CA3135816A1 - Procede d'activation d'une surface d'un substrat contenant des fibres non conductrices ou de carbone destine a la metallisation - Google Patents

Procede d'activation d'une surface d'un substrat contenant des fibres non conductrices ou de carbone destine a la metallisation Download PDF

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Publication number
CA3135816A1
CA3135816A1 CA3135816A CA3135816A CA3135816A1 CA 3135816 A1 CA3135816 A1 CA 3135816A1 CA 3135816 A CA3135816 A CA 3135816A CA 3135816 A CA3135816 A CA 3135816A CA 3135816 A1 CA3135816 A1 CA 3135816A1
Authority
CA
Canada
Prior art keywords
species
ions
transition metal
metal particles
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3135816A
Other languages
English (en)
Inventor
Josef Gaida
Lutz Stamp
Lena IVANOVA
Thomas Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CA3135816A1 publication Critical patent/CA3135816A1/fr
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886Multistep pretreatment
    • C23C18/1893Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)

Abstract

La présente invention concerne un procédé d'activation d'une surface d'un substrat contenant des fibres non conductrices ou de carbone destiné à la métallisation, le procédé comprenant les étapes consistant : (a) à fournir ledit substrat, (b) à fournir une composition d'activation aqueuse sans palladium comprenant (i) une première espèce d'ions métalliques de transition dissous et en outre leurs nanoparticules métalliques, (ii) au moins un agent complexant, (iii) au moins un agents réducteur présent à titre permanent ou temporaire, (iv) éventuellement au moins une seconde espèce d'ions métalliques dissous différente de la première espèce, du moins pour la première espèce, les ions métalliques de transition dissous et leurs particules métalliques étant présents en équilibre réversible, à condition que les particules métalliques soient formées à partir des ions métalliques de transition dissous par une réduction continue ou semi-continue par l'intermédiaire dudit agent réducteur, que les ions métalliques de transition dissous soient formés à partir des particules métalliques par oxydation continue ou semi-continue desdites particules, et que les ions métalliques de transition dissous et leurs particules métalliques, respectivement, soient impliquées à plusieurs reprises dans ladite réduction et ladite oxydation de sorte qu'aucun agglomérat de précipitation desdites particules métalliques n'est pas formé, (c) à mettre en contact le substrat avec ladite composition d'activation de sorte qu'un métal de transition ou un alliage de métal de transition est déposé sur la surface dudit substrat et qu'une surface activée en vue de la métallisation est obtenue.
CA3135816A 2019-04-04 2020-04-01 Procede d'activation d'une surface d'un substrat contenant des fibres non conductrices ou de carbone destine a la metallisation Pending CA3135816A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP19167282.3 2019-04-04
EP19167282 2019-04-04
PCT/EP2020/059313 WO2020201387A1 (fr) 2019-04-04 2020-04-01 Procédé d'activation d'une surface d'un substrat contenant des fibres non conductrices ou de carbone destiné à la métallisation

Publications (1)

Publication Number Publication Date
CA3135816A1 true CA3135816A1 (fr) 2020-10-08

Family

ID=66092168

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3135816A Pending CA3135816A1 (fr) 2019-04-04 2020-04-01 Procede d'activation d'une surface d'un substrat contenant des fibres non conductrices ou de carbone destine a la metallisation

Country Status (11)

Country Link
US (1) US20220154343A1 (fr)
EP (1) EP3947772A1 (fr)
JP (1) JP7455859B2 (fr)
KR (1) KR20210143882A (fr)
CN (1) CN113614283A (fr)
BR (1) BR112021016763A2 (fr)
CA (1) CA3135816A1 (fr)
MX (1) MX2021012121A (fr)
SG (1) SG11202109533QA (fr)
TW (1) TWI764121B (fr)
WO (1) WO2020201387A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230054852A (ko) 2020-08-27 2023-04-25 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 금속화를 위해 비전도성 또는 탄소 섬유 함유 기재의 표면을 활성화하는 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278712A (en) 1978-08-31 1981-07-14 Surface Technology, Inc. Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating
US4600699A (en) * 1983-02-14 1986-07-15 Enthone, Incorporated Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters
US4820547A (en) * 1987-04-24 1989-04-11 Surface Technology, Inc. Activators for colloidal catalysts in electroless plating processes
US5421989A (en) * 1993-08-31 1995-06-06 Atotech Deutschland Gmbh Process for the metallization of nonconductive substrates with elimination of electroless metallization
KR20060128739A (ko) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 비-전도성 기판의 직접적인 금속화 방법
US20080245184A1 (en) * 2006-06-15 2008-10-09 Woo Ram Lee Preparation method of metal nano particle using micro mixer
EP1876262A1 (fr) 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Compositions de dépôt autocatalytique sans danger pour lýenvironnement
FR2958944B1 (fr) * 2010-04-19 2014-11-28 Pegastech Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique
CN104040026B (zh) 2011-10-05 2019-01-01 埃托特克德国有限公司 不含甲醛的化学镀镀铜溶液
JP6145681B2 (ja) * 2014-02-07 2017-06-14 石原ケミカル株式会社 無電解銅メッキ用の水系銅コロイド触媒液並びに無電解銅メッキ方法
EP3181724A3 (fr) 2015-12-14 2017-08-16 Rohm and Haas Electronic Materials LLC Catalyseurs écologiques stables pour la métallisation autocatalytique de cartes de circuits imprimés et de trous traversants
US10151035B2 (en) * 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
CN107460459A (zh) * 2017-06-29 2017-12-12 深圳安德万斯新材料科技有限公司 一种纳米铜活化液及其制备方法

Also Published As

Publication number Publication date
TWI764121B (zh) 2022-05-11
KR20210143882A (ko) 2021-11-29
MX2021012121A (es) 2021-11-03
BR112021016763A2 (pt) 2021-10-13
JP7455859B2 (ja) 2024-03-26
EP3947772A1 (fr) 2022-02-09
TW202041712A (zh) 2020-11-16
CN113614283A (zh) 2021-11-05
JP2022527973A (ja) 2022-06-07
SG11202109533QA (en) 2021-10-28
WO2020201387A1 (fr) 2020-10-08
US20220154343A1 (en) 2022-05-19

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Effective date: 20240328