JP7385652B2 - 超音波トランスデューサ空洞におけるゲッタリング材料の製造技術及び構造 - Google Patents
超音波トランスデューサ空洞におけるゲッタリング材料の製造技術及び構造 Download PDFInfo
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- JP7385652B2 JP7385652B2 JP2021510705A JP2021510705A JP7385652B2 JP 7385652 B2 JP7385652 B2 JP 7385652B2 JP 2021510705 A JP2021510705 A JP 2021510705A JP 2021510705 A JP2021510705 A JP 2021510705A JP 7385652 B2 JP7385652 B2 JP 7385652B2
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- 239000000463 material Substances 0.000 title claims description 57
- 238000005247 gettering Methods 0.000 title description 8
- 238000004519 manufacturing process Methods 0.000 title description 6
- 238000000034 method Methods 0.000 claims description 31
- 239000012528 membrane Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 30
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 2
- 229910052720 vanadium Inorganic materials 0.000 claims 2
- 229910052726 zirconium Inorganic materials 0.000 claims 2
- 239000010410 layer Substances 0.000 description 76
- 238000002604 ultrasonography Methods 0.000 description 44
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 230000008569 process Effects 0.000 description 12
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
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- 238000005530 etching Methods 0.000 description 5
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- 238000001459 lithography Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000002094 self assembled monolayer Substances 0.000 description 3
- 239000013545 self-assembled monolayer Substances 0.000 description 3
- 210000001519 tissue Anatomy 0.000 description 3
- 238000012285 ultrasound imaging Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
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- 239000006227 byproduct Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
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- 239000007769 metal material Substances 0.000 description 2
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- 238000002161 passivation Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011797 cavity material Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
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- 229910002804 graphite Inorganic materials 0.000 description 1
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- 238000000227 grinding Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000007170 pathology Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
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- 238000003892 spreading Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- BNCXNUWGWUZTCN-UHFFFAOYSA-N trichloro(dodecyl)silane Chemical compound CCCCCCCCCCCC[Si](Cl)(Cl)Cl BNCXNUWGWUZTCN-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K13/00—Cones, diaphragms, or the like, for emitting or receiving sound in general
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/18—Methods or devices for transmitting, conducting or directing sound
- G10K11/26—Sound-focusing or directing, e.g. scanning
- G10K11/28—Sound-focusing or directing, e.g. scanning using reflection, e.g. parabolic reflectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Acoustics & Sound (AREA)
- Life Sciences & Earth Sciences (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Radiology & Medical Imaging (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Pathology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Biophysics (AREA)
- Multimedia (AREA)
- Gynecology & Obstetrics (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Pressure Sensors (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Description
