CA962744A - Lead frame connector and electronic packages containing same - Google Patents
Lead frame connector and electronic packages containing sameInfo
- Publication number
- CA962744A CA962744A CA133,085A CA133085A CA962744A CA 962744 A CA962744 A CA 962744A CA 133085 A CA133085 A CA 133085A CA 962744 A CA962744 A CA 962744A
- Authority
- CA
- Canada
- Prior art keywords
- lead frame
- containing same
- frame connector
- packages containing
- electronic packages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12229—Intermediate article [e.g., blank, etc.]
- Y10T428/12271—Intermediate article [e.g., blank, etc.] having discrete fastener, marginal fastening, taper, or end structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12354—Nonplanar, uniform-thickness material having symmetrical channel shape or reverse fold [e.g., making acute angle, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11300771A | 1971-02-05 | 1971-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA962744A true CA962744A (en) | 1975-02-11 |
Family
ID=22347072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA133,085A Expired CA962744A (en) | 1971-02-05 | 1972-01-24 | Lead frame connector and electronic packages containing same |
Country Status (7)
Country | Link |
---|---|
US (1) | US3689684A (de) |
CA (1) | CA962744A (de) |
DE (1) | DE2205342A1 (de) |
FR (1) | FR2124508B1 (de) |
GB (1) | GB1331901A (de) |
IT (1) | IT947305B (de) |
NL (1) | NL7201492A (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3750252A (en) * | 1972-05-01 | 1973-08-07 | Du Pont | Solder terminal strip |
US3790916A (en) * | 1972-08-03 | 1974-02-05 | Gte Automatic Electric Lab Inc | Edge mount connector terminal |
US3805117A (en) * | 1972-12-12 | 1974-04-16 | Rca Corp | Hybrid electron device containing semiconductor chips |
US4044201A (en) * | 1974-09-17 | 1977-08-23 | E. I. Du Pont De Nemours And Company | Lead frame assembly |
US4012835A (en) * | 1974-09-17 | 1977-03-22 | E. I. Du Pont De Nemours And Co. | Method of forming a dual in-line package |
JPS51141356U (de) * | 1975-05-09 | 1976-11-13 | ||
FR2376590A1 (fr) * | 1976-12-28 | 1978-07-28 | Cit Alcatel | Ensemble de liaison d'une carte-support de circuit electrique et d'un cadre exterieur |
US4085998A (en) * | 1976-12-29 | 1978-04-25 | Western Electric Company, Inc. | Dual clip connector |
US4196959A (en) * | 1977-12-27 | 1980-04-08 | Beckman Instruments, Inc. | Carrier strip for round lead pins and method for making the same |
US4177554A (en) * | 1978-04-26 | 1979-12-11 | Western Electric Co., Inc. | Assembling leads to a substrate |
US4222622A (en) * | 1978-06-12 | 1980-09-16 | Gte Products Corporation | Electrical connector for circuit board |
US4224637A (en) * | 1978-08-10 | 1980-09-23 | Minnesota Mining And Manufacturing Company | Leaded mounting and connector unit for an electronic device |
GB2029652B (en) * | 1978-08-23 | 1983-01-12 | North American Specialities | Solder bearing terminal clip |
US4214120A (en) * | 1978-10-27 | 1980-07-22 | Western Electric Company, Inc. | Electronic device package having solder leads and methods of assembling the package |
US4272644A (en) * | 1979-09-27 | 1981-06-09 | Hybrid Systems Corporation | Electronic hybrid circuit package |
US4313262A (en) * | 1979-12-17 | 1982-02-02 | General Electric Company | Molybdenum substrate thick film circuit |
US4323293A (en) * | 1980-06-30 | 1982-04-06 | Bourns, Inc. | Terminal lead with labyrinthine clip |
US4371912A (en) * | 1980-10-01 | 1983-02-01 | Motorola, Inc. | Method of mounting interrelated components |
JPS58220513A (ja) * | 1982-06-16 | 1983-12-22 | Murata Mfg Co Ltd | 電子部品 |
US4503609A (en) * | 1982-10-29 | 1985-03-12 | At&T Technologies, Inc. | Low-insertion force method of assembling a lead and a substrate |
US4498121A (en) * | 1983-01-13 | 1985-02-05 | Olin Corporation | Copper alloys for suppressing growth of Cu-Al intermetallic compounds |
