CA3111475A1 - Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities - Google Patents
Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities Download PDFInfo
- Publication number
- CA3111475A1 CA3111475A1 CA3111475A CA3111475A CA3111475A1 CA 3111475 A1 CA3111475 A1 CA 3111475A1 CA 3111475 A CA3111475 A CA 3111475A CA 3111475 A CA3111475 A CA 3111475A CA 3111475 A1 CA3111475 A1 CA 3111475A1
- Authority
- CA
- Canada
- Prior art keywords
- cavity
- getter material
- substrate
- electrode
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K13/00—Cones, diaphragms, or the like, for emitting or receiving sound in general
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/18—Methods or devices for transmitting, conducting or directing sound
- G10K11/26—Sound-focusing or directing, e.g. scanning
- G10K11/28—Sound-focusing or directing, e.g. scanning using reflection, e.g. parabolic reflectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Acoustics & Sound (AREA)
- Life Sciences & Earth Sciences (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Biophysics (AREA)
- Veterinary Medicine (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Biomedical Technology (AREA)
- Radiology & Medical Imaging (AREA)
- Pathology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Gynecology & Obstetrics (AREA)
- Multimedia (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Pressure Sensors (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862738502P | 2018-09-28 | 2018-09-28 | |
| US62/738,502 | 2018-09-28 | ||
| PCT/US2019/053352 WO2020069252A1 (en) | 2018-09-28 | 2019-09-27 | Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA3111475A1 true CA3111475A1 (en) | 2020-04-02 |
Family
ID=69946946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA3111475A Pending CA3111475A1 (en) | 2018-09-28 | 2019-09-27 | Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11655141B2 (https=) |
| EP (1) | EP3856679B1 (https=) |
| JP (1) | JP7385652B2 (https=) |
| KR (1) | KR20210070302A (https=) |
| CN (1) | CN112770999A (https=) |
| AU (1) | AU2019350989A1 (https=) |
| CA (1) | CA3111475A1 (https=) |
| TW (1) | TW202042750A (https=) |
| WO (1) | WO2020069252A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112075090B (zh) | 2018-05-03 | 2022-10-14 | 蝴蝶网络有限公司 | 用于cmos传感器上的超声换能器的压力端口 |
| CA3118563A1 (en) | 2018-11-13 | 2020-05-22 | Butterfly Network, Inc. | Getter technology for micromachined ultrasonic transducer cavities |
| WO2020102492A1 (en) | 2018-11-15 | 2020-05-22 | Butterfly Network, Inc. | Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices |
| TW202045099A (zh) | 2019-02-07 | 2020-12-16 | 美商蝴蝶網路公司 | 用於微加工超音波傳感器裝置的雙層金屬電極 |
| US11583894B2 (en) | 2019-02-25 | 2023-02-21 | Bfly Operations, Inc. | Adaptive cavity thickness control for micromachined ultrasonic transducer devices |
| US11484911B2 (en) | 2019-04-12 | 2022-11-01 | Bfly Operations, Inc. | Bottom electrode via structures for micromachined ultrasonic transducer devices |
| CN114555248A (zh) | 2019-04-12 | 2022-05-27 | 布弗莱运营公司 | 用于微加工超声换能器器件的分段式吸气剂开口 |
| US11501562B2 (en) | 2019-04-30 | 2022-11-15 | Bfly Operations, Inc. | Ultrasound face scanning and identification apparatuses and methods |
| US11684951B2 (en) | 2019-08-08 | 2023-06-27 | Bfly Operations, Inc. | Micromachined ultrasonic transducer devices having truncated circle shaped cavities |
| US11988640B2 (en) | 2020-03-11 | 2024-05-21 | Bfly Operations, Inc. | Bottom electrode material stack for micromachined ultrasonic transducer devices |
| US20210328564A1 (en) | 2020-04-16 | 2021-10-21 | Butterfly Network, Inc. | Methods and circuitry for built-in self-testing of circuitry and/or transducers in ultrasound devices |
| US20210403321A1 (en) * | 2020-06-30 | 2021-12-30 | Butterfly Network, Inc. | Formation of self-assembled monolayer for ultrasonic transducers |
| CN112461438A (zh) * | 2020-12-11 | 2021-03-09 | 中国科学院空天信息创新研究院 | 高灵敏度谐振式差压传感器及其制备方法 |
| TW202239483A (zh) | 2021-03-04 | 2022-10-16 | 美商蝴蝶營運公司 | 具有不均勻柱腳的電容式微加工超音波換能器 |