[0001] 本願は、代理人案件番号B1348.70103US00を付され「FABRICATION TECHNIQUES AND STRUCTURES FOR GETTERING MATERIALS IN ULTRASONIC TRANSDUCER CAVITIES」と題されて2018年9月28日に提出された米国特許出願第62/738,502号の、米国特許法第119条(e)に規定された利益を請求する。同出願は参照によりその全体が本明細書に組み込まれる。
Claims (16)
- 超音波トランスデューサデバイスを形成する方法であって、
底部電極及びゲッタ材料の上に1つ以上の絶縁層を形成することと、
前記ゲッタ材料から前記1つ以上の絶縁層を除去することと、
メンブレンと基板の間に密閉された空洞を形成するように、前記メンブレンを前記基板に接合することと、を含み、
前記密閉された空洞内に位置するとともに前記密閉された空洞に露出する面は、前記ゲッタ材料を含む、方法。 - 前記密閉された空洞に露出する面は、前記基板の上面を備える、請求項1の方法。
- 前記ゲッタ材料は、前記底部電極と同じ材料を備える、請求項1の方法。
- 前記ゲッタ材料は、チタン、ジルコニウム、バナジウム、コバルト、ニッケル、及びこれらの合金のうち、1つ以上を備える、請求項1の方法。
- 前記ゲッタ材料は、前記底部電極から電気的に隔離されている、請求項1の方法。
- 前記ゲッタ材料は、前記空洞の外周部に配設される、請求項4の方法。
- 前記空洞は、円形形状であり、
前記ゲッタ材料は、前記空洞の外半径に配設される、請求項4の方法。 - 前記ゲッタ材料は、酸素、窒素、アルゴン、又は水蒸気のうち1つ以上を前記空洞から除去するように構成されている、請求項1の方法。
- 超音波トランスデューサデバイスであって、
密閉された空洞を介して基板に接合されたメンブレンであって、前記密閉された空洞内に位置するとともに前記密閉された空洞に露出する面がゲッタ材料を含む、メンブレンと、
底部電極の上に形成されるが前記ゲッタ材料の上には存在しない1つ以上の絶縁層と、
を備える、デバイス。 - 前記密閉された空洞に露出する面は、前記基板の上面を備える、請求項9のデバイス。
- 前記ゲッタ材料は、チタン、ジルコニウム、バナジウム、コバルト、ニッケル、及びこれらの合金のうち、1つ以上を備える、請求項9のデバイス。
- 前記ゲッタ材料は、前記空洞の前記底部電極から電気的に隔離されている、請求項9のデバイス。
- 前記ゲッタ材料は、前記空洞の外周部に配設される、請求項11のデバイス。
- 前記空洞は、円形形状であり、
前記ゲッタ材料は、前記空洞の外半径に配設される、請求項11のデバイス。 - 前記ゲッタ材料は、酸素、窒素、アルゴン、又は水蒸気のうち1つ以上を含む1つ以上のガスを除去するように選択される、請求項9のデバイス。
- 前記ゲッタ材料は、前記空洞の前記底部電極と同じ材料を備える、請求項9のデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862738502P | 2018-09-28 | 2018-09-28 | |
US62/738,502 | 2018-09-28 | ||
PCT/US2019/053352 WO2020069252A1 (en) | 2018-09-28 | 2019-09-27 | Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022501877A JP2022501877A (ja) | 2022-01-06 |
JPWO2020069252A5 JPWO2020069252A5 (ja) | 2022-10-04 |
JP7385652B2 true JP7385652B2 (ja) | 2023-11-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021510705A Active JP7385652B2 (ja) | 2018-09-28 | 2019-09-27 | 超音波トランスデューサ空洞におけるゲッタリング材料の製造技術及び構造 |
Country Status (9)
Country | Link |
---|---|
US (1) | US11655141B2 (ja) |
EP (1) | EP3856679B1 (ja) |
JP (1) | JP7385652B2 (ja) |
KR (1) | KR20210070302A (ja) |
CN (1) | CN112770999A (ja) |
AU (1) | AU2019350989A1 (ja) |
CA (1) | CA3111475A1 (ja) |
TW (1) | TW202042750A (ja) |
WO (1) | WO2020069252A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3880373A4 (en) * | 2018-11-13 | 2022-07-20 | Butterfly Network, Inc. | GETTER TECHNOLOGY FOR MICRO-MACHINED ULTRASONIC TRANSDUCER CAVIES |
CN113039433A (zh) | 2018-11-15 | 2021-06-25 | 蝴蝶网络有限公司 | 用于微加工超声换能器装置的抗粘滞的底部腔表面 |
WO2020163595A1 (en) | 2019-02-07 | 2020-08-13 | Butterfly Network, Inc | Bi-layer metal electrode for micromachined ultrasonic transducer devices |
TW202102312A (zh) | 2019-02-25 | 2021-01-16 | 美商蝴蝶網路公司 | 用於微加工超音波換能器裝置的適應性空腔厚度控制 |
WO2020210470A1 (en) | 2019-04-12 | 2020-10-15 | Butterfly Network, Inc. | Bottom electrode via structures for micromachined ultrasonic transducer devices |
EP3953064A4 (en) * | 2019-04-12 | 2022-12-21 | BFLY Operations, Inc. | SEGMENTED GETTER APERTURES FOR MICRO-MACHINED ULTRASOUND TRANSDUCER DEVICES |
US11501562B2 (en) | 2019-04-30 | 2022-11-15 | Bfly Operations, Inc. | Ultrasound face scanning and identification apparatuses and methods |
US11684951B2 (en) | 2019-08-08 | 2023-06-27 | Bfly Operations, Inc. | Micromachined ultrasonic transducer devices having truncated circle shaped cavities |
US11988640B2 (en) | 2020-03-11 | 2024-05-21 | Bfly Operations, Inc. | Bottom electrode material stack for micromachined ultrasonic transducer devices |
US11815492B2 (en) | 2020-04-16 | 2023-11-14 | Bfly Operations, Inc. | Methods and circuitry for built-in self-testing of circuitry and/or transducers in ultrasound devices |
US20210403321A1 (en) * | 2020-06-30 | 2021-12-30 | Butterfly Network, Inc. | Formation of self-assembled monolayer for ultrasonic transducers |
