WO2001067512A2 - Procede et appareil pour fournir du courant a des ensembles electroniques haute performance - Google Patents

Procede et appareil pour fournir du courant a des ensembles electroniques haute performance Download PDF

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Publication number
WO2001067512A2
WO2001067512A2 PCT/US2001/007410 US0107410W WO0167512A2 WO 2001067512 A2 WO2001067512 A2 WO 2001067512A2 US 0107410 W US0107410 W US 0107410W WO 0167512 A2 WO0167512 A2 WO 0167512A2
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WO
WIPO (PCT)
Prior art keywords
circuit board
conductive
conductive member
power
disposed
Prior art date
Application number
PCT/US2001/007410
Other languages
English (en)
Other versions
WO2001067512A3 (fr
Inventor
Joseph Ted Ii Dibene
David Hartke
Edward J. Derian
Carl E. Hoge
James M. Broder
Jose B. San Andreas
Joseph S. Riel
Original Assignee
Incep Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Incep Technologies, Inc. filed Critical Incep Technologies, Inc.
Priority to AU2001266554A priority Critical patent/AU2001266554A1/en
Priority to EP01944111A priority patent/EP1261999A2/fr
Priority to CA002402229A priority patent/CA2402229A1/fr
Publication of WO2001067512A2 publication Critical patent/WO2001067512A2/fr
Publication of WO2001067512A3 publication Critical patent/WO2001067512A3/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/189—Power distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • This invention relates in general to a system for providing electrical continuity between a plurality of circuit boards, and in particular to a method and apparatus for improving the packaging and distribution of power to high performance electronic circuit assemblies.
  • ICs integrated circuits
  • PCBs printed circuit boards
  • ceramics having alternating conductive and non-conductive layers or planes sandwiched or bonded together to form a dense X-Y signal interconnect.
  • the operating voltage of ICs was approximately 5 volts and the power consumption was generally less than 1 watt. This relatively high supply voltage and low power level allowed the packaging of a large number of ICs on a single PCB with power distribution incorporated into one or more of the PCB planes.
  • the present invention achieves both of these goals, while also allowing for a compact, integrated stack-up system design that permits thermal dissipation and control of electromagnetic interference (EMI).
  • EMI electromagnetic interference
  • the present invention discloses a method, apparatus, article of manufacture, for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface.
  • the apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.
  • the apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface dismal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.
  • the second conductive member is hollow, and is disposed within the second conductive member in a coaxial arrangement.
  • a dielectric can be placed between the first conductive member and the second conductive member. The dielectric, or the dimensions of the first conductive member and the second conductive member can be defined so that the apparatus exhibits an impedance that can be used cooperatively with circuit elements on either the first circuit board or the second circuit board.
  • One of the advantages of the present invention is the integration of function in which the apparatus operates both as a rigid standoff to separate the first circuit board from the second circuit board, and a conduit for delivering power and a ground return (or other signals) between the circuit boards as well. While the apparatus will be discussed in terms of providing a power signal from a first circuit board to a second circuit board, it can also be used to provide power to a plurality of circuit boards in a stacked up configuration, all with minimal impedance.
