976-02-06 1977-09-02 Ibm Procede de fabrication d'un dispositif integre a grande echelle ayant une surface plane
US4035276A (en) * 1976-04-29 1977-07-12 Ibm Corporation Making coplanar layers of thin films
US4564997A (en) * 1981-04-21 1986-01-21 Nippon-Telegraph And Telephone Public Corporation Semiconductor device and manufacturing process thereof
JPS57176746A (en) * 1981-04-21 1982-10-30 Nippon Telegr & Teleph Corp <Ntt> Semiconductor integrated circuit and manufacture thereof
US4392298A (en) * 1981-07-27 1983-07-12 Bell Telephone Laboratories, Incorporated Integrated circuit device connection process
US4440804A (en) * 1982-08-02 1984-04-03 Fairchild Camera & Instrument Corporation Lift-off process for fabricating self-aligned contacts
JPS5982746A (ja) * 1982-11-04 1984-05-12 Toshiba Corp 半導体装置の電極配線方法
US4631806A (en) * 1985-05-22 1986-12-30 Gte Laboratories Incorporated Method of producing integrated circuit structures
JPH02125422A (ja) * 1988-11-02 1990-05-14 Nec Corp 半導体装置の製造方法
KR0121106B1 (ko) * 1994-02-15 1997-11-10 김주용 반도체 소자의 금속배선 형성방법
US5854128A (en) 1996-04-29 1998-12-29 Micron Technology, Inc. Method for reducing capacitive coupling between conductive lines
TW350099B (en) * 1998-01-26 1999-01-11 United Microelectronics Corp IC microfilm process
DE10208728B4 (de) * 2002-02-28 2009-05-07 Advanced Micro Devices, Inc., Sunnyvale Ein Verfahren zur Herstellung eines Halbleiterelements mit unterschiedlichen Metallsilizidbereichen

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL251302A (US07534539-20090519-C00280.png) * 1959-05-06
US3160534A (en) * 1960-10-03 1964-12-08 Gen Telephone & Elect Method of making tunnel diodes
US3266127A (en) * 1964-01-27 1966-08-16 Ibm Method of forming contacts on semiconductors
NL132313C (US07534539-20090519-C00280.png) * 1964-12-17 1900-01-01
US3498833A (en) * 1966-07-08 1970-03-03 Fairchild Camera Instr Co Double masking technique for integrated circuit
US3840982A (en) * 1966-12-28 1974-10-15 Westinghouse Electric Corp Contacts for semiconductor devices, particularly integrated circuits, and methods of making the same
GB1286737A (en) * 1969-10-15 1972-08-23 Itt Multilevel conductive systems
GB1363815A (en) * 1971-12-06 1974-08-21 Tektronix Inc Semiconductor device and method of producing same
US3747200A (en) * 1972-03-31 1973-07-24 Motorola Inc Integrated circuit fabrication method

Also Published As

Publication number Publication date
FR2203175A1 (US07534539-20090519-C00280.png) 1974-05-10
US3945347A (en) 1976-03-23
DE2351943B2 (de) 1980-08-07
FR2203175B1 (US07534539-20090519-C00280.png) 1977-09-23
GB1418969A (en) 1975-12-24
JPS4960870A (US07534539-20090519-C00280.png) 1974-06-13
NL158026B (nl) 1978-09-15
NL7314156A (US07534539-20090519-C00280.png) 1974-04-18
DE2351943A1 (de) 1974-05-02

Similar Documents

Publication Publication Date Title
CA920721A (en) Method of making thermo-compression-bonded semiconductor device
CA989076A (en) Method of contacting semiconductor devices
AU473855B2 (en) Semiconductor device and method of manufacturing the device
AU475207B2 (en) Semiconductor devices
CA902804A (en) Method of making semiconductor device components
CA858502A (en) Method of manufacturing semiconductor devices
CA838347A (en) Method of manufacturing semiconductor devices
CA913806A (en) Methods of manufacturing semiconductor devices
CA902796A (en) Fabrication of semiconductor devices
CA903384A (en) Method for the production of semiconductor devices
CA934481A (en) Method of fabricating semiconductor devices
CA917821A (en) Contact for semiconductor devices and method for making
CA906104A (en) Method for making semiconductor devices
CA835594A (en) Method of making semiconductor devices
CA908866A (en) Manufacture of semiconductor devices
CA863542A (en) Method of making semiconductor devices
CA910500A (en) Semiconductor device and method of making
AU454949B2 (en) Method of contacting semiconductor arrangements
CA837796A (en) Method of forming leads on semiconductor devices
CA902249A (en) Semiconductor device and method of making the same
CA906669A (en) Semiconductor device and method of manufacturing said device
CA843644A (en) Method of manufacturing semiconductor devices
CA903930A (en) Methods of manufacturing housings for semiconductor devices
CA884039A (en) Manufacturing method of semiconductor device
AU488333B2 (en) Semiconductor. device and method of manufacturing same