CN112461438A (zh) * | 2020-12-11 | 2021-03-09 | 中国科学院空天信息创新研究院 | 高灵敏度谐振式差压传感器及其制备方法 |
CN113731779B (zh) * | 2021-07-30 | 2022-06-10 | 中北大学 | 基于soi埋氧层牺牲释放技术的电容式微机械超声换能器及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011029910A (ja) | 2009-07-24 | 2011-02-10 | Seiko Instruments Inc | 圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計 |
US20130135056A1 (en) | 2011-11-30 | 2013-05-30 | Stmicroelectronics S.R.L. | Oscillator device and manufacturing process of the same |
US20170232474A1 (en) | 2015-07-30 | 2017-08-17 | North Carolina State University | Anodically bonded vacuum-sealed capacitive micromachined ultrasonic transducer (cmut) |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6430109B1 (en) | 1999-09-30 | 2002-08-06 | The Board Of Trustees Of The Leland Stanford Junior University | Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections |
US6779387B2 (en) | 2001-08-21 | 2004-08-24 | Georgia Tech Research Corporation | Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument |
US6694817B2 (en) | 2001-08-21 | 2004-02-24 | Georgia Tech Research Corporation | Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument |
US6958255B2 (en) | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
US6836020B2 (en) | 2003-01-22 | 2004-12-28 | The Board Of Trustees Of The Leland Stanford Junior University | Electrical through wafer interconnects |
JP2005235452A (ja) * | 2004-02-17 | 2005-09-02 | Toshiba Corp | 表示装置 |
US7615834B2 (en) | 2006-02-28 | 2009-11-10 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane |
JP2009088254A (ja) * | 2007-09-28 | 2009-04-23 | Toshiba Corp | 電子部品パッケージ及び電子部品パッケージの製造方法 |
US7843022B2 (en) | 2007-10-18 | 2010-11-30 | The Board Of Trustees Of The Leland Stanford Junior University | High-temperature electrostatic transducers and fabrication method |
US8483014B2 (en) | 2007-12-03 | 2013-07-09 | Kolo Technologies, Inc. | Micromachined ultrasonic transducers |
WO2009135255A1 (en) | 2008-05-07 | 2009-11-12 | Signostics Pty Ltd | Docking system for medical diagnostic scanning using a handheld device |
US8402831B2 (en) | 2009-03-05 | 2013-03-26 | The Board Of Trustees Of The Leland Standford Junior University | Monolithic integrated CMUTs fabricated by low-temperature wafer bonding |
JP5534398B2 (ja) | 2009-08-25 | 2014-06-25 | エスアイアイ・クリスタルテクノロジー株式会社 | パッケージ及びパッケージの製造方法、圧電振動子、発振器、電子機器、並びに電波時計 |
US8241931B1 (en) | 2009-10-19 | 2012-08-14 | Analog Devices, Inc. | Method of forming MEMS device with weakened substrate |
JP5404335B2 (ja) | 2009-11-17 | 2014-01-29 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
WO2013049794A1 (en) * | 2011-09-30 | 2013-04-04 | Clean Energy Labs, Llc | Electrically conductive membrane transducer and methods to make and use same |
US9533873B2 (en) | 2013-02-05 | 2017-01-03 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
EP2969914B1 (en) * | 2013-03-15 | 2020-01-01 | Butterfly Network Inc. | Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same |
US9233839B2 (en) * | 2013-08-01 | 2016-01-12 | Taiwan Semiconductor Manufacturing Company Limited | MEMS device and method of forming the same |
KR102155695B1 (ko) | 2014-02-12 | 2020-09-21 | 삼성전자주식회사 | 전기 음향 변환기 |
TWI708368B (zh) | 2014-04-18 | 2020-10-21 | 美商蝴蝶網路公司 | 在互補式金屬氧化物半導體晶圓中的超音波轉換器及相關設備和方法 |
US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
US9637371B2 (en) * | 2014-07-25 | 2017-05-02 | Semiconductor Manufacturing International (Shanghai) Corporation | Membrane transducer structures and methods of manufacturing same using thin-film encapsulation |
JP2016039512A (ja) | 2014-08-08 | 2016-03-22 | キヤノン株式会社 | 電極が貫通配線と繋がったデバイス、及びその製造方法 |