  • FIG. 1 A is a two-dimensional section view illustrating an architecture in which the present invention may be usefully employed in delivering power to a microprocessor
  • FIG. IB is a section view of a microprocessor package used in FIG. 1 A which further illustrates the location of the power standoff assemblies associated with delivering power to the microprocessor shown if FIG. 1 A;
  • FIG. 2A is a two-dimensional section view of a conceptual coaxial interconnect illustrating the delivery of electrical energy from an upper planar circuit structure to a lower planar circuit structure;
  • FIG. 2B is two-dimensional plan view of the current flow to the coaxial interconnect structure in the upper planar circuit of FIG. 2 A;
  • FIG. 3 is a two-dimensional section view of a power standoff assembly structure in which the imier cylinder is swaged to the upper planar circuit and a screw forms both a mechanical and electrical connection to a lower planar circuit;
  • FIG. 4 is a two-dimensional section view of a power standoff assembly structure in which the inner cylinder is swaged to the upper planar circuit and a crushable spring washer forms an electrical connection from the inner cylinder to a lower planar circuit while a screw forms the mechanical connection;
  • FIG. 5 is a two-dimensional section view of a power standoff assembly structure in which the inner cylinder is swaged to the upper planar circuit and a screw forms the mechanical connection of the inner cylinder to the lower circuit structure while a spring feature is incorporated into the outer cylinder in order to accommodate electrical connection of the outer cylinder to the lower planar circuit;
  • FIG. 4 is a two-dimensional section view of a power standoff assembly structure in which the inner cylinder is swaged to the upper planar circuit and a screw forms the mechanical connection of the inner cylinder to the lower circuit structure while a spring feature is incorporated into the outer cylinder in order to accommodate electrical connection of the outer cylinder to the lower planar circuit;
  • FIG. 6 is a two-dimensional section view of a power standoff assembly structure in which the inner cylinder is swaged to the upper planar circuit and a screw forms the mechanical connection of the inner cylinder to the lower circuit structure while a spring insert is incorporated into the outer cylinder in order to accommodate electrical connection of the outer cylinder to the lower planar circuit;
  • FIG. 7A is a two-dimensional section view of a power standoff assembly structure in which the inner and outer cylinders are soldered to the upper planar circuit while the connection of these cylinders to the lower planar circuit is accommodated by the use of a coaxial spring contact assembly;
  • FIG. 7B is a two-dimensional plan section view of the power standoff assembly structure of FIG. 7A further illustrating the coaxial spring contact assembly;
  • FIG. 8 A is a two-dimensional section view of a power standoff assembly structure in which coaxial ring structures are joined to both the upper and lower planar circuit to form coaxial blades which engages into spring furrows which are an integral part of the inner and outer cylinders of the power standoff assembly;
  • FIG. 8B is a two-dimensional plan view of the coaxial ring structure of FIG. 8A;
  • FIG. 8C is a two-dimensional plan view looking into the spring furrows of the inner and outer cylinders of FIG. 8 A;
  • FIG. 9 A is a two-dimensional section view of a planar circuit structure illustrating how the layers in a multi-layered circuit structure can be arranged to efficiently couple dynamic electrical current impulses from the inner planes of the planar structure to the inner and outer cylinders of a coaxial power standoff assembly utilizing a screw connection as illustrated in FIG. 3;
  • FIG. 9B is a two-dimensional plan view of the top most layer of FIG. 9 A;
  • FIG. 9C is a two-dimensional plan view of the upper inner layer of FIG. 9A;
  • FIG. 9D is a two-dimensional plan view of the lower inner layer of FIG. 9 A.
  • FIG. 9E is a two-dimensional plan view of the lower most layer of FIG. 9 A;
  • FIG. 10 is a 2-dimensional plan view of a power standoff assembly structure which is surrounded with capacitors in order to improve the overall connection impedance;
  • FIG. 11A is a 2-dimensional side view of an EMI frame using power standoff assemblies integral with the frame assembly
  • FIG. 1 IB is a 2-dimensional plan section view of the EMI frame shown in FIG. 10 A;
  • FIG. 12 is a diagram illustrating how the power standoff assembly can be used as a circuit element between the circuit boards.
  • the present invention discloses an apparatus for providing power from a first circuit board to a second circuit board, i one embodiment, the apparatus (hereinafter alternatively referred to as a POWERDIRECT or a standoff) comprises an inner cylindrical cylinder, an intermediate coaxially located insulator or dielectric material and an outer coaxially located cylindrical cylinder.
  • the standoff is disposed between a first planar structure or printed circuit board and a second planar structure or printed circuit board to provide a path for the transfer of electrical power and a ground return between the two planar structures in an efficient manner. This creates a very low impedance interconnect between power and groundplanes on the first planar structure and power and ground planes on the second planar structure.
  • the present invention discloses a variety of methods in which the coaxial cylinders of the power standoff assembly may be joined to the upper and lower planar structures and their internal power planes. It also discloses efficient methods of connecting the internal power planes of the planar structures to external land features of the planar structures in such a manner as to further enhance the efficacy of the interconnect between power planes on the first planar structure and power planes on the second planar structure.
