CA2462444A1 - Systeme de refroidissement a emplacement de ventilation independant - Google Patents

Systeme de refroidissement a emplacement de ventilation independant Download PDF

Info

Publication number
CA2462444A1
CA2462444A1 CA002462444A CA2462444A CA2462444A1 CA 2462444 A1 CA2462444 A1 CA 2462444A1 CA 002462444 A CA002462444 A CA 002462444A CA 2462444 A CA2462444 A CA 2462444A CA 2462444 A1 CA2462444 A1 CA 2462444A1
Authority
CA
Canada
Prior art keywords
heatsink
group
gas supply
cooling system
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002462444A
Other languages
English (en)
Inventor
John Bird
Ralph I. Larson
Lynn Dore-North
Paul Bussiere
Amy Allen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celestica International Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2462444A1 publication Critical patent/CA2462444A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dissipateur thermique placé à proximité d'un premier dispositif dans lequel une alimentation en gaz peut être installée pour permettre l'approvisionnement en gaz dans n'importe quelle direction par rapport au dissipateur thermique. L'alimentation en gaz peut se présenter sous la forme d'un ventilateur, d'une soufflerie ou d'une source de gaz comprimé. L'alimentation en gaz peut s'effectuer dans n'importe quelle direction ou dans plusieurs directions. Le dissipateur thermique est en communication thermique avec un premier dispositif générateur de chaleur, tel qu'un microprocesseur. Dans un mode de réalisation préféré, le dissipateur thermique comprend un dissipateur thermique à ailette radiale repliée conçue pour permettre l'écoulement axial.
CA002462444A 2001-10-04 2002-10-03 Systeme de refroidissement a emplacement de ventilation independant Abandoned CA2462444A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32719401P 2001-10-04 2001-10-04
US60/327,194 2001-10-04
PCT/US2002/031628 WO2003030608A1 (fr) 2001-10-04 2002-10-03 Systeme de refroidissement a emplacement de ventilation independant

Publications (1)

Publication Number Publication Date
CA2462444A1 true CA2462444A1 (fr) 2003-04-10

Family

ID=23275523

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002462444A Abandoned CA2462444A1 (fr) 2001-10-04 2002-10-03 Systeme de refroidissement a emplacement de ventilation independant

Country Status (3)

Country Link
US (1) US20030066626A1 (fr)
CA (1) CA2462444A1 (fr)
WO (1) WO2003030608A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198094B2 (en) * 2003-06-20 2007-04-03 Hewlett-Packard Development Company, L.P. Finned device for removing heat from an electronic component
US7055577B2 (en) * 2004-02-12 2006-06-06 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device for electronic device
US20150330718A1 (en) * 2013-08-28 2015-11-19 Hamilton Sundstrand Corporation Integrated blower diffuser-fin single phase heat exchanger
EP3756430B1 (fr) * 2018-05-31 2023-11-08 Hewlett-Packard Development Company, L.P. Modules thermiques pour dispositifs électroniques

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Also Published As

Publication number Publication date
WO2003030608A1 (fr) 2003-04-10
US20030066626A1 (en) 2003-04-10
WO2003030608A9 (fr) 2003-11-27

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