US20160009544A1 (en) | 2015-03-02 | 2016-01-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
US9630831B1 (en) * | 2015-10-15 | 2017-04-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor sensing structure |
US9938134B2 (en) | 2016-04-14 | 2018-04-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device |
EP3586093A4 (en) * | 2017-02-27 | 2021-01-06 | Butterfly Network, Inc. | CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT), EQUIPMENT AND ASSOCIATED PROCESSES |
US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
WO2018236956A1 (en) | 2017-06-21 | 2018-12-27 | Butterfly Network, Inc. | MICROFABRICATED ULTRASONIC TRANSDUCER HAVING INDIVIDUAL CELLS HAVING ELECTRICALLY ISOLATED ELECTRODE SECTIONS |
CA3064279A1 (en) | 2017-06-23 | 2018-12-27 | Butterfly Network, Inc. | Differential ultrasonic transducer element for ultrasound devices |
US20190142387A1 (en) | 2017-11-15 | 2019-05-16 | Butterfly Network, Inc. | Ultrasound apparatuses and methods for fabricating ultrasound devices |
EP3745961A4 (en) | 2018-01-30 | 2021-11-10 | Butterfly Network, Inc. | METHODS AND DEVICES FOR PACKAGING ULTRASONIC-ON-A-CHIP |
AU2019231793A1 (en) | 2018-03-09 | 2020-09-24 | Butterfly Network, Inc. | Ultrasound transducer devices and methods for fabricating ultrasound transducer devices |
CN108529550B (zh) * | 2018-04-28 | 2019-12-20 | 北京航天控制仪器研究所 | 基于晶圆键合工艺的圆片级封装mems芯片结构及其加工方法 |
TW201946700A (zh) | 2018-05-03 | 2019-12-16 | 美商蝴蝶網路公司 | 超音波裝置 |
TW201947717A (zh) | 2018-05-03 | 2019-12-16 | 美商蝴蝶網路公司 | 用於超音波晶片的垂直封裝及相關方法 |
JP2021522734A (ja) | 2018-05-03 | 2021-08-30 | バタフライ ネットワーク,インコーポレイテッド | Cmosセンサ上の超音波トランスデューサ用の圧力ポート |
AU2019297412A1 (en) | 2018-07-06 | 2021-01-28 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
WO2020210470A1 (en) | 2019-04-12 | 2020-10-15 | Butterfly Network, Inc. | Bottom electrode via structures for micromachined ultrasonic transducer devices |
EP3953064A4 (en) | 2019-04-12 | 2022-12-21 | BFLY Operations, Inc. | SEGMENTED GETTER APERTURES FOR MICRO-MACHINED ULTRASOUND TRANSDUCER DEVICES |
-
2019
- 2019-09-27 TW TW108135059A patent/TW202042750A/zh unknown
- 2019-09-27 CA CA3111475A patent/CA3111475A1/en active Pending
- 2019-09-27 EP EP19868109.0A patent/EP3856679B1/en active Active
- 2019-09-27 JP JP2021510705A patent/JP7385652B2/ja active Active
- 2019-09-27 US US16/585,283 patent/US11655141B2/en active Active
- 2019-09-27 WO PCT/US2019/053352 patent/WO2020069252A1/en unknown
- 2019-09-27 AU AU2019350989A patent/AU2019350989A1/en not_active Abandoned
- 2019-09-27 KR KR1020217011234A patent/KR20210070302A/ko not_active Application Discontinuation
- 2019-09-27 CN CN201980062783.7A patent/CN112770999A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011029910A (ja) | 2009-07-24 | 2011-02-10 | Seiko Instruments Inc | 圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計 |
US20130135056A1 (en) | 2011-11-30 | 2013-05-30 | Stmicroelectronics S.R.L. | Oscillator device and manufacturing process of the same |
US20170232474A1 (en) | 2015-07-30 | 2017-08-17 | North Carolina State University | Anodically bonded vacuum-sealed capacitive micromachined ultrasonic transducer (cmut) |
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AU2019350989A1 (en) | 2021-03-25 |
CA3111475A1 (en) | 2020-04-02 |
EP3856679A4 (en) | 2022-11-02 |
JP2022501877A (ja) | 2022-01-06 |
EP3856679C0 (en) | 2024-05-01 |
KR20210070302A (ko) | 2021-06-14 |
TW202042750A (zh) | 2020-12-01 |
EP3856679A1 (en) | 2021-08-04 |
US11655141B2 (en) | 2023-05-23 |
CN112770999A (zh) | 2021-05-07 |
US20200102214A1 (en) | 2020-04-02 |
WO2020069252A1 (en) | 2020-04-02 |
EP3856679B1 (en) | 2024-05-01 |
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