  • the present invention further describes a specific application where the power standoff assembly may be especially beneficial to delivering power to high performance microprocessor packages in such a manner as to negate the need to integrate power regulation circuitry directly onto the microprocessor package (On- Package- Voltage-Regulation, OPVR) so as to improve the producibility, yield and cost of modern high performance microprocessors.
  • OPVR On- Package- Voltage-Regulation
  • Encapsulated Circuit Assembly Typically, a modern high performance microprocessor die is flip-chip attached to an organic or ceramic substrate utilizing a Controlled-Collapse-Chip-Connection (C4).
  • the substrate has one or more power planes which are used to distribute power to the chip connections.
  • the power requirements of the microprocessor exceed 100 watts at operating voltages of approximately 1 volt and transient current requirements in excess of 100 amps per microsecond.
  • power conditioning may be provided by a voltage regulation module (VRM).
  • VRM voltage regulation module
  • the stringent power demands require that the VRM be very closely coupled to the microprocessor or directly mounted on to the microprocessor substrate.
  • OPVR architectures combine VRM technology with high performance silicon technology all on a common substrate.
  • FIG. 1 A is a diagram illustrating a stack up assembly 100 illustrating the use of a power standoff assembly 105 to deliver power to a microprocessor substrate 101 and its associated lid 108 from a remotely located VRM assembly 102.
  • the VRM assembly 102 surrounds the microprocessor lid 108, thus saving space in the z (vertical) axis.
  • the microprocessor lid 108 is thermally coupled to a heatsink structure 106 through a thermal coupling mesa 107 and appropriate thermal interface material (TIM) such as thermal grease (not shown) which can be integral to the base of 107 or a separate structure that is coupled (i.e. bonded, or metallically fused) to the base of the heatsink structure 106. Furthermore, heat generated from components in the VRM assembly 102 can be thermally attached directly to the base of heatsink assembly 106, thus sharing the heat dissipation benefits of the heatsink assembly 106. Signals from the microprocessor can be connected through pins (not shown) to socket 104 which is mounted to main board 103.
  • TIM thermal interface material
  • Power from the VRM assembly 102 is efficiently coupled to the microprocessor substrate 101 by utilizing one or more power standoff assemblies 105.
  • power standoff assemblies 105 are used, and each is located proximate a corner of the microprocessor substrate 101.
  • FIG. IB is a diagram showing the location of the four power standoff assemblies 105 proximate the corners of the microprocessor substrate 105.
  • the power standoff assemblies 105 maybe located in other locations on the substrate 101 such as at the center of each side. Further, the number of power standoff assemblies 105 used can be varied to meet the power needs of target microprocessor or other high performance Integrated Circuit assembly.
  • FIGs. 2A and 2B are diagrams illustrating transfer of energy from a source (such as a VRM assembly 102) on a first circuit board 201 to a second circuit board 202 through one or more power standoff assemblies 105.
  • a source such as a VRM assembly 102
  • the power signal 211 then passes through the first conductive member 105 A to similar connections on the second circuit board 202 and then onto a conductive plane 207 in or on the second circuit board 202, and thence to the load (e.g. the IC, microprocessor or other power dissipating device).
  • a ground return signal 212 passes from a ground plane 206 in or on the second circuit board 202 through a conductive surface 213 to a second conductive member 105B, through the second conductive member 105B, to a conductive plane 205 on or in the first circuit board 201. This acts as a ground return for the NRM power signal 211.
  • the space between the first conductive member 105 A and the second conductive member 105B may include a dielectric or electric insulator 105C, if desired.
  • the second conductive member 105B is hollow and the first conductive member 105 A is disposed within the second conductive member 105B such that they are substantially coaxial (e.g. the major axis of the first conductive member and the major axis of the second conductive member are co- linear).
  • the series inductance of the power standoff assembly 105 is governed primarily by the basic equation;
  • ⁇ o is the permeability of space
  • h is the length of the power standoff 105 body
  • Do is the inner diameter of the outer conductor
  • Z _- is the diameter of the inner conductor.
  • the power plane 204, 206 and the ground plane 205, 207 of the first circuit board 201 and the second circuit board 202 maybe on inner layers, instead of on an external surface of the circuit boards 201, 202.
  • through holes can be used on the first circuit board 201 and second circuit board 202.
