CA2402229A1 - Procede et appareil pour fournir du courant a des ensembles electroniques haute performance - Google Patents

Procede et appareil pour fournir du courant a des ensembles electroniques haute performance Download PDF

Info

Publication number
CA2402229A1
CA2402229A1 CA002402229A CA2402229A CA2402229A1 CA 2402229 A1 CA2402229 A1 CA 2402229A1 CA 002402229 A CA002402229 A CA 002402229A CA 2402229 A CA2402229 A CA 2402229A CA 2402229 A1 CA2402229 A1 CA 2402229A1
Authority
CA
Canada
Prior art keywords
circuit board
conductive
conductive member
power
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002402229A
Other languages
English (en)
Inventor
Joseph Ted Ii Dibene
David H. Hartke
Edward J. Derian
Carl E. Hoge
James M. Broder
Jose B. San Andreas
Joseph S. Riel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Incep Technologies Inc
Original Assignee
Incep Technologies, Inc.
Joseph Ted Ii Dibene
David H. Hartke
Edward J. Derian
Carl E. Hoge
James M. Broder
Jose B. San Andreas
Joseph S. Riel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Incep Technologies, Inc., Joseph Ted Ii Dibene, David H. Hartke, Edward J. Derian, Carl E. Hoge, James M. Broder, Jose B. San Andreas, Joseph S. Riel filed Critical Incep Technologies, Inc.
Publication of CA2402229A1 publication Critical patent/CA2402229A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures
    • G06F1/182Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/189Power distribution
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1517Multilayer substrate
    • H01L2924/15192Resurf arrangement of the internal vias
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10325Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10704Pin grid array [PGA]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Combinations Of Printed Boards (AREA)
CA002402229A 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance Abandoned CA2402229A1 (fr)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
US18777700P 2000-03-08 2000-03-08
US60/187,777 2000-03-08
US19605900P 2000-04-10 2000-04-10
US60/196,059 2000-04-10
US21981300P 2000-07-21 2000-07-21
US60/219,813 2000-07-21
US23297100P 2000-09-14 2000-09-14
US60/232,971 2000-09-14
US25118400P 2000-12-04 2000-12-04
US25122200P 2000-12-04 2000-12-04
US25122300P 2000-12-04 2000-12-04
US60/251,184 2000-12-04
US60/251,223 2000-12-04
US60/251,222 2000-12-04
PCT/US2001/007410 WO2001067512A2 (fr) 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance

Publications (1)

Publication Number Publication Date
CA2402229A1 true CA2402229A1 (fr) 2001-09-13

Family

ID=27569217

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002402229A Abandoned CA2402229A1 (fr) 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance

Country Status (4)

Country Link
EP (1) EP1261999A2 (fr)
AU (1) AU2001266554A1 (fr)
CA (1) CA2402229A1 (fr)
WO (1) WO2001067512A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030214800A1 (en) 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
DE10107839A1 (de) * 2001-02-16 2002-09-05 Philips Corp Intellectual Pty Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung
US6979784B1 (en) 2003-10-17 2005-12-27 Advanced Micro Devices, Inc. Component power interface board
DE102021209318A1 (de) 2021-08-25 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Antriebsanordnung eines Elektrofahrrads

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
JPH06314580A (ja) * 1992-08-05 1994-11-08 Amp Japan Ltd 二基板接続用同軸コネクタ
JPH08204304A (ja) * 1995-01-30 1996-08-09 Meidensha Corp プリント板群
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
FR2789811B1 (fr) * 1999-02-11 2001-05-18 Radiall Sa Raccord coaxial pour relier deux cartes de circuit imprime

Also Published As

Publication number Publication date
WO2001067512A2 (fr) 2001-09-13
WO2001067512A3 (fr) 2002-05-10
EP1261999A2 (fr) 2002-12-04
AU2001266554A1 (en) 2001-09-17

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Legal Events

Date Code Title Description
FZDE Discontinued