CA978278A - Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate - Google Patents
Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrateInfo
- Publication number
- CA978278A CA978278A CA 150295 CA150295A CA978278A CA 978278 A CA978278 A CA 978278A CA 150295 CA150295 CA 150295 CA 150295 A CA150295 A CA 150295A CA 978278 A CA978278 A CA 978278A
- Authority
- CA
- Canada
- Prior art keywords
- forming
- layer glass
- integral mounting
- metal module
- refractory substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17553071A | 1971-08-27 | 1971-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA978278A true CA978278A (en) | 1975-11-18 |
Family
ID=22640592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 150295 Expired CA978278A (en) | 1971-08-27 | 1972-08-24 | Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5120699B2 (en) |
CA (1) | CA978278A (en) |
IT (1) | IT964139B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5049663A (en) * | 1973-09-05 | 1975-05-02 | ||
JPS5819158B2 (en) * | 1976-09-28 | 1983-04-16 | 日本電気株式会社 | Manufacturing method for high-density multilayer wiring board |
JPS548976A (en) * | 1977-06-22 | 1979-01-23 | Nec Corp | Lsi package |
JPS54135360A (en) * | 1978-04-13 | 1979-10-20 | Oki Electric Ind Co Ltd | Multiilayer ceramic board |
JPS5598897A (en) * | 1979-01-23 | 1980-07-28 | Nippon Electric Co | Multilayer circuit board |
JPS5759472U (en) * | 1980-09-26 | 1982-04-08 | ||
JPS5842263A (en) * | 1981-09-04 | 1983-03-11 | Nec Corp | Multichip package |
JPS58199594A (en) * | 1982-05-17 | 1983-11-19 | 日本電気株式会社 | Multilayer circuit board |
JPH0789574B2 (en) * | 1985-01-18 | 1995-09-27 | 日立超エル・エス・アイ・エンジニアリング株式会社 | Pellet mounting board manufacturing method |
WO2003100846A2 (en) * | 2002-05-23 | 2003-12-04 | Schott Ag | Glass material for use at high frequencies |
-
1972
- 1972-08-11 JP JP8007872A patent/JPS5120699B2/ja not_active Expired
- 1972-08-22 IT IT2836272A patent/IT964139B/en active
- 1972-08-24 CA CA 150295 patent/CA978278A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5120699B2 (en) | 1976-06-26 |
IT964139B (en) | 1974-01-21 |
JPS4832475A (en) | 1973-04-28 |
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