  • These thru-hole patterns can also be coaxially arranged proximate to where first and second conductive members 105 A, 105B are connected to the first and the second circuit boards 201, 202.
  • plane inductance inductance from the plane pairs 204/205 and 206/207) can be reduced by the bringing the plane pairs 204/205 and 206/207 closer together.
  • I step is the step current the IC creates when switching transistors internally
  • RA C is the AC resistance of the interconnect
  • ⁇ TOT is the total inductance of the interconnect
  • dl/dt is the rate of change or AC current slew-rate which occurs due to the switching transistors.
  • the inductance is the dominant element in the path and thus contributes to the largest portion of the drop across the interconnect.
  • FIG. 3 is a diagram illustrating a preferred embodiment of a power feed standoff assembly 300.
  • the power feed standoff assembly 300 is used to route power and/or signals from a first circuit board 306 to a second circuit board 309.
  • the power feed standoff assembly 300 comprises a first conductive member 303 and a second conductive member 301.
  • the second conductive member 301 is hollow, and the first conductive member 303 is disposed within the second conductive member 301.
  • the first conductive member 303 and second conductive member 301 are coaxial (e.g. the longitudinal axes of symmetry of each are substantially colinear). Hence, the first conductive member 303 is disposed within and coaxially with the second conductive member 301.
  • the first conductive member 303 includes a first end 314.
  • the first end 314 includes a shoulder portion 316 having a first conductive member first surface 313 that is electrically coupleable to a first conductive surface 307 on the first circuit board 306, such as a pad.
  • the first conductive member 303 also includes a second end 315 distal from the first end 314 having a first conductive member second surface 317 electrically coupleable with a first conductive surface 310 or pad of the second circuit board 309. In the illustrated embodiment, the first conductive member second surface 317 does not directly contact the first surface 310A of the second circuit board 309.
  • first conductive member second surface 317 and the first surface 310 of the second circuit board 309 is accomplished by a screw 305 that is electrically coupled to both the first conductive member 303 and the first surface 310 of the second circuit board.
  • a screw 305 that is electrically coupled to both the first conductive member 303 and the first surface 310 of the second circuit board.
  • the second conductive member 301 includes a first end 318 having a second conductive member first surface 319.
  • the second conductive member first surface 319 is electrically coupled to a first circuit board 306 second conductive surface 308.
  • the second conductive member first surface 319 is directly coupled to the first circuit board 306 second conductive surface 308, but this need not be the case.
  • the second conductive member 301 includes a second end 320 having a second conductive member second surface 321.
  • the second conductive member second surface 321 is electrically coupled to the second circuit board second surface 311.
  • the second conductive member second surface 321 is directly coupled to the second circuit board second surface 311, but this need not be the case.
  • both the first conductive member 303 and the second conductive member 301 are cylindrical in shape (e.g. generally circular in cross section), but this need not be the case.
  • the first and second conductive members 303, 301 maybe of an ovoid, rectangular, or trapezoidal cross section.
  • the conductive members 301, 301 may simply be a pair of adjacent linear conductive members having an insulator or insulating space therebetween, hi each case, the longitudinal axes of symmetry for the first and second conductive members 301, 303 can be made substantially co-linear.
  • the first conductive member 303 is also disposed through a plated through hole (PTH) in the first circuit board 306.
  • the inner conductive member 303 can be affixed to the first circuit board 306 by a swage 312.
  • the swage 312 works cooperatively with the shelf portion 316 to affix the first conductive member 303 to the first circuit board 306.
  • the inner conductive member 303 can be further attached to the first circuit board 306 by soldering. However, soldering alone is not the preferred method of affixing the first conductive member 303 to the first circuit board 306.
  • the plated through hole 322 and the surrounding first circuit board first surface 307 together with the first conductive member 303 define an inner coaxial power circuit.
  • the inner coaxial power circuit is completed by a conductive fastening device 305 such as a screw, which makes electrical contact with the first conductive member 303 and the second circuit board first surface 310, thus forming an electrically conductive path from the first circuit board 306 to the second circuit board 309.
  • the inner conductive member 303 includes hollow portion having a threaded inner surface configured to accept and hold.
