CA2848802A1 - Mecanisme et procede de serrage pour appliquer une force nominale a un appareil de conversion electrique - Google Patents
Mecanisme et procede de serrage pour appliquer une force nominale a un appareil de conversion electrique Download PDFInfo
- Publication number
- CA2848802A1 CA2848802A1 CA2848802A CA2848802A CA2848802A1 CA 2848802 A1 CA2848802 A1 CA 2848802A1 CA 2848802 A CA2848802 A CA 2848802A CA 2848802 A CA2848802 A CA 2848802A CA 2848802 A1 CA2848802 A1 CA 2848802A1
- Authority
- CA
- Canada
- Prior art keywords
- force
- assembly
- rated force
- fixed body
- rated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13023—IGCT - Integrated Gate Commutated Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2011/001634 WO2013044409A1 (fr) | 2011-09-28 | 2011-09-28 | Mécanisme et procédé de serrage pour appliquer une force nominale à un appareil de conversion électrique |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2848802A1 true CA2848802A1 (fr) | 2013-04-04 |
Family
ID=47994090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2848802A Abandoned CA2848802A1 (fr) | 2011-09-28 | 2011-09-28 | Mecanisme et procede de serrage pour appliquer une force nominale a un appareil de conversion electrique |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2761654A4 (fr) |
BR (1) | BR112014005674A2 (fr) |
CA (1) | CA2848802A1 (fr) |
WO (1) | WO2013044409A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103489856B (zh) * | 2013-09-18 | 2016-08-24 | 许继电气股份有限公司 | 用于柔性直流输电的晶闸管压接组件 |
CN103745975B (zh) * | 2013-10-18 | 2016-09-14 | 中国西电电气股份有限公司 | 一种模块化多电平换流器功率模块内的晶闸管压装结构 |
CN106463500B (zh) * | 2014-07-01 | 2020-05-15 | 西门子公司 | 具有压力件的紧固设备 |
US20170141070A1 (en) * | 2014-07-03 | 2017-05-18 | Siemens Aktiengesellschaft | Clamping Assembly Having A Spring System |
EP3018709B1 (fr) * | 2014-11-04 | 2018-07-18 | SEMIKRON Elektronik GmbH & Co. KG | Dispositif de convertisseur |
CN211828745U (zh) * | 2017-01-20 | 2020-10-30 | 西门子股份公司 | 夹紧组合体 |
JP2020150747A (ja) * | 2019-03-15 | 2020-09-17 | 東芝三菱電機産業システム株式会社 | 電力装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2550887B1 (fr) * | 1983-08-19 | 1986-11-07 | Jeumont Schneider | Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance |
JP3462709B2 (ja) * | 1997-05-06 | 2003-11-05 | 株式会社日立製作所 | 電力変換器用平形半導体スタック |
JP3808680B2 (ja) * | 2000-01-11 | 2006-08-16 | 東芝三菱電機産業システム株式会社 | 平型半導体素子用スタック |
US6677673B1 (en) * | 2000-10-27 | 2004-01-13 | Varian Medical Systems, Inc. | Clamping assembly for high-voltage solid state devices |
JP2003168778A (ja) * | 2001-12-03 | 2003-06-13 | Toshiba Corp | 平型半導体素子用スタック |
CN2779619Y (zh) * | 2005-03-10 | 2006-05-10 | 冶金自动化研究设计院 | 一种平板型电力电子半导体器件组件 |
-
2011
- 2011-09-28 EP EP11873228.8A patent/EP2761654A4/fr not_active Withdrawn
- 2011-09-28 WO PCT/CN2011/001634 patent/WO2013044409A1/fr active Application Filing
- 2011-09-28 CA CA2848802A patent/CA2848802A1/fr not_active Abandoned
- 2011-09-28 BR BR112014005674A patent/BR112014005674A2/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2761654A4 (fr) | 2015-05-20 |
EP2761654A1 (fr) | 2014-08-06 |
WO2013044409A1 (fr) | 2013-04-04 |
BR112014005674A2 (pt) | 2017-03-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Discontinued |
Effective date: 20170928 |