CA2402229A1 - Procede et appareil pour fournir du courant a des ensembles electroniques haute performance - Google Patents

Procede et appareil pour fournir du courant a des ensembles electroniques haute performance Download PDF

Info

Publication number
CA2402229A1
CA2402229A1 CA002402229A CA2402229A CA2402229A1 CA 2402229 A1 CA2402229 A1 CA 2402229A1 CA 002402229 A CA002402229 A CA 002402229A CA 2402229 A CA2402229 A CA 2402229A CA 2402229 A1 CA2402229 A1 CA 2402229A1
Authority
CA
Canada
Prior art keywords
circuit board
conductive
conductive member
power
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002402229A
Other languages
English (en)
Inventor
Joseph Ted Ii Dibene
David H. Hartke
Edward J. Derian
Carl E. Hoge
James M. Broder
Jose B. San Andreas
Joseph S. Riel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Incep Technologies Inc
Original Assignee
Incep Technologies, Inc.
Joseph Ted Ii Dibene
David H. Hartke
Edward J. Derian
Carl E. Hoge
James M. Broder
Jose B. San Andreas
Joseph S. Riel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Incep Technologies, Inc., Joseph Ted Ii Dibene, David H. Hartke, Edward J. Derian, Carl E. Hoge, James M. Broder, Jose B. San Andreas, Joseph S. Riel filed Critical Incep Technologies, Inc.
Publication of CA2402229A1 publication Critical patent/CA2402229A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/189—Power distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Combinations Of Printed Boards (AREA)
CA002402229A 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance Abandoned CA2402229A1 (fr)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
US18777700P 2000-03-08 2000-03-08
US60/187,777 2000-03-08
US19605900P 2000-04-10 2000-04-10
US60/196,059 2000-04-10
US21981300P 2000-07-21 2000-07-21
US60/219,813 2000-07-21
US23297100P 2000-09-14 2000-09-14
US60/232,971 2000-09-14
US60/251,184 2000-11-29
US25118400P 2000-12-04 2000-12-04
US25122200P 2000-12-04 2000-12-04
US25122300P 2000-12-04 2000-12-04
US60/251,222 2000-12-04
US60/251,223 2000-12-04
PCT/US2001/007410 WO2001067512A2 (fr) 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance

Publications (1)

Publication Number Publication Date
CA2402229A1 true CA2402229A1 (fr) 2001-09-13

Family

ID=27569217

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002402229A Abandoned CA2402229A1 (fr) 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance

Country Status (4)

Country Link
EP (1) EP1261999A2 (fr)
AU (1) AU2001266554A1 (fr)
CA (1) CA2402229A1 (fr)
WO (1) WO2001067512A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030214800A1 (en) 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
DE10107839A1 (de) 2001-02-16 2002-09-05 Philips Corp Intellectual Pty Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung
US6979784B1 (en) 2003-10-17 2005-12-27 Advanced Micro Devices, Inc. Component power interface board
DE102021209318A1 (de) 2021-08-25 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Antriebsanordnung eines Elektrofahrrads

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
JPH06314580A (ja) * 1992-08-05 1994-11-08 Amp Japan Ltd 二基板接続用同軸コネクタ
JPH08204304A (ja) * 1995-01-30 1996-08-09 Meidensha Corp プリント板群
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
FR2789811B1 (fr) * 1999-02-11 2001-05-18 Radiall Sa Raccord coaxial pour relier deux cartes de circuit imprime

Also Published As

Publication number Publication date
WO2001067512A3 (fr) 2002-05-10
EP1261999A2 (fr) 2002-12-04
WO2001067512A2 (fr) 2001-09-13
AU2001266554A1 (en) 2001-09-17

Similar Documents

Publication Publication Date Title
US6618268B2 (en) Apparatus for delivering power to high performance electronic assemblies
US6623279B2 (en) Separable power delivery connector
US7881072B2 (en) System and method for processor power delivery and thermal management
US6847529B2 (en) Ultra-low impedance power interconnection system for electronic packages
US6947293B2 (en) Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US7245507B2 (en) Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6556455B2 (en) Ultra-low impedance power interconnection system for electronic packages
EP1323340B1 (fr) Procede et systeme permettant de connecter un convertisseur de puissance a une prise femelle de boitier lga
US20030156400A1 (en) Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
US20030193791A1 (en) Power delivery and other systems for integrated circuits
CA2389712A1 (fr) Boitier encapsule inter-circuits pour distribution d'energie
KR100699094B1 (ko) 모듈러 회로판 어셈블리 및 이것을 조립하는 방법
US11387226B2 (en) Chip power supply system, chip, PCB, and computer device
KR20040020924A (ko) 횡방향 접속된 커패시터들을 갖는 전자 어셈블리 및 그제조 방법
US6741480B2 (en) Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
CA2402229A1 (fr) Procede et appareil pour fournir du courant a des ensembles electroniques haute performance
US20020151195A1 (en) Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate
US7235875B2 (en) Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module
US20040043644A1 (en) Coaxial and linear power delivery devices

Legal Events

Date Code Title Description
FZDE Discontinued