  • the height of the first conductive member 303 is typically slightly less than the height of the second conductive member 301 for the reasons described below.
  • the second conductive member 301 forms the outer coaxial circuit engaging the first circuit board second surface 308 (which may include a power pad pattern) and the second circuit board second surface 311. h one embodiment, dielectric 302 does not grip the first conductive member 303 and the second conductive member 310 so tightly that their relative position can not be adjusted slightly with a force imparted by fastener 305 such that the upper surface 313 of outer conductor 305 can come into intimate contact with the first circuit board second surface 308, thus completing the upper half of the outer coaxial power circuit. Because the inner conductor 303 is slightly shorter than outer conductor 301 both circuit feeds have identical and predictable joining forces between PCB 306 and PCB 309.
  • first conductive member 303 and the second conductive member 301 are coaxially arranged to reduce the unwanted electromagnetic fields that might be created from electric disturbances induced into the assembly 300.
  • the power feed standoff assembly 300 may be produced by separately fabricating items 301, 302 and 303 and pressing them together forming an inseparable assembly.
  • the power feed standoff assembly 300 may also be produced by separately fashioning the inner conductive member 303 and the outer conductive member 301, supporting the members 301, 303 in a fixture, and inserting a dielectric 302 into the gap separating 301 and 303 (e.g. under heat and pressure) and curing the dielectric material 302.
  • outer conductor 301, dielectric 302 and inner conductor 303 can be separate parts that are assembled in a different sequence than is described above without detracting from the benefits of this invention.
  • FIG. 4 is a two-dimensional sectional view of another embodiment of the power feed standoff assembly 300.
  • This embodiment is similar to that which is depicted in FIG. 3, however, a compressible conductive member such as a crushable washer 401 is disposed between the second circuit board 309 first surface 310 and the second conductive member second surface 317.
  • This provides a direct path by which current in the first conductive member 303 passes directly to the first conductive surface 310 on the second circuit board 309.
  • Crushable washer 401 significantly reduces the inductance of the electrical interconnect because current does not have to proceed through the screw body to the second circuit board 309 first conductive surface 310 but rather can proceed directly from the base of first conductive member 303 to the second circuit board 309 first conductive surface 310.
  • FIG. 5 is a two-dimensional section view of another embodiment of the power feed standoff assembly 300, illustrating still another structure for eliminating the passage of current through the screw 305. Unlike the embodiment FIG.
  • the outer conductive member 302 is fabricated with a compressibly compliant section 501 which acts as a spring
  • first conductive member conductor 303 is the "fixed" height member
  • second conductive member 301 is the slightly longer member with a compressibly compliant end section 501 that takes up variations in height between first conductive member 301 and the second conductive member 303, providing a direct path for both the inner and outer conductor members 303 and 301 to the second circuit board first conductive surface 310 and the second circuit board second conductive surface 311, respectively.
  • FIG. 6 is a diagram of another embodiment of the power feed standoff assembly 300.
  • the integral compressibly compliant end section formed by the body of the second conductive member 301 is replaced with a separate compressibly compliant member 601 which is inserted into an inner surface of the second conductive member 301.
  • FIG. 7A is a diagram illustrating another embodiment of the power feed standoff assembly 300.
  • a spring contact assembly 702 is used to electrically connect lower half (i.e. the second ends) of the first conductive member 303 and the second conductive member 303 to the second circuit board 309.
  • the spring contact assembly 702 includes a plurality of cantilever beam spring elements 703 and 704.
  • the upper portion (i.e. the first end) of the power feed standoff assembly 300 may be solder attached to the first circuit board 306 and the respective first circuit boad conductive surfaces 307 and 308. This is because this embodiment does not result in a continuous vertical force on the power feed standoff assembly 300 causing solder creepage.
  • a center locating feature 701 in or on the first circuit board 306 maybe employed to locate the power feed standoff assembly 300 to the first circuit board 306 prior to soldering.
  • the spring contact assembly 702 comprises a first contact 703 that is electrically coupled to the second circuit board second conductive surface 311.
  • the first contact 703 slidably and releaseably contacts the outer surface of the second conductive member 301.
