AU2001266554A1 - Method and apparatus for delivering power to high performance electronic assemblies - Google Patents
Method and apparatus for delivering power to high performance electronic assembliesInfo
- Publication number
- AU2001266554A1 AU2001266554A1 AU2001266554A AU6655401A AU2001266554A1 AU 2001266554 A1 AU2001266554 A1 AU 2001266554A1 AU 2001266554 A AU2001266554 A AU 2001266554A AU 6655401 A AU6655401 A AU 6655401A AU 2001266554 A1 AU2001266554 A1 AU 2001266554A1
- Authority
- AU
- Australia
- Prior art keywords
- high performance
- delivering power
- electronic assemblies
- performance electronic
- assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18777700P | 2000-03-08 | 2000-03-08 | |
US60187777 | 2000-03-08 | ||
US19605900P | 2000-04-10 | 2000-04-10 | |
US60196059 | 2000-04-10 | ||
US21981300P | 2000-07-21 | 2000-07-21 | |
US60219813 | 2000-07-21 | ||
US23297100P | 2000-09-14 | 2000-09-14 | |
US60232971 | 2000-09-14 | ||
US25122200P | 2000-12-04 | 2000-12-04 | |
US25118400P | 2000-12-04 | 2000-12-04 | |
US25122300P | 2000-12-04 | 2000-12-04 | |
US60251223 | 2000-12-04 | ||
US60251222 | 2000-12-04 | ||
US60251184 | 2000-12-04 | ||
PCT/US2001/007410 WO2001067512A2 (en) | 2000-03-08 | 2001-03-08 | Method and apparatus for delivering power to high performance electronic assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001266554A1 true AU2001266554A1 (en) | 2001-09-17 |
Family
ID=27569217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001266554A Abandoned AU2001266554A1 (en) | 2000-03-08 | 2001-03-08 | Method and apparatus for delivering power to high performance electronic assemblies |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1261999A2 (en) |
AU (1) | AU2001266554A1 (en) |
CA (1) | CA2402229A1 (en) |
WO (1) | WO2001067512A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
US20030214800A1 (en) | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
DE10107839A1 (en) | 2001-02-16 | 2002-09-05 | Philips Corp Intellectual Pty | Arrangement with an integrated circuit mounted on a carrier and a power supply assembly |
US6979784B1 (en) | 2003-10-17 | 2005-12-27 | Advanced Micro Devices, Inc. | Component power interface board |
DE102021209318A1 (en) | 2021-08-25 | 2023-03-02 | Robert Bosch Gesellschaft mit beschränkter Haftung | Drive arrangement of an electric bicycle |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5065280A (en) * | 1990-08-30 | 1991-11-12 | Hewlett-Packard Company | Flex interconnect module |
JPH06314580A (en) * | 1992-08-05 | 1994-11-08 | Amp Japan Ltd | Coaxial connection for two boards connection |
JPH08204304A (en) * | 1995-01-30 | 1996-08-09 | Meidensha Corp | Printed board group |
US5825633A (en) * | 1996-11-05 | 1998-10-20 | Motorola, Inc. | Multi-board electronic assembly including spacer for multiple electrical interconnections |
FR2789811B1 (en) * | 1999-02-11 | 2001-05-18 | Radiall Sa | COAXIAL CONNECTION FOR CONNECTING TWO PRINTED CIRCUIT BOARDS |
-
2001
- 2001-03-08 CA CA002402229A patent/CA2402229A1/en not_active Abandoned
- 2001-03-08 AU AU2001266554A patent/AU2001266554A1/en not_active Abandoned
- 2001-03-08 WO PCT/US2001/007410 patent/WO2001067512A2/en active Application Filing
- 2001-03-08 EP EP01944111A patent/EP1261999A2/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1261999A2 (en) | 2002-12-04 |
CA2402229A1 (en) | 2001-09-13 |
WO2001067512A3 (en) | 2002-05-10 |
WO2001067512A2 (en) | 2001-09-13 |
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