US5001546A (en) * | 1983-07-27 | 1991-03-19 | Olin Corporation | Clad metal lead frame substrates |
US4722060A (en) * | 1984-03-22 | 1988-01-26 | Thomson Components-Mostek Corporation | Integrated-circuit leadframe adapted for a simultaneous bonding operation |
US4592617A (en) | 1985-02-06 | 1986-06-03 | North American Specialties Corporation | Solder-bearing terminal |
US4685032A (en) * | 1985-07-01 | 1987-08-04 | Honeywell Information Systems Inc. | Integrated backplane |
US4862326A (en) * | 1985-07-01 | 1989-08-29 | Bull Hn Information Systems Inc. | Power supply contact |
KR950006432B1 (ko) * | 1986-02-21 | 1995-06-15 | 가부시기가이샤 히다찌세이사꾸쇼 | 혼성집적회로장치 및 제조방법과 그 제조에 사용하는 리드 프레임 |
US4855866A (en) * | 1987-06-06 | 1989-08-08 | Murata Manufacturing Co., Ltd. | Capacitor network |
US5138438A (en) * | 1987-06-24 | 1992-08-11 | Akita Electronics Co. Ltd. | Lead connections means for stacked tab packaged IC chips |
FR2625040B1 (fr) * | 1987-12-22 | 1991-01-04 | Cit Alcatel | Plot de report de connexion pour la fixation d'une broche a griffes sur la tranche d'un substrat de circuit hybride |
US5015803A (en) * | 1989-05-31 | 1991-05-14 | Olin Corporation | Thermal performance package for integrated circuit chip |
EP0408779B1 (de) * | 1989-07-18 | 1993-03-17 | International Business Machines Corporation | Halbleiter-Speichermodul höher Dichte |
JPH0381980A (ja) * | 1989-08-25 | 1991-04-08 | Amp Japan Ltd | 電気コネクタ |
JPH0582685A (ja) * | 1991-09-24 | 1993-04-02 | Mitsubishi Electric Corp | 混成集積部品の放熱部および端子部用構造体とその構造体を用いた混成集積部品の製造方法 |
US5177326A (en) * | 1991-10-21 | 1993-01-05 | Gec-Marconi Electronic Systems Corp. | Lead wire array for a leadless chip carrier |
JPH06209224A (ja) * | 1993-01-12 | 1994-07-26 | Murata Mfg Co Ltd | 端子付き電気機能部品 |
US5969259A (en) * | 1995-04-07 | 1999-10-19 | Sensym, Inc. | Side port package for micromachined fluid sensor |
DE19919395A1 (de) * | 1998-04-29 | 1999-11-04 | Capax B V | Schalter für elektrische Werkzeuge mit integrierten Schaltkontakten |
JP2003198161A (ja) * | 2001-12-26 | 2003-07-11 | Mitsubishi Electric Corp | クリップ型リード、及び、当該クリップ型リードにより半導体装置又は副基板を実装した主基板 |
JP6443104B2 (ja) * | 2015-02-13 | 2018-12-26 | 株式会社村田製作所 | コイル部品 |
DE102016106482A1 (de) * | 2016-04-08 | 2017-10-12 | Biotronik Se & Co. Kg | Verbindungselement für eine elektronische Bauelementanordnung und Verfahren zum Herstellen desselben, elektronische Bauelementanordnung und Verfahren zum Herstellen desselben |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1471695A (fr) * | 1965-03-19 | 1967-03-03 | Elco Corp | Connecteur pour les circuits à pellicule mince |
FR1467190A (fr) * | 1965-12-15 | 1967-01-27 | Radiotechnique Coprim Rtc | Dispositif et procédé permettant de relier des plaquettes porteuses de microcircuits à des dispositifs électriques extérieurs |
GB1178395A (en) * | 1966-05-16 | 1970-01-21 | Plessey Co Ltd | Improvements in or relating to Connecting Leads for Thin Film Circuit Devices. |
FR1492275A (fr) * | 1966-07-07 | 1967-08-18 | Radiotechnique Coprim Rtc | Procédé permettant de relier un microcircuit à des dispositifs électriques extérieurs |
-
1971
- 1971-02-05 US US113007A patent/US3689684A/en not_active Expired - Lifetime
-
1972
- 1972-01-24 CA CA133,085A patent/CA962744A/en not_active Expired
- 1972-02-04 DE DE19722205342 patent/DE2205342A1/de active Pending
- 1972-02-04 NL NL7201492A patent/NL7201492A/xx unknown
- 1972-02-04 FR FR7203865A patent/FR2124508B1/fr not_active Expired
- 1972-02-04 GB GB540872A patent/GB1331901A/en not_active Expired
- 1972-02-04 IT IT20227/72A patent/IT947305B/it active
Also Published As
Publication number | Publication date |
---|---|
FR2124508B1 (de) | 1976-07-09 |
GB1331901A (en) | 1973-09-26 |
DE2205342A1 (de) | 1972-08-17 |
NL7201492A (de) | 1972-08-08 |
IT947305B (it) | 1973-05-21 |
FR2124508A1 (de) | 1972-09-22 |
US3689684A (en) | 1972-09-05 |
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