  • the spring contact assembly 702 further comprises a second contact 704 that is electrically coupled to the second circuit board first conductive surface 310, and slidably and releasably contacts an inner surface of the first conductive member 303.
  • An insulating member 705 is disposed between a portion of the first contact 703 adjacent to second conductive member second surface 710.
  • the insulating member 705 which can be made from plastic, is used to hold together spring contacts 703 and 704 prior to permanent installation onto second circuit board conductive surfaces 310 and 311, and to insulate the spring contact 703 from the second conductive surface 311.
  • the spring contact assembly 702 is used to electrically contact the first and second conductive members 303, 301 of the power feed standoff assembly 300 in a low inductance manner to conductive surfaces 310 and 311 on the second circuit board 309.
  • a center locating feature 706 in or on the second circuit board 309 may be useful in locating the spring contact assembly 702 to the second circuit board 309 prior to soldering.
  • the contacts 703, 704 of the spring assembly can be ring-shaped when viewed from above, or may comprises a plurality of piecewise linear springs disposed radially to contact the first and second conductive members 303, 301. This embodiment is further illustrated in FIG. 7B, which presents a plan section view looking downward into the spring assembly 702.
  • FIG. 8 A is an illustration of a further embodiment of the present invention in which the ends of the power feed standoff assembly 300 include a receptive spring assembly 805.
  • the receptive spring feature 805 includes a blade portion 801 and a spring portion 804 for slidably engaging the blade portion 801, thus making electrical contact between the blade portion 801 and the spring portion 804.
  • the spring portion 804 includes opposing spring portions 804A, 804B, which grasp the mating blade portion 801 (which, when viewed from below, have the appearance of concentric blades) therebetween.
  • the male portion 801A of the blades 801 are mounted to the respective circuit boards by an attachment portion 801B which has a surface suitable for mounting on the conductive surfaces of the respective circuit boards (e.g. the first conductive member 303 electrically coupled to a first conductive surface 307 and the second conductive member 301 electrically coupled to the second conductive surface 308).
  • FIG. 8B is apian view of the power feed standoff assembly 300 illustrated in FIG. 8A looking into the concentric blade assemblies 801 and 802.
  • blade assemblies 801 and 802 can be joined together with an insulative plastic resin 803, thus forming the integraded blade assembly 806.
  • this assembly may have vertical protrusion features that are a part of 801, 802 or 803 which engage into mating holes in PCBs 306 and 309 to facilitate alignment and assembly.
  • the female portion 804 can be segmented in a plurality of segments arranged in concentric rings.
  • FIG. 8C is a plan view looking into the top or bottom of the first and second conductive members 803 and 801 illustrating how the female portion 804 can be segmented.
  • power feed standoff assembly 300 is simply plugged into assembly 806 without the need for a fastener. It will be recognized that power feed standoff assembly 300 need only have spring arrangement 804 and blade assembly 801, 802 on one side, and that the other side of the assembly 300 can be permanently secured to either PCB 306 or 309 using methods previously described in this invention disclosure.
  • the receptive spring assembly 804 is included on both the first conductive member 303 and the second conductive member 301, this assembly can be utilized on only one of the conductive members, or a single-sided spring (e.g.
  • the receptive spring assembly 805 can be an integral part of the first and or second conductive members 303, 301, or can be separately fashioned, and affixed to the ends of the first and second conductive members 303, 301.
  • FIG. 9A is a drawing presenting a section view of an exemplary circuit board
  • PCB 900 will have at least one pair of conductive planes dedicated to power distribution.
  • FIG. 9A illustrates a first conductive plane 902 and a second conductive plane 903.
  • Conductive plane 902 can be considered the voltage power plane and plane 903 can be considered the ground power plane, which together represent a power plane pair.
  • These planes are usually separated from each other by a thin dielectric or insulative layer 950 to keep the electrical impedance of the power plane pair low.
  • first plurality of plated through holes 906 to provide an electrical path from the power plane 902 to one or more conductive surfaces 910, 911 on the external surface of the circuit board 900
  • second plurality of plated through holes 905 to provide an electrical path from the ground plane 903 to one or more other conductive surfaces 912, 956 of the circuit board 900.