| TW202240165A (zh) | 2021-03-04 | 2022-10-16 | 美商蝴蝶營運公司 | 具有柱腳的微加工超音波換能器 |
| CN113731779B (zh) * | 2021-07-30 | 2022-06-10 | 中北大学 | 基于soi埋氧层牺牲释放技术的电容式微机械超声换能器及其制备方法 |
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| JPH08330607A (ja) * | 1995-05-29 | 1996-12-13 | Matsushita Electric Works Ltd | 小型半導体デバイス及び小型赤外線センサ |
| US6430109B1 (en) | 1999-09-30 | 2002-08-06 | The Board Of Trustees Of The Leland Stanford Junior University | Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections |
| US6694817B2 (en) | 2001-08-21 | 2004-02-24 | Georgia Tech Research Corporation | Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument |
| US6779387B2 (en) | 2001-08-21 | 2004-08-24 | Georgia Tech Research Corporation | Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument |
| US6958255B2 (en) | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
| US6836020B2 (en) | 2003-01-22 | 2004-12-28 | The Board Of Trustees Of The Leland Stanford Junior University | Electrical through wafer interconnects |
| JP2005235452A (ja) * | 2004-02-17 | 2005-09-02 | Toshiba Corp | 表示装置 |
| US7615834B2 (en) | 2006-02-28 | 2009-11-10 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane |
| JP2009088254A (ja) * | 2007-09-28 | 2009-04-23 | Toshiba Corp | 電子部品パッケージ及び電子部品パッケージの製造方法 |
| US7843022B2 (en) | 2007-10-18 | 2010-11-30 | The Board Of Trustees Of The Leland Stanford Junior University | High-temperature electrostatic transducers and fabrication method |
| US8483014B2 (en) | 2007-12-03 | 2013-07-09 | Kolo Technologies, Inc. | Micromachined ultrasonic transducers |
| NZ589503A (en) | 2008-05-07 | 2013-07-26 | Signostics Ltd | Docking system for medical diagnostic scanning using a handheld device |
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| JP2011029910A (ja) * | 2009-07-24 | 2011-02-10 | Seiko Instruments Inc | 圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計 |
| JP5534398B2 (ja) | 2009-08-25 | 2014-06-25 | エスアイアイ・クリスタルテクノロジー株式会社 | パッケージ及びパッケージの製造方法、圧電振動子、発振器、電子機器、並びに電波時計 |
| US8241931B1 (en) | 2009-10-19 | 2012-08-14 | Analog Devices, Inc. | Method of forming MEMS device with weakened substrate |
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| CN108529550B (zh) * | 2018-04-28 | 2019-12-20 | 北京航天控制仪器研究所 | 基于晶圆键合工艺的圆片级封装mems芯片结构及其加工方法 |
| CN112075090B (zh) | 2018-05-03 | 2022-10-14 | 蝴蝶网络有限公司 | 用于cmos传感器上的超声换能器的压力端口 |
| WO2019213449A2 (en) | 2018-05-03 | 2019-11-07 | Butterfly Network, Inc. | Ultrasound devices |
| TW201947717A (zh) | 2018-05-03 | 2019-12-16 | 美商蝴蝶網路公司 | 用於超音波晶片的垂直封裝及相關方法 |
| CA3105492A1 (en) | 2018-07-06 | 2020-01-09 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| CN114555248A (zh) | 2019-04-12 | 2022-05-27 | 布弗莱运营公司 | 用于微加工超声换能器器件的分段式吸气剂开口 |
| US11484911B2 (en) | 2019-04-12 | 2022-11-01 | Bfly Operations, Inc. | Bottom electrode via structures for micromachined ultrasonic transducer devices |
-
2019
- 2019-09-27 AU AU2019350989A patent/AU2019350989A1/en not_active Abandoned
- 2019-09-27 WO PCT/US2019/053352 patent/WO2020069252A1/en not_active Ceased
- 2019-09-27 EP EP19868109.0A patent/EP3856679B1/en active Active
- 2019-09-27 CA CA3111475A patent/CA3111475A1/en active Pending
- 2019-09-27 US US16/585,283 patent/US11655141B2/en active Active
- 2019-09-27 TW TW108135059A patent/TW202042750A/zh unknown
- 2019-09-27 CN CN201980062783.7A patent/CN112770999A/zh active Pending
- 2019-09-27 KR KR1020217011234A patent/KR20210070302A/ko not_active Ceased
- 2019-09-27 JP JP2021510705A patent/JP7385652B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022501877A (ja) | 2022-01-06 |
| WO2020069252A1 (en) | 2020-04-02 |
| JP7385652B2 (ja) | 2023-11-22 |
| EP3856679C0 (en) | 2024-05-01 |
| US11655141B2 (en) | 2023-05-23 |
| EP3856679A1 (en) | 2021-08-04 |
| EP3856679B1 (en) | 2024-05-01 |
| TW202042750A (zh) | 2020-12-01 |
| AU2019350989A1 (en) | 2021-03-25 |
| KR20210070302A (ko) | 2021-06-14 |
| US20200102214A1 (en) | 2020-04-02 |
| EP3856679A4 (en) | 2022-11-02 |
| CN112770999A (zh) | 2021-05-07 |
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