CA2402229A1 - Procede et appareil pour fournir du courant a des ensembles electroniques haute performance - Google Patents
Procede et appareil pour fournir du courant a des ensembles electroniques haute performance Download PDFInfo
- Publication number
- CA2402229A1 CA2402229A1 CA002402229A CA2402229A CA2402229A1 CA 2402229 A1 CA2402229 A1 CA 2402229A1 CA 002402229 A CA002402229 A CA 002402229A CA 2402229 A CA2402229 A CA 2402229A CA 2402229 A1 CA2402229 A1 CA 2402229A1
- Authority
- CA
- Canada
- Prior art keywords
- circuit board
- conductive
- conductive member
- power
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18777700P | 2000-03-08 | 2000-03-08 | |
US60/187,777 | 2000-03-08 | ||
US19605900P | 2000-04-10 | 2000-04-10 | |
US60/196,059 | 2000-04-10 | ||
US21981300P | 2000-07-21 | 2000-07-21 | |
US60/219,813 | 2000-07-21 | ||
US23297100P | 2000-09-14 | 2000-09-14 | |
US60/232,971 | 2000-09-14 | ||
US25118400P | 2000-12-04 | 2000-12-04 | |
US25122200P | 2000-12-04 | 2000-12-04 | |
US25122300P | 2000-12-04 | 2000-12-04 | |
US60/251,184 | 2000-12-04 | ||
US60/251,223 | 2000-12-04 | ||
US60/251,222 | 2000-12-04 | ||
PCT/US2001/007410 WO2001067512A2 (fr) | 2000-03-08 | 2001-03-08 | Procede et appareil pour fournir du courant a des ensembles electroniques haute performance |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2402229A1 true CA2402229A1 (fr) | 2001-09-13 |
Family
ID=27569217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002402229A Abandoned CA2402229A1 (fr) | 2000-03-08 | 2001-03-08 | Procede et appareil pour fournir du courant a des ensembles electroniques haute performance |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1261999A2 (fr) |
AU (1) | AU2001266554A1 (fr) |
CA (1) | CA2402229A1 (fr) |
WO (1) | WO2001067512A2 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030214800A1 (en) | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
DE10107839A1 (de) * | 2001-02-16 | 2002-09-05 | Philips Corp Intellectual Pty | Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung |
US6979784B1 (en) | 2003-10-17 | 2005-12-27 | Advanced Micro Devices, Inc. | Component power interface board |
DE102021209318A1 (de) | 2021-08-25 | 2023-03-02 | Robert Bosch Gesellschaft mit beschränkter Haftung | Antriebsanordnung eines Elektrofahrrads |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5065280A (en) * | 1990-08-30 | 1991-11-12 | Hewlett-Packard Company | Flex interconnect module |
JPH06314580A (ja) * | 1992-08-05 | 1994-11-08 | Amp Japan Ltd | 二基板接続用同軸コネクタ |
JPH08204304A (ja) * | 1995-01-30 | 1996-08-09 | Meidensha Corp | プリント板群 |
US5825633A (en) * | 1996-11-05 | 1998-10-20 | Motorola, Inc. | Multi-board electronic assembly including spacer for multiple electrical interconnections |
FR2789811B1 (fr) * | 1999-02-11 | 2001-05-18 | Radiall Sa | Raccord coaxial pour relier deux cartes de circuit imprime |
-
2001
- 2001-03-08 AU AU2001266554A patent/AU2001266554A1/en not_active Abandoned
- 2001-03-08 WO PCT/US2001/007410 patent/WO2001067512A2/fr active Application Filing
- 2001-03-08 EP EP01944111A patent/EP1261999A2/fr not_active Withdrawn
- 2001-03-08 CA CA002402229A patent/CA2402229A1/fr not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001067512A2 (fr) | 2001-09-13 |
WO2001067512A3 (fr) | 2002-05-10 |
EP1261999A2 (fr) | 2002-12-04 |
AU2001266554A1 (en) | 2001-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6618268B2 (en) | Apparatus for delivering power to high performance electronic assemblies | |
US6623279B2 (en) | Separable power delivery connector | |
US7881072B2 (en) | System and method for processor power delivery and thermal management | |
US6847529B2 (en) | Ultra-low impedance power interconnection system for electronic packages | |
US6947293B2 (en) | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management | |
US7245507B2 (en) | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management | |
US6556455B2 (en) | Ultra-low impedance power interconnection system for electronic packages | |
EP1323340B1 (fr) | Procede et systeme permettant de connecter un convertisseur de puissance a une prise femelle de boitier lga | |
US20030156400A1 (en) | Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management | |
US20030193791A1 (en) | Power delivery and other systems for integrated circuits | |
CA2389712A1 (fr) | Boitier encapsule inter-circuits pour distribution d'energie | |
KR100699094B1 (ko) | 모듈러 회로판 어셈블리 및 이것을 조립하는 방법 | |
US11387226B2 (en) | Chip power supply system, chip, PCB, and computer device | |
KR20040020924A (ko) | 횡방향 접속된 커패시터들을 갖는 전자 어셈블리 및 그제조 방법 | |
US6741480B2 (en) | Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems | |
CA2402229A1 (fr) | Procede et appareil pour fournir du courant a des ensembles electroniques haute performance | |
US20020151195A1 (en) | Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate | |
US7235875B2 (en) | Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module | |
US20040043644A1 (en) | Coaxial and linear power delivery devices |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Discontinued |