  • the PTHs 906 and 905 are arranged so as to coincide with the location of the first conductive member 303 and the second conductive member 301, respectively, when the power feed standoff assembly is disposed adjacent to the circuit board 900.
  • the PTHs 906 can be arranged in concentric circles (an inner concentric circle and an outer concentric circle) around the aperture as shown. h FIG. 9A concentric PTHs 906 connect to voltage power plane 902 and surface plane pads 910 and 911 shown in FIGs. 9B and 9E. Additionally, main screw hole 907 electrically connects to voltage power plane 902 and conductive surface plane pads 910 and 911.
  • the preceding creates one half of the low impedance connection from the power plane 902 to the surface pad 910.
  • the further connection to the power plane of the second circuit board can be accomplished as described in any of the foregoing embodiments.
  • the first conductive member 303, the fastener 305, and the washer 304 and hence, to a power plane in the second circuit board as shown in FIG. 3.
  • concentric ring of PTHs 905 connect to ground power plane 903 and to surface plane pads 912 and 956.
  • FIG. 9C and 9D illustrate the conductive patterns for power planes 902 and 903 respectively. It will be understood that although they are shown as terminating, exterior conductive feature 951 in FIG. 9C and feature 953 in FIG. 9D extend out and represents a continuum of each of the power planes in PCB 309. Note that the arrangement of external conductive surfaces 307, 308, 310, and
  • FIG. 311 depicted in FIG. 3 is essentially duplicated in the embodiment shown in FIG. 9A. That is, with respect to the second circuit board 309, surfaces 910 and 911 are analogous to surfaces 307, and surface 912 is analogous to surface 311. And, with respect to the first circuit board 306, surfaces 910 and 911 are analogous to surface 307 and surface 956 is analogous to surface 308.
  • FIG. 10 illustrates an arrangement where the power standoff assembly 300 is mounted on PCB 306 and is surrounded with surface mount bypass capacitors 1001.
  • a power plane structure consisting of a voltage and ground plane, for example, is connected to a power standoff assembly 300 the concentration of the electromagnetic fields as they approach the power standoff assembly 300 tend to create an increasing impedance at the power standoff assembly 300 connection due to the fact that the current paths are utilizing an ever decreasing portion of the planar structure in which the power is passing.
  • This effect can be reduced by adding bypass capacitors 1001 which are connected to power planes within PCB 306 in a concentric pattern as shown in FIG. 10 so as to reduce the impedance of the planes at a point very near to the power standoff assembly 300 connections to the plane.
  • This arrangement is superior to placing bypass capacitors 1001 at a remote point from the power standoff assembly 300 where the impedance of the planes at the power standoff assembly 300 connection are not corrected.
  • FIGS. 11A and 11B illustrate such an electromagnetic interference (EMI) frame 1101 incorporating power coupling devices therein.
  • the EMI frame 1101 is used to contain undesirable electromagnetic fields from radiating to an external environment.
  • the power standoff assembly 300 can either be a separate assembly that is pressed into the frame 1101 or the frame 1101 may become a part of the power standoff assembly's outer cylinder 301 with the inner conductor cylinder 303 and dielectric 302 similar to what has been described in the referenced related patent disclosures, hi one embodiment, the outer cylinder 301 protrudes slightly higher than the base of the frame 1101 so as to insure that electrical contact is made at the outer cylinder 301and not at some general feature of the frame, hi this way the integrity of the coaxial current paths are maintained. Note also that in the interest of clarity, FIG. 11 A does not show EMI gasketing materials between the frame and PCB 306 and PCB 309.
  • FIG. 12 illustrates how the power standoff assembly 300 may be used as a circuit element between PCB 306 and PCB 309.
  • the power standoff assembly 300 can be represented electrically as a series RLC circuit as shown.
  • One or more of the circuit elements may be used to enhance the electrical performance of the signals transferred between the two PCBs 306 and 309 by using the power standoff assembly 300 as a filter or as a storage element in the circuit path.
  • the power standoff assembly 300 may be an additional component that is added to either PCB 306 or PCB 309 or it may replace a component on either PCB or both. The benefits may be less complexity overall on either or both PCB's.
  • the capacitive portion of the power standoff assembly 300 may be enhanced by decreasing the dielectric 302 spacing between the inner and outer electrodes and or by choosing a material whose dielectric constant increases the overall capacitance.
  • the power standoff assembly may also act as an inductive or capacitive storage element.
  • the present invention describes a method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface.
  • the apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.
  • the apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

Abstract

L'invention concerne un procédé, un appareil et un produit manufacturé destinés à fournir du courant à partir d'une première carte de circuit imprimé, ayant une première surface conductrice et une deuxième surface conductrice, vers une deuxième carte de circuit imprimé, ayant une première surface conductrice et une deuxième surface conductrice. Ledit appareil comprend un premier membre conducteur, dont une première extrémité présente une surface électriquement connectable à la première surface conductrice de la première carte de circuit imprimé, et dont une deuxième extrémité, distale de la première extrémité, possède une deuxième surface électriquement connectable à la première surface de la deuxième carte de circuit imprimé. Cet appareil comporte aussi un deuxième membre conducteur, ayant une première surface électriquement connectable à la deuxième surface de la première carte de circuit imprimé et une deuxième surface, distale de la première de ce deuxième membre conducteur, cette deuxième surface étant électriquement connectable à la deuxième surface conductrice de la deuxième carte de circuit imprimé.
PCT/US2001/007410 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance WO2001067512A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001266554A AU2001266554A1 (en) 2000-03-08 2001-03-08 Method and apparatus for delivering power to high performance electronic assemblies
EP01944111A EP1261999A2 (fr) 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance
CA002402229A CA2402229A1 (fr) 2000-03-08 2001-03-08 Procede et appareil pour fournir du courant a des ensembles electroniques haute performance

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US18777700P 2000-03-08 2000-03-08
US60/187,777 2000-03-08
US19605900P 2000-04-10 2000-04-10
US60/196,059 2000-04-10
US21981300P 2000-07-21 2000-07-21
US60/219,813 2000-07-21
US23297100P 2000-09-14 2000-09-14
US60/232,971 2000-09-14
US25118400P 2000-12-04 2000-12-04
US25122300P 2000-12-04 2000-12-04
US25122200P 2000-12-04 2000-12-04
US60/251,222 2000-12-04
US60/251,184 2000-12-04
US60/251,223 2000-12-04

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AU (1) AU2001266554A1 (fr)
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WO2002067646A1 (fr) * 2001-02-16 2002-08-29 Koninklijke Philips Electronics N.V. Systeme avec circuit integre monte sur un moyen de support et systeme de modules d'alimentation en energie
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US7881072B2 (en) 1999-07-15 2011-02-01 Molex Incorporated System and method for processor power delivery and thermal management
DE102021209318A1 (de) 2021-08-25 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Antriebsanordnung eines Elektrofahrrads

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US6979784B1 (en) 2003-10-17 2005-12-27 Advanced Micro Devices, Inc. Component power interface board

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JPH08204304A (ja) * 1995-01-30 1996-08-09 Meidensha Corp プリント板群
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US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
EP0582145A1 (fr) * 1992-08-05 1994-02-09 The Whitaker Corporation Connecteur coaxial pour l'interconnexion de deux circuits imprimés
JPH08204304A (ja) * 1995-01-30 1996-08-09 Meidensha Corp プリント板群
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
US6231352B1 (en) * 1999-02-11 2001-05-15 Radiall Coaxial coupling for interconnecting two printed circuit cards

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Publication number Priority date Publication date Assignee Title
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US7881072B2 (en) 1999-07-15 2011-02-01 Molex Incorporated System and method for processor power delivery and thermal management
WO2002067646A1 (fr) * 2001-02-16 2002-08-29 Koninklijke Philips Electronics N.V. Systeme avec circuit integre monte sur un moyen de support et systeme de modules d'alimentation en energie
US7719850B2 (en) 2001-02-16 2010-05-18 Nxp B.V. Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement
DE102021209318A1 (de) 2021-08-25 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Antriebsanordnung eines Elektrofahrrads

Also Published As

Publication number Publication date
CA2402229A1 (fr) 2001-09-13
WO2001067512A3 (fr) 2002-05-10
AU2001266554A1 (en) 2001-09-17
EP1261999A2 (fr) 2002-12-04

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